LPKF ProtoPlace E4 Standard Operating Procedure: Difference between revisions

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## Create vacuum in the needle by placing a finger onto the open hole on top of the placement head.
## Create vacuum in the needle by placing a finger onto the open hole on top of the placement head.
## Slowly raise the placement head upward.
## Slowly raise the placement head upward.
## Confirm that the component is attached to the needle and that the orientation has not changed.
## Confirm that the component is attached to the needle and that the orientation has not changed. If you are unable to consistently pick up and drop a component from the vacuum, assess if the vacuum pump is turned on and if the vacuum path is undisturbed.
 
# '''PCB and component setup'''
'''Note: If you are unable to consistently pick up and drop a component from the vacuum, stop!'''
#* Verify that there is solder paste on every pad where an electronic component will be fitted
 
#* Verify that the board does not move when secured by magnetic holders.
'''PCB and component setup'''  
#* Ensure that the pads with solder paste are visible on the monitor.
 
#* Organize parts to be placed by value/footprint/reference designator before proceeding with placement.
1) Verify that there is solder paste on every pad where an electronic component will be fitted
#* Use component trays for loose components.
 
#* Use the tape feeders for taped components.
2) Safeguard that the board does not move when secured by magnetic holders.
#* Minimize the amount of open component values to prevent ambiguity when more than one open value.
 
#* Confirm orientation of components.
3) Ensure that the pads with solder paste are visible on the monitor.
#* Limit use of tweezers since they can scrape PCB pads or disturb the solder paste.
 
# '''Component placement'''
4) Organise parts to be placed by value/footprint/reference designator before proceeding with placement.
#* Move the placement head above the component tray or tape feeder lane.
 
#* Lower the vacuum needle until it lightly contacts the component.
5) Use component trays for loose components.
#* Activate the vacuum by placing your finger over the vacuum vent hole on top of the tool head.
 
#* Slowly lift the component from the tray or feeder.
6) If tape feeders are available, use them for taped components.
#* Watch the monitor and confirm that the component is held straight on the needle.
 
#* Move the placement head above the correct PCB footprint.
7) Minimise the amount of open component values to prevent ambiguity when more than one open value.
#* Use the camera display to align the component with the solder-pasted pads.
 
#* Lower the component slowly until it touches the solder paste.
8) Confirm orientation of polarized components before picking them up.
#* Release the vacuum.
 
#* Lift the placement head straight upward.
9) Confirm pin 1 orientation prior to picking up ICs.
#* Confirm that the component stayed on the pads and did not shift.
 
#* If the component is misaligned, gently correct its position with tweezers before continuing.
10) Limit use of tweezers to occasions when necessary, there should be no scraping of either PCB pads or solder paste with tweezers.
#* Repeat the placement process for all required SMD components.
 
#* Adjust method if needed:
'''Component placement'''
#** Change needle/nozzle size if the component is too small, too large, or cannot be held reliably.
 
#** Do not force the placement head downward onto the PCB.
1) Move the placement head above the component tray or tape feeder lane.
#** Do not drag components across the solder paste with the needle.
 
#** Do not place components if the solder paste is dried out, contaminated, or smeared across adjacent pads.
2) Lower the vacuum needle until it lightly contacts the component.
 
3) Activate the vacuum.
 
4) Slowly lift the component from the tray or feeder.
 
5) Watch the monitor and confirm that the component is held straight on the needle.
 
6) Move the placement head above the correct PCB footprint.
 
7) Use the camera display to align the component with the solder-pasted pads.
 
8) Lower the component slowly until it touches the solder paste.
 
9) Release the vacuum.
 
10) Lift the placement head straight upward.
 
11) Confirm that the component stayed on the pads and did not shift.
 
12) If the component is misaligned, gently correct its position with tweezers before continuing.
 
13) Repeat the placement process for all required SMD components.
 
14) Change needle/nozzle size if the component is too small, too large, or cannot be held reliably.
 
15) Do not force the placement head downward onto the PCB.
 
16) Do not drag components across the solder paste with the needle.
 
17) Do not place components if the solder paste is dried out, contaminated, or smeared across adjacent pads.
 
