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Replaced content with "# USC Nanofabrication Facility – Tool List __Last extracted from provided equipment tables__ ## Thermal Processing / Annealing - RTA (Rapid Thermal Annealer) - Cascade Tek vacuum oven - Blue M furnace big - Blue M furnace little - Narco vacuum oven ## Deposition – CVD - Oxford PECVD - Veeco ALD ## Deposition – PVD (Evaporation) - Angstrom Evaporator - CHA Evaporator - KJL Evaporator - Temescal Metal e-beam evaporator *(not in service)* ## Deposition – PV..."
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== Anneal & Furnace ==
# USC Nanofabrication Facility – Tool List
{| class="wikitable"
|+
!Tool
!Location
!Substrate size
!Gases
!Features
!Links
|-
|<div id="RTA">[[#RTA|RTA (Rapid Thermal Annealer)]]</div>
[[File:RTA (rapid thermal annealer).jpg|frameless|314x314px]]
|Deposition bay 1
|Small pieces, 2″, 3″, 4″, 5″, 6″ wafer capability
|2%H2 in N2, N2, O2, Ar
|
* Model: Allwin AW-610T
* Programmable, 10°C to 120°C per second.
* ERP Pyrometer 450-1250°C with ±1°C
* Thermocouple 100-800°C with ±0.5°C accuracy & rapid response
* Temperature repeatability: ±0.5°C or better at 1150°C wafer-to-wafer
* Temperature uniformity: ±5°C across a 6″ (150 mm) wafer at 1150°C.
|[[:File:RTA standard operation procedures.pdf|SOP]]
|-
|<div id="Cascade Tek vacuum oven">[[#Cascade Tek vacuum oven|Cascade Tek vacuum oven]]</div>
[[File:Cascade tek vacuum oven.jpg|frameless|200x200px]]
|Advanced Photo bay
|
|
|
* Model: Cascade TEK TVO-2
|[[:File:Cascade TEK TVO-2 SOP v1.pdf|SOP]]
|-
|<div id="Blue M furnace big">[[#Blue M furnace big|Blue M furnace big]]</div>
[[File:Blue M oven big.jpg|frameless|177x177px]]
|Advanced Photo bay
|
|
|
* Model: Blue M 0V-12A
* Temp range: up to 260C
|[[:File:Blue M OV-12A Drying Oven SOP v1.pdf|SOP]]
|-
||<div id="Blue M furnace little">[[#Blue M furnace little|Blue M furnace little]]</div>
[[File:Blue M oven little.jpg|frameless|185x185px]]
|Advanced Photo bay
|
|
|
* Model: Blue M 0V-8A
* Temp range: up to 260C
|[[:File:Blue M OV-8A Drying Oven SOP v1.pdf|SOP]]
|-
|<div id="Narco vacuum oven">[[#Narco vacuum oven|Narco vacuum oven]]</div>
[[File:Narco oven.jpg|frameless|174x174px]]
|Advanced Photo bay
|
|
|
* Model: Narco 5831 Vacuum Oven
|
|}


