Tool list

Anneal & Furnace

Tool	Location	Substrate size	Gases	Features	Links
RTA (Rapid Thermal Annealer)	Deposition bay 1	Small pieces, 2″, 3″, 4″, 5″, 6″ wafer capability	2%H2 in N2, N2, O2, Ar	Model: Allwin AW-610T Programmable, 10°C to 120°C per second. ERP Pyrometer 450-1250°C with ±1°C Thermocouple 100-800°C with ±0.5°C accuracy & rapid response Temperature repeatability: ±0.5°C or better at 1150°C wafer-to-wafer Temperature uniformity: ±5°C across a 6″ (150 mm) wafer at 1150°C.	SOP
Cascade Tek vacuum oven	Advanced Photo bay			Model: Cascade TEK TVO-2	SOP
Blue M furnace big	Advanced Photo bay			Model: Blue M 0V-12A Temp range: up to 260C	SOP
Blue M furnace little	Advanced Photo bay			Model: Blue M 0V-8A Temp range: up to 260C	SOP
Narco vacuum oven	Advanced Photo bay			Model: Narco 5831 Vacuum Oven

Deposition

CVD (chemical vapor deposition)

Tool	Location	Substrate size	Deposition films	Gases and precursors	Features	Links
Oxford PECVD	Deposition bay 1	up to 6" wafer	SiO2, Si3N4, SiNO	2% SiH4/N2, NH3, N2O, N2, He, CF4	PlasmaPro System 100 Electrode specs: 240mm diameter, up to 400°C Load lock No wafer clamping, fixed height RF power 300W LF power 500W	SOP
Veeco ALD	Deposition bay 1	up to 4" diameter or small pieces	MgO, Al2O3, Pt, Ru, HfO2, ZrO2, TiO2	N2 as a carrier gas H2O as film precursor O2 or O3 as film precursor TMA as Al2O3 precursor TDMAZr as ZrO2 precursor MeCpPtMe3 as Pt precursor TDMAHf as HfO2 precursor EtCp2Mg as MgO precursor RuEtCp2 as Ru precursor TDMAT as TiO2 precursor	Savannah S200 Reactor temperature: 150°C for most recipes, up to 270°C Ozone generator can replace O2 with O3	SOP

PVD (physical vapor deposition)

Tool	Location	Substrate size	# of pockets	Power source	Deposition materials	Gases	Features	Links
Angstrom Evaporator	Deposition bay 1	up to 6"	4 pockets	E-beam voltage 10kV	Ti, Al, Al2O3	Ar, 5% O2 in Ar	variable angle stage substrate rotation substrate heater ion mill for substrate cleaning load lock	SOP
CHA Evaporator	Deposition bay 2	up to 6"	6 pockets @ 15cc	E-beam voltage 10kV	Ti, Au, Pt, Pd, Cr, Ni and Ag		Sweep controller motor-driven deposition shield 8kW heater array Lift-off fixturing substrate rotation substrate dome for twenty-two 100mm back loaded wafers Inficon IC/6 for thickness control	SOP
KJL Evaporator	Deposition bay 1	up to 6"	4 pockets	E-beam voltage 5kV	Ti, Au, Pt, Pd, Cr, Ni, and Ag. Other materials available upon request.		substrate rotation source to substrate distance is approx. 15″ (381mm)	SOP Training video
Temescal Metal e-beam evaporator	Deposition bay 1						Not in service.	SOP
KJL Sputter	Deposition bay 1	up to 6"	4 DC sources 1 RF/DC source	DC sputter power 500 W RF sputter power 300 W	Au, Pt, Ti, Al, W, Mo, Cu, SiO2, Al2O3, and ITO. Other materials available upon request.	Ar, O2	Target size: 2" Substrate rotation	SOP

Dry Etching & Plasma Cleaning

See also: Dry etching recipes.