'''Staff-approved dispensing test'''
 
This section of the ProtoPlace E4 is designated for only qualified operators to perform commissioning/testing. Regular users should not dispense solder paste on the ProtoPlace E4 without approval from the staff for this setup. To assist you in conducting a test dispense, please follow these guidelines:
 
1. Ensure the dispensing accessory is being used by either a qualified operator or under the supervision of a staff member.
 
2. Ensure that the dispensing needle is clean and properly seated.
 
3. Use solder paste or test material supplied and approved by staff.
 
4. Do not use solder paste that is dry, outdated, questionable or has been contaminated.
 
5. Perform the initial dispense test on a scrap printed circuit board or a test coupon, not on a device belonging to a user.
 
6. Ensure that the test coupon is flat on the work surface.
 
7. Position the dispensing needle above the test pad.
 
8. Dispense the smallest amount of material possible.
 
9. Inspect the size and shape of the dot created by the dispense of material.
 
10. If the dot produced is too big, variable, stringy, or blocked, cease operating and notify staff.
 
11. Following tests, remove the test coupon and clean the work surface area.
 
12. Dispose of any used solder paste, wipes or contaminated materials in accordance with Nanofab Staff Procedures.
 
'''Note: Do not leave solder paste inside a needle or dispensing accessory after use.'''


'''Shutdown and cleanup'''
'''Shutdown and cleanup'''


To ensure that the PCB work area is clean for the next user, follow these procedures:
# Turn off the vacuum pump
 
# Turn off the monitor/camera display.
1. Restore the placement head to its resting position in the safe position.
# Remove all materials (PCB, components, etc) from the work area.
 
# Close every component tray and tape the packages shut.
2. If the vacuum/air pump will not be needed until the next user has finished, please turn it off.
# Return needles, nozzles, feeders, and any other accessories back to the ProtoPlace parts drawer.
 
# Notify Nanofab staff of broken needles, clogged nozzles, missing accessories, or display/vacuum problems.
3. Ensure that, if appropriate, to turn off the monitor/camera display.
 
4. Take the PCB from the work area.
 
5. Close every component tray and tape the packages shut.
 
6. Return needles, nozzles, feeders, and any other accessories back to where they belong.
 
7. Clean up the work area of all loose or open components.
 
8. Use an appropriate cleanroom wipe to clean the work area if necessary.
 
9. Do not clean the equipment using compressed air.
 
10. Dispose of used wipes and contaminated materials and solder paste impacts based on the disposal directions provided by Nanofab staff.
 
11. Notify Nanofab staff of issues related to broken needles, clogged nozzles, missing accessories, display problems, vacuum problems, or power supply problems.


== <big>Troubleshooting</big> ==
== <big>Troubleshooting</big> ==

Revision as of 11:38, 27 August 2026

Overview

LPKF ProtoPlace E4 main components
The vacuum system allows the placement needle to pick up and release small SMD components.

The LPKF ProtoPlace E4 is a hand-operated device designed to position surface mount devices accurately onto already prepared printed circuit boards. It uses vacuum needles on the placement/marking head to assist in picking up, locating and dropping SMDs from either loose component trays or tape feeders onto contact pads on a PCB. Solder paste will need to have already been applied to the PCB via the LPKF S103 mill. It is possible to dispense solder paste with this tool, however because it is not currently equipped with a pneumatic doser, any solder syringe loaded into the side mount will need to be dosed manually.

The main parts of the LPKF ProtoPlace E4 are:

  • Monitor / camera display
  • Manual placement head, its vacuum nozzle, and various sized vacuum pickup needles
  • Hex keys for adjusting placement head components such as the mounted camera and the side solder syringe holder.
  • PCB work area
  • Tape feeder lanes and the loose component tray
  • Vacuum / air pump and tubing