== Deposition ==
__Last extracted from provided equipment tables__
{| class="wikitable"
|+CVD (chemical vapor deposition)
!Tool
!Location
!Substrate size
!Deposition films
!Gases
!Features
!Links
|-
|<div id="Oxford PECVD">[[#Oxford PECVD|Oxford PECVD]]</div>
[[File:PECVD.jpg|frameless|200x200px]]
|Deposition bay 1
|up to 6" wafer
|SiO2, Si3N4, SiNO
|2% SiH4/N2, NH3, N2O, N2, He, CF4
|
* PlasmaPro System 100
* Electrode specs: 240mm diameter, up to 400°C
* Load lock
* No wafer clamping, fixed height
* RF power 300W
* LF power 500W
|[[:File:PECVD SOP v1.pdf|SOP]]
|-
|<div id="Veeco ALD">[[#Veeco ALD|Veeco ALD]]</div>
[[File:ALD.jpg|frameless|212x212px]]
|Deposition bay 1
|up to 4" diameter or small pieces
|MgO, Al2O3, Pt, Ru, HfO2, ZrO2, TiO2
|N2 as a carrier gas
O2 or O3 as film precursor
|
* Savannah S200
* Reactor temperature: 150°C for most recipes, up to 270°C
* Ozone generator can replace O2 with O3
|[[:File:ALD Quick Start Guide - August 2023.pdf|SOP]]
|}
{| class="wikitable"
|+PVD (physical vapor deposition)
!Tool
!Location
!Substrate size
(up to diameter)
!# of pockets
!E-beam voltage
!Deposition materials
!Gases
!Features
!Links
|-
|<div id="Angstrom Evaporator">[[#Angstrom Evaporator|Angstrom Evaporator]]</div>
[[File:Angstrom Evaporator.jpg|frameless|200x200px]]
|Deposition bay 1
|6"
|4
|10kV
|Ti, Al, Al2O3
|Ar, 5% O2 in Ar
|
* variable angle stage
* substrate rotation
* substrate heater
* ion mill for substrate cleaning
* load lock
|[[:File:Angstrom Evaporator SOP v1.pdf|SOP]]
|-
|<div id="CHA Evaporator">[[#CHA Evaporator|CHA Evaporator]]</div>
[[File:CHA Evaporator.jpg|frameless|195x195px]]
|Deposition bay 2
|6"
|6 @ 15cc
|10kV
|Ti, Au, Pt, Pd, Cr, Ni and Ag
|
|
* Sweep controller
* motor-driven deposition shield
* 8kW heater array
* Lift-off fixturing
* substrate rotation
* substrate dome for twenty-two 100mm back loaded wafers
* Inficon IC/6 for thickness control
|[[:File:CHA Evaporator SOP v2.pdf|SOP]]
|-
|<div id="KJL Evaporator">[[#KJL Evaporator|KJL Evaporator]]</div>
[[File:KJL Evaporator.jpg|frameless|200x200px]]
|Deposition bay 1
|6"
|4
|5kV
|Ti, Au, Pt, Pd, Cr, Ni, and Ag. Other materials available upon request.
|
|
* substrate rotation
* source to substrate distance is approx. 15″ (381mm)
|
* [[:File:KJL Metal SOP v1.pdf|SOP]]
* [https://drive.google.com/file/d/1YhiAI7t0Oj1NVDgHsnbHGBm0qvsl0yjb/view?usp=sharing Training video]
|-
|<div id="Temescal Metal e-beam evaporator">[[#Temescal Metal e-beam evaporator|Temescal Metal e-beam evaporator]]</div>
|Deposition bay 1
|
|
|
|
|
|Not in service.
|[[:File:DEP-015 Temescal Ebeam Metal Evaporator 04-28-09.pdf|SOP]]
|-
|
!
!Substrate size
!# of sources
!Sputter power
|
|
|
|
|-
|<div id="KJL Sputter">[[#KJL Sputter|KJL Sputter]]</div>
[[File:KJL Sputter.jpg|frameless|200x200px]]
|Deposition bay 1
|6"
|
* 4 DC
* 1 RF/DC
|
* DC sputter power 500 W
* RF sputter power 300 W
|Au, Pt, Ti, Al, W, Mo, Cu, SiO2, Al2O3, and ITO. Other materials available upon request.
|Ar, O2
|
* Target size: 2"
* Substrate rotation
|[[:File:KJL Sputter SOP v2.pdf|SOP]]
|}


