Safety resources: Difference between revisions
→SDSs for chemicals you can expect to find in the Nanofab: trim names for pcb chemicals |
→Safety Data Sheets (SDSs): add some ALD chemicals |
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!Resists and polymers | !Resists and polymers | ||
!Gases | !Gases | ||
!Precursors for ALD | |||
!PCB chemicals | !PCB chemicals | ||
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|[[:File:ZED-N50-1yto6n0.pdf|ZED N50]] | |[[:File:ZED-N50-1yto6n0.pdf|ZED N50]] | ||
|[[:File:Chlorine Gas SDS.pdf|Chlorine]] | |[[:File:Chlorine Gas SDS.pdf|Chlorine]] | ||
|[[:File:Orthrus from AirLiquide SDS ALAM.pdf|Orthrus]] | |||
|[[:File:LPKF Dispense Solder Paste USA-en 1,0.pdf|LPKF Dispense Solder Paste]] | |[[:File:LPKF Dispense Solder Paste USA-en 1,0.pdf|LPKF Dispense Solder Paste]] | ||
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|[[:File:SU-82000-1jm0ei1.pdf|SU-82000]] | |[[:File:SU-82000-1jm0ei1.pdf|SU-82000]] | ||
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|[[:File:HfO2 precursor SDS.pdf|TDMAH]] | |||
|[[:File:SDS LPKF Developer USA-en 1,0.pdf|LPKF Developer]] | |[[:File:SDS LPKF Developer USA-en 1,0.pdf|LPKF Developer]] | ||
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|[[:File:Nano-Strip-MSDS-19b5vvy.pdf|Nano-Strip]] | |[[:File:Nano-Strip-MSDS-19b5vvy.pdf|Nano-Strip]] | ||
|[[:File:S1813-2hn58rw.pdf|S1813]] | |[[:File:S1813-2hn58rw.pdf|S1813]] | ||
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|[[:File:SDS LPKF ProLegend Component A USA-en 1,0.pdf|LPKF ProLegend Component A]] | |[[:File:SDS LPKF ProLegend Component A USA-en 1,0.pdf|LPKF ProLegend Component A]] | ||
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|[[:File:IRON-OXIDE-ETCHANT-1qxf0qq.pdf|Iron Oxide]] | |[[:File:IRON-OXIDE-ETCHANT-1qxf0qq.pdf|Iron Oxide]] | ||
|[[:File:S1805-1ysp40e.pdf|S1805]] | |[[:File:S1805-1ysp40e.pdf|S1805]] | ||
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|[[:File:SDS LPKF ProLegend Component B USA-en 2,0.pdf|LPKF ProLegend Component B]] | |[[:File:SDS LPKF ProLegend Component B USA-en 2,0.pdf|LPKF ProLegend Component B]] | ||
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|[[:File:Gold Etchant TFA MSDS-1vossr4.pdf|Gold]] | |[[:File:Gold Etchant TFA MSDS-1vossr4.pdf|Gold]] | ||
|[[:File:Polyimide-2dw4nvf.pdf|Polyimide]] | |[[:File:Polyimide-2dw4nvf.pdf|Polyimide]] | ||
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|[[:File:SDS LPKF ProMask Component A USA-en 1,0.pdf|LPKF ProMask Component A]] | |[[:File:SDS LPKF ProMask Component A USA-en 1,0.pdf|LPKF ProMask Component A]] | ||
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|[[:File:Titanium-etchant-qz5tpa.pdf|Titanium]] | |[[:File:Titanium-etchant-qz5tpa.pdf|Titanium]] | ||
|[[:File:PMMA-1l6wsvp.pdf|PMMA]] | |[[:File:PMMA-1l6wsvp.pdf|PMMA]] | ||
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|[[:File:SDS LPKF ProMask Component B USA-en 2,0.pdf|LPKF ProMask Component B]] | |[[:File:SDS LPKF ProMask Component B USA-en 2,0.pdf|LPKF ProMask Component B]] | ||
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|[[:File:CU-etch-2juc3ek.pdf|Copper]] | |[[:File:CU-etch-2juc3ek.pdf|Copper]] | ||
|[[:File:AZ-5214-1n4ax5v.pdf|AZ-5214]] | |[[:File:AZ-5214-1n4ax5v.pdf|AZ-5214]] | ||
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|[[:File:SDS A4 LPKF Activator 310.pdf 2025-11-17 14-09-15.pdf|LPKF Activator 310]] | |[[:File:SDS A4 LPKF Activator 310.pdf 2025-11-17 14-09-15.pdf|LPKF Activator 310]] | ||
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|[[:File:AZ-1500-Thinner-1l0gtmo.pdf|AZ 1500 thinner]] | |[[:File:AZ-1500-Thinner-1l0gtmo.pdf|AZ 1500 thinner]] | ||
|[[:File:CR-7-1k5lh9c.pdf|CR-7]] | |[[:File:CR-7-1k5lh9c.pdf|CR-7]] | ||