Standard Operating Procedure for SMD placement

  1. Worktable Preparation
    1. Ensure that no unwanted debris is present on the PCB workspace.
    2. Place loose SMD components into the component tray and/or load component tape into the feeder lanes.
    3. Use a PCB that already has solder paste applied to the appropriate pads.
    4. Select 4 or more magnetic PCB holders, place them onto the work area, then place the PCB on top of the holders with no rotation relative to the work area.
    5. Ensure PCB does not move when lightly touched.
    6. Place any loose SMD components against an edge of the loose component tray such that the rotation of the component relative to the PCB is correct prior to pickup.
  2. System startup and vacuum check
    1. Behind the ProtoPlace tool, find the power switches for the camera+monitor, and for the vacuum pump, then switch them on.
    2. Ensure the camera displays a live image on the monitor.
    3. Select an appropriate vacuum packaging needle/nozzle based on the size of the component to be mounted.
    4. Move the placement head above the first component to be picked up.
    5. Lower the vacuum needle until it just touches the component.
    6. Create vacuum in the needle by placing a finger onto the open hole on top of the placement head.
    7. Slowly raise the placement head upward.
    8. Confirm that the component is attached to the needle and that the orientation has not changed. If you are unable to consistently pick up and drop a component from the vacuum, assess if the vacuum pump is turned on and if the vacuum path is undisturbed.
  3. PCB and component setup
    • Verify that there is solder paste on every pad where an electronic component will be fitted
    • Verify that the board does not move when secured by magnetic holders.
    • Ensure that the pads with solder paste are visible on the monitor.
    • Organize parts to be placed by value/footprint/reference designator before proceeding with placement.
    • Use component trays for loose components.
    • Use the tape feeders for taped components.
    • Minimize the amount of open component values to prevent ambiguity when more than one open value.
    • Confirm orientation of components.
    • Limit use of tweezers since they can scrape PCB pads or disturb the solder paste.
  4. Component placement
    • Move the placement head above the component tray or tape feeder lane.
    • Lower the vacuum needle until it lightly contacts the component.
    • Activate the vacuum by placing your finger over the vacuum vent hole on top of the tool head.
    • Slowly lift the component from the tray or feeder.
    • Watch the monitor and confirm that the component is held straight on the needle.
    • Move the placement head above the correct PCB footprint.
    • Use the camera display to align the component with the solder-pasted pads.
    • Lower the component slowly until it touches the solder paste.
    • Release the vacuum.
    • Lift the placement head straight upward.
    • Confirm that the component stayed on the pads and did not shift.
    • If the component is misaligned, gently correct its position with tweezers before continuing.
    • Repeat the placement process for all required SMD components.
    • Adjust method if needed:
      • Change needle/nozzle size if the component is too small, too large, or cannot be held reliably.
      • Do not force the placement head downward onto the PCB.
      • Do not drag components across the solder paste with the needle.
      • Do not place components if the solder paste is dried out, contaminated, or smeared across adjacent pads.

Shutdown and cleanup

  1. Turn off the vacuum pump
  2. Turn off the monitor/camera display.
  3. Remove all materials (PCB, components, etc) from the work area.
  4. Close every component tray and tape the packages shut.
  5. Return needles, nozzles, feeders, and any other accessories back to the ProtoPlace parts drawer.
  6. Notify Nanofab staff of broken needles, clogged nozzles, missing accessories, or display/vacuum problems.

Troubleshooting

Symptom Solution
Vacuum does not pick up the component Check that the pump is on, check the foot switch, check tubing, replace or clean the needle, and use a needle size appropriate for the component.
Component falls before reaching the PCB Re-test vacuum on a scrap component, check for leaks, use a larger or smaller needle, and confirm the component surface is flat.
Component sticks to the needle after release Release the vacuum again, lift straight upward, and clean or replace the needle if paste is present.
Component shifts after placement Secure the PCB with magnetic holders, lower the placement head more gently, and reposition the component with tweezers.
Camera display is blank or unclear Check monitor power, check video/camera connections, and notify staff if the image does not return.
Placement head does not move smoothly Stop using the tool, remove obvious loose debris if safe, and notify Nanofab staff.
Dispensing needle clogs during staff-approved test Stop the dispensing test, remove the clogged needle, and notify staff. Do not force paste through the needle.
Power does not turn on Confirm that the approved power adapter is connected. If the tool still does not power on, stop and contact Nanofab staff.
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