== Dry Etching & Plasma Cleaning ==
## Thermal Processing / Annealing
See also [[Dry etching recipes|Dry etching recipes.]]
- RTA (Rapid Thermal Annealer)
{| class="wikitable"
- Cascade Tek vacuum oven
|+Etchers
- Blue M furnace big
!Tool
- Blue M furnace little
!Location
- Narco vacuum oven
!Substrate
size
!Allowed
materials
!Disallowed
materials
!Gases
!Table temperature
!Features
!Links
|-
|<div id="Oxford DRIE">[[#Oxford DRIE|Oxford DRIE]]</div>
[[File:DRIE.jpg|frameless|200x200px]]
|Etch bay 1
|4" wafer clamp, smaller pieces may go onto carrier wafers
2″, 3″, 4″, 6″, 8″ wafers possible
|Si, SiO2, SiN, Parylene, polyimide, LiNbO3, BCB
|No exposed metals (except Cr)
|Ar, O2, CF4, CHF3, SF6, C4F8
|20C
|
* Model: Oxford System 100 Deep reactive-ion etcher
* Etch deep Si with Bosch process
* ICP power (max) 3000W
* Table RF power (max) 300W
|
* [[:File:DRIE SOP - August 2023.pdf|SOP]]
* [[:File:DRIE Quick Start Guide - August 2023.pdf|Quickstart guide]]
* [https://drive.google.com/file/d/1m-eROS6U5DX9oX8whYGcevRShoGtdpAr/view?usp=drive_link Load lock operation video with chamber open]
* [https://docs.google.com/spreadsheets/d/e/2PACX-1vRAOAaR5tTHyx3b0pJpRsf3p0oh_AjsmcLllQjLOq_5Uod0HPC2WB94mBHw6brxLaQqFUvY6Iu3jJ20/pubhtml?gid=0&single=true Recipes]
|-
|<div id="Oxford DRIE-ALE">[[#Oxford DRIE-ALE|Oxford DRIE-ALE]]</div>
[[File:DRIE-ALE.jpg|frameless|200x200px]]
|Etch bay 1
|
|
|
|
|
|
* Oxford Deep reactive-ion etcher and atomic-layer etcher.
* This new tool is currently being commissioned
|
|-
|<div id="Oxford III-V">[[#Oxford III-V|Oxford III-V]]</div>
[[File:III-V.jpg|frameless|200x200px]]
|Etch bay 1
|4" wafer clamp, smaller pieces may go onto carrier wafers
2″, 3″, 4″, 6″, 8″ wafers possible
|InP, InAs, GaN, AlGaAs, GaAs, InGaAsP, ITO, Si, SiC, MoS2, WSe, Graphene
|No exposed metals (except Cr)
No deep etching polymers (>1 µm)
|Ar, O2, SF6, CH4, H2, Cl2, BCl3, SiCl4
| -120 to 200C
|
* Model: Oxford PlasmaPro 100 Cobra III-V etcher
* Etch III-V materials
* Cryo cooling
* Helium backside cooling
* ICP power (max) 1500W
* Table RF power (max) 1500W
* Optical endpoint detection: Horiba Jobin Yvon LEM G50
|
* [[:File:III V Etcher SOP - August 2023.pdf|SOP]]
* [[:File:III V Quick Start Guide - August 2023.pdf|Quickstart guide]]
|-
|<div id="Oxford RIE">[[#Oxford RIE|Oxford RIE]]</div>
[[File:RIE.jpg|frameless|200x200px]]
|Etch bay 1
|Up to 200 mm wafers
|Si, SiO2, Si3N4
|No exposed metals (except Cr)
No deep etching polymers (>1 µm)
|Ar, O2, CF4, CHF3, SF6
|20C
|
* Model: Oxford PlasmaPro 80 reactive ion etcher
* Etch dielectrics
* Table RF power (max) 300W
* Optical endpoint detection: Horiba Jobin Yvon LEM G50
|
* [[:File:RIE 80 SOP - August 2023.pdf|SOP]]
* [[:File:RIE 80 Quick Start Guide - August 2023.pdf|Quickstart guide]]
* [https://drive.google.com/file/d/15cHZNcl4yK-OBauSIQ__ZOWv5xrtNU40/view?usp=sharing Training video]
* [Https://docs.google.com/spreadsheets/d/1cleuEcpL6Nnjj40jUlnfaEt4aXEZ23ReL1UCT6eQsUY/edit?gid=864539770#gid=864539770 Standard Recipe Calibration]
|-
|<div id="XeF2 etcher">[[#XeF2 etcher|XeF2 etcher]]</div>
[[File:XeF2.jpg|frameless|200x200px]]
|Deposition bay 1
|Up to 6" wafers
|Si
|None
|Crystal XeF2 source
|20C
|
* Etch Si quickly and isotropically with high selectivity
* Custom built by the Armani group
|
* [[:File:XeF2 SOP - June 2023.pdf|SOP]]
* [[:File:XeF2 Quick Start Guide - May 2023.pdf|Quickstart guide]]
|}
{| class="wikitable"
|+Plasma cleaning / ashing
!Tool
!Location
!Substrate size
!Allowed materials
!Gases
!Features
!Links
|-
|<div id="Tegal O2 Plasma Asher">[[#Tegal O2 Plasma Asher|Tegal O2 Plasma Asher]]</div>
[[File:Tegal o2 plasma.jpg|frameless|163x163px]]
|Advanced Photo Bay
|200 mm pieces or wafers
|Photoresist, graphene, CNT
|O2
|
* Model: Tegal CU90??
|[[:File:Tegal Oxygen Plasma Asher.pdf|SOP]]
|-
|<div id="Tegal Plasma">[[#Tegal Plasma|Tegal Plasma]]</div>
[[File:Tegal plasma cleaner.jpg|frameless|178x178px]]
|Advanced Photo Bay
|
|
|
|
* Model: Tegal Plasma 915
* Tool is currently not in operation
|
|-
|<div id="YES O2 Plasma">[[#YES O2 Plasma|YES O2 Plasma]]</div>
[[File:Yes o2 plasma.jpg|frameless|238x238px]]
|Advanced Photo Bay
|200mm pieces or wafers
|
|O2
|
* Model: Yield Engineering System YES-CV200RFS
* 1000W table RF power
* Heat up to 250C
|[[:File:YES Quick Start Guide - August 2023.pdf|Quickstart]]
|}