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|[[:File:AZ-421K-Developer-1886tw4.pdf|AZ 421K]] | |[[:File:AZ-421K-Developer-1886tw4.pdf|AZ 421K]] | ||
|[[:File:CHROMIUM-ETCH-2mw0yvf.pdf|Chromium]] | |[[:File:CHROMIUM-ETCH-2mw0yvf.pdf|Chromium]] | ||
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|[[:File:XPSU-825-developer-1r38h98.pdf|XPSU-825]] | |[[:File:XPSU-825-developer-1r38h98.pdf|XPSU-825]] | ||
|[[:File:BUFFERED-OXIDE-ETCH-20zagld.pdf|Buffered Oxide Etchant (BOE)]] | |[[:File:BUFFERED-OXIDE-ETCH-20zagld.pdf|Buffered Oxide Etchant (BOE)]] | ||
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|[[:File:SDS A4 LPKF Copper Plater 400.pdf 2025-11-17 14-12-20.pdf|LPKF Copper Plater 400]] | |[[:File:SDS A4 LPKF Copper Plater 400.pdf 2025-11-17 14-12-20.pdf|LPKF Copper Plater 400]] | ||
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Revision as of 09:54, 15 July 2026
The USC Nanofab thanks you for your commitment to safety. By your situational awareness and attention to policy, our facility stays a safe place to work.
Administrative processes
Safety trainings
If you are an active user, you will have already completed both the General Lab Safety course with USC EHS as well as the Nanofab's Cleanroom safety training, as detailed in the New user onboarding procedure. This permits you cleanroom access and the ability to request tool trainings, which will have safety aspects built into the training content (e.g., Fumehood training). The training request form is linked from the wiki homepage and the NEMO homepage.
To maintain cleanroom access, all users must complete annual cleanroom-specific safety refresher training. This is sent out as an email invitation to all users with multiple sessions available.
Chemical approval
To get approval to bring in new chemicals into the cleanroom, submit a Chemical Approval Form, including the SDS, so that our staff and USC EHS are aware of it. When a chemical is completely used, alert staff to update the chemical inventory.
Standard Operating Procedures (SOPs)
Facility SOPs
Nanofab tool SOPs
For tool-specific SOPs, visit the Tool list and refer to the last column.
Chemical SOPs
The Nanofab provides below SOPs specific to our lab for working with specific hazardous materials. USC EHS also provides templates for chemical SOPs with more general guidance.
- Acute Toxicants SOP
- Carcinogens SOP
- Chlorinated Solvents SOP
- Corrosives SOP
- Cryogens SOP
- Explosives SOP
- Hydrofluoric Acid SOP
- Oxidants SOP
- Piranha & Nanostrip SOP
- Potassium Hydroxide SOP
- Reproductive Toxicants SOP
Safety Data Sheets (SDSs)
It's critical to know the hazards associated with the chemicals you handle. This can inform how you work with it, or whether you choose to use it at all. Additionally, regulating bodies require that SDSs are made available in the workplace. If you are handed an unfamiliar chemical, ask for the SDS.
SDSs for chemicals you can expect to find in the Nanofab
USC EHS has also pooled a list of SDS sources from chemical distributors.
| Developers | Etchants | Resists and polymers | Gases | Precursors for ALD | PCB chemicals |
|---|---|---|---|---|---|
| SU-8 | Silver | ZED N50 | Chlorine | Orthrus | LPKF Dispense Solder Paste |
| MF-321 | Nickel | SU-82000 | TDMAH | LPKF Developer | |
| MF-319 | Nano-Strip | S1813 | LPKF ProLegend Component A | ||
| MF-312 | Iron Oxide | S1805 | LPKF ProLegend Component B | ||
| AZ 400K | Gold | Polyimide | LPKF ProMask Component A | ||
| AZ 300 MIF | Titanium | PMMA | LPKF ProMask Component B | ||
| AZ KWIK STRIP REMOVER | Copper | AZ-5214 | LPKF Activator 310 | ||
| AZ 1500 thinner | CR-7 | LPKF Cleaner 110 | |||
| AZ 421K | Chromium | LPKF Cleaner 210 | |||
| XPSU-825 | Buffered Oxide Etchant (BOE) | LPKF Copper Plater 400 | |||
| LPKF Shine 410 |