== Lithography ==
## Deposition – CVD
{| class="wikitable"
- Oxford PECVD
|+E-beam and laser
- Veeco ALD
!Tool
!Location
!Substrate size
!Exposure
resolution
!Features
!Links
|-
|<div id="Raith EBL">[[#Raith EBL|Raith EBL]]</div>
[[File:Raith EBPG5150.jpg|frameless|200x200px]]
|Ebeam Bay
|4" wafer, or small pieces up to 2"
|<8nm
|
* Model: EBPG5150
* Thermal Field Emission 50kV and 100kV
* Beam current 350nA
* Pattern Generator 125 MHZ Genlsys – Beamer
|[[:File:Raith EBPG 5150 SOP.pdf|SOP]]
|-
|<div id="Heidelberg DWL">[[#Heidelberg DWL|Heidelberg DWL]]</div>
[[File:Heidelberg DWL 66+.jpg|frameless|200x200px]]
|Metrology Bay
|
* Min substrate/mask size 5x5mm
* Max substrate/mask size 9"x9"
|300nm
|
* Model: Heidelberg DWL 66+ (Direct Write Laser)
* Front and backside alignment
* Exposure wavelength: Grayscale and advanced grayscale exposure 405nm laser (“h-line” photoresists)
* Write modes (trading off high speed and high resolution)
** High resolution (min feature size 0.3um)
** Mode IV: min size 2um
** Mode V: min size 4um
* Alignment modes: Manual, semi-automatic, and fully automatic alignment
|[[:File:Heidelberg DWL 66 plus SOP.pdf|SOP]]
|}
{| class="wikitable"
|+UV mask aligners
!Tool
!Location
!Substrate
size
!Mask
size
!Exposure
resolution
!Features
!Links
|-
|<div id="Aligner A (MJB3)">[[#Aligner A (MJB3)|Aligner A (MJB3)]]</div>
[[File:MJB3 A.jpg|frameless|200x200px]]
|Advanced Photo bay
|Pieces up to 3”
|3” and 4”
|0.8um
|
* Backside alignment
* Exposure modes Soft, Hard, and vacuum contacts
* Exposure wavelength UV 400, 350-450 nm
* Exposure source 350 W Hg Arc lamp
|[[:File:Mask Aligner MJB3 SOP.pdf|SOP]]
|-
|<div id="Aligner B (MJB3)">[[#Aligner B (MJB3)|Aligner B (MJB3)]]</div>
[[File:MJB3 B.jpg|frameless|200x200px]]
|Photo bay
|Pieces up to 3”
|3” and 4”
|0.8um
|
* Exposure modes Soft, Hard, and vacuum contacts
* Exposure wavelength UV 400, 350-450 nm
* Exposure source 350 W Hg Arc lamp
|[[:File:Mask Aligner MJB3 SOP.pdf|SOP]]
|-
|<div id="Aligner C (MJB4)">[[#Aligner C (MJB4)|Aligner C (MJB4)]]</div>
[[File:MJB4 C.jpg|frameless|150x150px]]
|Photo bay
|Pieces up to 2"
|3", 4", and 5"
|0.8um
|
* Exposure wavelength UV 400, 350 – 450nm
* Eyepieces 10x, objectives 5x, 10x, 20x
|[[:File:Mask Aligner MJB4 SOP.pdf|SOP]]
|-
|<div id="Aligner D (MA BA6 Gen4)">[[#Aligner D (MA BA6 Gen4)|Aligner D (MA BA6 Gen4)]]</div>
[[File:MABA6 D.jpg|frameless|200x200px]]
|Advanced Photo Bay
|
|
|0.8um
|
* Backside alignment
* Exposure wavelength UV400 350 – 450 nm
* Exposure source 450W LED
* Digital camera objectives 5x, 10x
|[[:File:Mask Aligner MABA6 SOP.pdf|SOP]]
|}


== Metrology ==
## Deposition – PVD (Evaporation)
{| class="wikitable"
- Angstrom Evaporator
|+Assorted metrology
- CHA Evaporator
!Tool
- KJL Evaporator
!Location
- Temescal Metal e-beam evaporator *(not in service)*
!Features
!Links
|-
|<div id="4-point Probe">[[#4-point Probe|4-point Probe]]</div>
[[File:4 point probe.jpg|frameless|200x200px]]
|Metrology bay
|
* Model: Signatone 4-point probe
* SP4 probe
* Readout with HP 34401A multimeter
|
* [[:File:Hp34401 multimeter for 4ptprobe manual.pdf|Multimeter SOP]]
|-
|<div id="Dektak profilometer">[[#Dektak profilometer|Dektak profilometer]]</div>
[[File:Dektak.jpg|frameless|200x200px]]
|Metrology bay
|
* Model: Bruker DektakXT profilometer
* Scan Length Range 55mm (2in)
* 150mm (6in) with scan stitching capability Data Points Per Scan 120,000 maximum
* Max. Sample Thickness 50mm (1.95in)
* Step Height Repeatability <5Å, 1sigma on 0.1μm step
* Vertical Range 1mm (0.039in.)
* Vertical Resolution 1Å max. (@ 6.55μm range)10 Å @ 65.5 μm; 80 Å @ 524μm;
* 150 Å @ 1mm 3D capability
|[[:File:Dektak XT SOP.pdf|SOP]]
|-
|<div id="Ellipsometer">[[#Ellipsometer|Ellipsometer]]</div>
[[File:Ellipsometer.jpg|frameless|200x200px]]
|Photo bay
|
* Thin film thickness measurement
* Laser wavelengths 4050, 6328, 8300 Angstroms
* Wafer mapping Yes
|[[SOP:Ellipsometer|SOP]]
|-
|<div id="Filmetrics F20">[[#Filmetrics F20|Filmetrics F20]]</div>
[[File:Filmetrics F20.jpg|frameless|233x233px]]
|Photo bay
|Thin film thickness measurement
|[[Filmetrics F20 Standard Operating Procedure|SOP]]
|}
{| class="wikitable"
|+Microscopes
!Tool
!Location
!Features
!Links
|-
|<div id="Desktop SEM">[[#Desktop SEM|Desktop SEM]]</div>
[[File:Phenom SEM.jpg|frameless|200x200px]]
|Metrology bay
|
* Model: Phenom ProX G6 Desktop Scanning Electron Microscope
* Acc Voltage 5 – 15kV
* Resolution <10nm (for BSED)  
* Magnification 80-150,000x
* Electron or optical imaging modes
* Sample Size – up to 32mm
|
* [[:File:SEM-033 Philips XL30.pdf|SOP]]
* [[:File:Phenom SEM operation procedures.pdf|Operation manual]]
|-
|<div id="Nikon LV 150 optical microscope">[[#Nikon LV 150 optical microscope|Nikon LV 150 optical microscope]]</div>
[[File:Nikon LV 150 microscope.jpg|frameless|200x200px]]
|Photo bay
|
* Brightfield & Darkfield Polarizer/Analyzer
* Halogen Lamp 5x, 10x, 20x, 50x, 100x
* Camera – 5.9 MP resolution
* USB output/WIFI for exporting images
|[[:File:Nikon Eclipse LV150N Microscope SOP v1.pdf|SOP]]
|-
|<div id="Max ERB optical microscope">[[#Max ERB optical microscope|Max ERB optical microscope]]</div>
[[File:Max ERB microscope.jpg|frameless|186x186px]]
|Photo bay
|
* Zeiss 47 30 12 9902 binocular microscope head
* MSA-001 linear encoder
|
|-
|<div id="Zeiss optical microscope">[[#Zeiss optical microscope|Zeiss optical microscope]]</div>
[[File:Zeiss microscope.jpg|frameless|200x200px]]
|Advanced photo bay
|
|
|-
|<div id="Nikon SMZ-10A optical microscope">[[#Nikon SMZ-10A optical microscope|Nikon SMZ-10A optical microscope]]</div>
[[File:Nikon smz-10a microscope.jpg|frameless|200x200px]]
|Advanced photo bay
|
* Dyna Lite 150 light source
* Olympus UC30 camera
|
|-
|<div id="Nikon optical microscope">[[#Nikon optical microscope|Nikon optical microscope]]</div>
[[File:Unknown Nikon optical microscope.jpg|frameless|200x200px]]
|Advanced photo bay
|
* Dyna Lite 150 light source
|
|}


== Packaging & Mechanical Tooling ==
## Deposition – PVD (Sputtering)
{| class="wikitable"
- KJL Sputter
|+Wafer and die processing
!Tool
!Location
!Substrate size
!Features
!Links
|-
|<div id="Ball & Wedge bonder">[[#Ball & Wedge bonder|Ball & Wedge bonder]]</div>
[[File:Fs bondtec wire bonder.jpg|frameless|200x200px]]
|Etch bay 2
|
|
* Model: F&S Bondtec 53BDA Deep-access & Ball-Wedge bonder
|
* [[:File:SOP-Wire-Bonder.pdf|SOP]]
* [[:File:Wire bonder 53XXBDA en-manual.pdf|Operation manual]]
|-
|<div id="Dicing Saw">[[#Dicing Saw|Dicing Saw]]</div>
[[File:Dicing saw.jpg|frameless|200x200px]]
|Common chase
|up to 8" or 250x250 mm
|
* Model: DISCO Corp. DAD3350 Dicing Saw
* 1.8 kW spindle
* X-axis Cutting range 260 mm
* Cutting speed mm/s 0.1 ～ 600
* Y-axis Cutting range 260 mm
* Index step: 0.0001 mm Z-axis
* Max. stroke: 32.2 mm
* Moving resolution: 0.00005 mm
* Repeatability accuracy: 0.001 mm
|
* [[:File:Disco Dicing Saw SOP v3.pdf|SOP]]
* [[:File:Dicing Saw Manual.pdf|Operation manual]]
* [https://drive.google.com/file/d/1yX8D712iCx9p6fb6fpUrM641zMq_xhoh/view?usp=sharing Training video part 1]
* [https://drive.google.com/file/d/1d6mJyI4XWhKVxlKeKhPMkS9pXmzbGAkv/view?usp=sharing Training video part 2]
* [https://drive.google.com/file/d/1SOrdsiE0oh6ZT0NZ7HBQ9P030tDoDxnm/view?usp=sharing Training video part 3]
|-
|<div id="Mini Polisher">[[#Mini Polisher|Mini Polisher]]</div>
[[File:Mini polisher with parts installed.jpg|frameless|200x200px]]
|Common chase
|up to 1" diameter
|
* EQ Unipol-300 Mini (3") Automatic Grinder/ Polisher
* 20nm, 50nm, 0.25um, 1um, 5um, 10um polishing slurries/pastes available
* Smooth polishing pads and sanding pads from 60-3000 grit available
|
* [[SOP:Mini Polisher|SOP]]
* [https://mtixtl.com/products/unipol-300 Manufacturer product page, including operation videos]
|-
|<div id="LatticeAx Cleaver">[[#LatticeAx Cleaver|LatticeAx Cleaver]]</div>
[[File:Latticeax cleaver.jpg|frameless|156x156px]]
|Photo bay
|
|
* LatticeAx 420 Cleaving System
* 2-axis linear stage
* Digital camera
|
* [[:File:LatticeAx 420 SOP v1.pdf|SOP]]
* [https://drive.google.com/file/d/1141aO-N5KNwdH-JWKg3Zsqe0k6bCeVLz/view?usp=drive_link Operation video]
* [[:File:LatticeAx 420 Manual.pdf|Operation manual]]
|-
|<div id="FlipScribe Cleaver">[[#FlipScribe Cleaver|FlipScribe Cleaver]]</div>
[[File:Flipscribe cleaver.jpg|frameless|208x208px]]
|Photo bay
|
|
* Model: LatticeGear FlipScribe
|
* [[:File:FlipScribe Manual.pdf|Operation manual]]
* [[:File:FlipScribe Quick Guide.pdf|Quickstart]]
|-
|<div id="Vacuum Bag Sealer">[[#Vacuum Bag Sealer|Vacuum Bag Sealer]]</div>
[[File:Gramatech vacuum bag sealer.jpg|frameless|209x209px]]
|Advanced photo bay
|
|
* Model: Gramatech GVS2600R Vacuum Sealer
* 36" max sealing width
* N2 purge bags before sealing
* Foot lever operation
* Automated purge/vacuum/heat-seal/cool sequence
|
|}


== PCB Processing ==
## Dry Etching
{| class="wikitable"
- Oxford DRIE
|+PCB processing
- Oxford DRIE-ALE
!Tool
- Oxford III-V
!Location
- Oxford RIE
!Features
- XeF₂ etcher
!Links
|-
|<div id="LPKF PCB mill">[[#LPKF PCB mill|LPKF PCB mill]]</div>
[[File:LPKF ProtoMat S103 PCB mill.jpg|frameless|200x200px]]
|Common chase
|
* Model: LPKF ProtoMat S103
* PCB milling, through hole drilling, contour routing, solder dispensing
* CircuitPro software available for design work
* Accepts design file Gerber export from various CAD softwares
* Mechanical resolution 0.5um
* Max PCB size: A4
|
* [[LPKF Standard Operating Procedure|SOP]]
* [[:File:2406-protomat-s43-serie-manual-.pdf|Operation manual]]
|-
|<div id="LPKF electroplater">[[#LPKF electroplater|LPKF electroplater]]</div>
[[File:LPKF Contac S4 electroplater.jpg|frameless|200x200px]]
|Common chase
|
* Model: LPKF Contac S4
* Multistep clean and plate process
* Through-hole copper electroplating
* Not yet in use. [[Contact Nanofab Staff|Contact Nanofab staff]] if interested and we can procure the chemical set.
|[[:File:3940-manual-contac-s4-v3-0-en.pdf|Operation manual]]
|}


== Wet Process ==
## Plasma Cleaning / Ashing
{| class="wikitable"
- Tegal O₂ Plasma Asher
|+Solvent fume hood (located in Metrology bay)
- Tegal Plasma *(not in operation)*
!
- YES O₂ Plasma
!Tool
 
!Description
## Lithography – Direct Write
!Links
- Raith EBL
|-
- Heidelberg DWL
| rowspan="4" |[[File:Fume hood solvent.jpg|frameless|500x500px]]
 
Model: Air Control, Inc CS-41-316LSS-8ft
## Lithography – Mask Aligners
|Heated ultrasonic bath
- Aligner A (MJB3)
|
- Aligner B (MJB3)
| rowspan="4" |[[:File:Solvent Fumehoods SOP v1.pdf|SOP]]
- Aligner C (MJB4)
|-
- Aligner D (MA BA6 Gen4)
|Torrey Pines hot plate
 
|Model: Torrey Pines HS70
## Metrology
|-
- 4-point Probe
|Solvent drains
- Dektak profilometer
|
- Ellipsometer
|-
- Filmetrics F20
|N2 sprayers
 
|
## Microscopy
|}
- Desktop SEM
{| class="wikitable"
- Nikon LV 150 optical microscope
|+Acid fume hood left-side (located in Etch bay)
- Max ERB optical microscope
!
- Zeiss optical microscope
!Tool
- Nikon SMZ-10A optical microscope
!Description
- Nikon optical microscope
!Links
 
|-
## Packaging & Mechanical Processing
|This fume hood is the only fume hood where the Piranha and Nanostrip chemicals may be used.
- Ball & Wedge bonder
|
- Dicing Saw
|
- Mini Polisher
|
- LatticeAx Cleaver
|-
- FlipScribe Cleaver
| rowspan="4" |[[File:Fume hood acid left.jpg|frameless|500x500px]]
- Vacuum Bag Sealer
Model: Air Control, Inc. CS-41-C-PVC-7ft
 
|Heated bath
## PCB Processing
|Model: Imtec Accubath
- LPKF PCB mill
| rowspan="4" |[[:File:Etch Bay Fumehoods SOP v1.pdf|SOP]]
- LPKF electroplater *(not yet in use)*
|-
 
|Quick-dump-rinse tank (QDR)
## Wet Processing Fume Hoods
|
### Solvent Fume Hood
|-
- Solvent fume hood
|DI water tap
 
|
### Acid Fume Hoods (Etch Bay)
|-
- Acid fume hood left-side
|N2 gun
- Acid fume hood right-side
|
 
|}
### Resist & Developer Fume Hoods (Advanced Photo Bay)
{| class="wikitable"
- Resist fume hood
|+Acid fume hood right-side (located in Etch bay)
- Base and developer fume hood left-side
!
- Base and developer fume hood right-side
!Tool
 
!Description
### E-beam Resist Fume Hood (Photo Bay)
!Links
- E-beam resist fume hood
|-
|Piranha and Nanostrip chemicals are NOT allowed in this fume hood.
|
|
|
|-
| rowspan="6" |[[File:Fume hood acid right.jpg|frameless|500x500px]]
Model: Air Control, Inc. CS-41-C-PVC-7ft
|Heated bath
|Model: Imtec Accubath
| rowspan="6" |[[:File:Etch Bay Fumehoods SOP v1.pdf|SOP]]
|-
|Torrey Pines hot plate left
| rowspan="2" |Model: Torrey Pines HS70
|-
|Torrey Pines hot plate right
|-
|Quick-dump-rinse tank (QDR)
|
|-
|DI water tap
|
|-
|N2 sprayer
|
|}
{| class="wikitable"
|+Resist fume hood (located in Advanced Photo bay)
!
!Tool
!Description
!Links
|-
| rowspan="6" |[[File:Fume hood resist.jpg|frameless|400x400px]]
Model: Air Control, Inc. CS-41-316-LSS-8ft
|Spinner left
| rowspan="2" |Laurell resist spinner
| rowspan="2" |[[:File:Laurell Spinner SOP v1.pdf|SOP]]
|-
|Spinner right
|-
|Bake plate 1
| rowspan="4" |Apogee bake plate
| rowspan="4" |[[:File:Apogee Hotplate SOP v1.pdf|SOP]]
|-
|Bake plate 2
|-
|Bake plate 3
|-
|Bake plate 4
|}
{| class="wikitable"
|+Base and developer fume hood left-side (located in Advanced Photo bay)
!
!Tool
!Description
!Links
|-
| rowspan="5" |[[File:Fume hood development left.jpg|frameless|500x500px]]
Model: Air Control, Inc. CS-41-C-PVC-6ft
|Heated bath
|Model: Imtec Accubath
| rowspan="5" |[[:File:Advanced Photobay Fumehoods SOP v1.pdf|SOP]]
|-
|Torrey Pines hot plate
|Model: Torrey Pines HS70
|-
|Quick-dump-rinse tank (QDR)
|
|-
|DI water tap
|
|-
|N2 sprayer
|
|}
{| class="wikitable"
|+Base and developer fume hood right-side (located in Advanced Photo bay)
!
!Tool
!Description
!Links
|-
| rowspan="5" |[[File:Fume hood development right.jpg|frameless|500x500px]]
Model: Air Control, Inc. CS-41-C-PVC-6ft
|Heated bath
|Model: Imtec Accubath
| rowspan="5" |[[:File:Advanced Photobay Fumehoods SOP v1.pdf|SOP]]
|-
|Torrey Pines hot plate
|Model: Torrey Pines HS70
|-
|Quick-dump-rinse tank (QDR)
|
|-
|DI water tap
|
|-
|N2 sprayer
|
|}
{| class="wikitable"
|+E-beam resist fume hood (located in Photo bay)
!
!Tool
!Description
!Links
|-
| rowspan="6" |[[File:Fume hood ebeam resist.jpg|frameless|500x500px]]
Model: Precision Air Technology CS-41-316LSS-8ft
|Headway spinner left
| rowspan="2" |
* Model: Headway Research CB15
* Controller model: Headway Research PWM50
| rowspan="2" |[[:File:Headway Spinner SOP v1.pdf|SOP]]
|-
|Headway spinner right
|-
|Apogee hot plate left
|
| rowspan="2" |[[:File:Apogee Hotplate SOP v1.pdf|SOP]]
|-
|Apogee hot plate right
|
|-
|Ultrasonic heated bath
|
|
|-
|Torrey Pines hot plate/ stirrer
|Model: Torrey Pines HS70
|
|}

Revision as of 13:33, 2 February 2026

  1. USC Nanofabrication Facility – Tool List

__Last extracted from provided equipment tables__

    1. Thermal Processing / Annealing

- RTA (Rapid Thermal Annealer) - Cascade Tek vacuum oven - Blue M furnace big - Blue M furnace little - Narco vacuum oven

    1. Deposition – CVD

- Oxford PECVD - Veeco ALD

    1. Deposition – PVD (Evaporation)

- Angstrom Evaporator - CHA Evaporator - KJL Evaporator - Temescal Metal e-beam evaporator *(not in service)*

    1. Deposition – PVD (Sputtering)

- KJL Sputter

    1. Dry Etching

- Oxford DRIE - Oxford DRIE-ALE - Oxford III-V - Oxford RIE - XeF₂ etcher

    1. Plasma Cleaning / Ashing

- Tegal O₂ Plasma Asher - Tegal Plasma *(not in operation)* - YES O₂ Plasma

    1. Lithography – Direct Write

- Raith EBL - Heidelberg DWL

    1. Lithography – Mask Aligners

- Aligner A (MJB3) - Aligner B (MJB3) - Aligner C (MJB4) - Aligner D (MA BA6 Gen4)

    1. Metrology

- 4-point Probe - Dektak profilometer - Ellipsometer - Filmetrics F20

    1. Microscopy

- Desktop SEM - Nikon LV 150 optical microscope - Max ERB optical microscope - Zeiss optical microscope - Nikon SMZ-10A optical microscope - Nikon optical microscope

    1. Packaging & Mechanical Processing

- Ball & Wedge bonder - Dicing Saw - Mini Polisher - LatticeAx Cleaver - FlipScribe Cleaver - Vacuum Bag Sealer

    1. PCB Processing

- LPKF PCB mill - LPKF electroplater *(not yet in use)*

    1. Wet Processing Fume Hoods
      1. Solvent Fume Hood

- Solvent fume hood

      1. Acid Fume Hoods (Etch Bay)

- Acid fume hood left-side - Acid fume hood right-side

      1. Resist & Developer Fume Hoods (Advanced Photo Bay)

- Resist fume hood - Base and developer fume hood left-side - Base and developer fume hood right-side

      1. E-beam Resist Fume Hood (Photo Bay)

- E-beam resist fume hood

Retrieved from "https://wiki.nanofab.usc.edu/index.php?title=Tool_list&oldid=526"