Etchers

Tool	Location	Substrate size	Allowed materials	Disallowed materials	Gases	Table temperature	Features	Links
Oxford DRIE	Etch bay 1	4" wafer clamp, smaller pieces may go onto carrier wafers 2″, 3″, 4″, 6″, 8″ wafers possible	Si, SiO2, SiN, Parylene, polyimide, LiNbO3, BCB	No exposed metals (except Cr as a mask)	Ar, O2, CF4, CHF3, SF6, C4F8	20C	Model: Oxford System 100 Deep reactive-ion etcher Etch deep Si with Bosch process ICP power (max) 3000W Table RF power (max) 300W	SOP Quickstart guide Load lock operation video with chamber open Recipes
Oxford DRIE-ALE	Etch bay 1	4" wafer clamp, smaller pieces may go onto carrier wafers 2″, 3″, 4″, 6″, 8″ wafers possible	Si only - other materials may be allowed on a case by case basis	No SiNx, SiO2, III-V materials No exposed metals (except Cr as a mask) No deep etching polymers (>1 µm), may be used as a mask only	BCl3, Cl2, H2, N2O, CH4, CF4, CHF3, Ar, O2, C4F8, SF6	-120 to 200C	Oxford Deep reactive-ion etcher and atomic-layer etcher.
Oxford III-V	Etch bay 1	4" wafer clamp, smaller pieces may go onto carrier wafers 2″, 3″, 4″, 6″, 8″ wafers possible	InP, InAs, GaN, AlGaAs, GaAs, InGaAsP, ITO, Si, SiC, MoS2, WSe, Graphene	No exposed metals (except Cr as a mask) No deep etching polymers (>1 µm), may be used as a mask only	Ar, O2, SF6, CH4, H2, Cl2, BCl3, SiCl4	-120 to 200C	Model: Oxford PlasmaPro 100 Cobra III-V etcher Etch III-V materials Cryo cooling Helium backside cooling ICP power (max) 1500W Table RF power (max) 1500W Optical endpoint detection: Horiba Jobin Yvon LEM G50	SOP Quickstart guide
Oxford RIE	Etch bay 1	Up to 200 mm wafers	Si, SiO2, Si3N4 As masks: Cr, graphene Material removal: passivation (fluorine), resist (for descum), surface cleaning and activation	No exposed metals (except Cr as a mask) No deep etching polymers (>1 µm), may be used as a mask only No deep or high-aspect-ratio processes (consult staff)	Ar, O2, CF4, CHF3, SF6	20C	Model: Oxford PlasmaPro 80 reactive ion etcher Etch dielectrics Table RF power (max) 300W Optical endpoint detection: Horiba Jobin Yvon LEM G50	SOP OES SOP Laser Endpoint SOP Training video Standard Recipes Standard Recipe Calibration
XeF2 etcher	Deposition bay 1	Up to 6" wafers	Si	None	Crystal XeF2 source	20C	Etch Si quickly and isotropically with high selectivity Custom built by the Armani group	SOP Quickstart guide

Plasma cleaning / ashing

Tool	Location	Substrate size	Allowed materials	Gases	Features	Links
Tegal O2 Plasma Asher	Advanced Photo Bay	200 mm pieces or wafers	Photoresist, graphene, CNT	O2	Model: Tegal CU90??	SOP
Tegal Plasma	Advanced Photo Bay				Model: Tegal Plasma 915 Tool is currently not in operation
YES O2 Plasma	Advanced Photo Bay	200mm pieces or wafers		O2	Model: Yield Engineering System YES-CV200RFS 1000W table RF power Heat up to 250C	Quickstart

Lithography

E-beam and laser

Tool	Location	Substrate size	Exposure resolution	Features	Links
Raith EBL	Ebeam Bay	4" wafer, or small pieces up to 2"	<8nm	Model: EBPG5150 Thermal Field Emission 50kV and 100kV Beam current 350nA Pattern Generator 125 MHZ Genlsys – Beamer	SOP
Heidelberg DWL	Metrology Bay	Min substrate/mask size 5x5mm Max substrate/mask size 9"x9"	300nm	Model: Heidelberg DWL 66+ (Direct Write Laser) Front and backside alignment Exposure wavelength: Grayscale and advanced grayscale exposure 405nm laser (“h-line” photoresists) Write modes (trading off high speed and high resolution) High resolution (min feature size 0.3um) Mode IV: min size 2um Mode V: min size 4um Alignment modes: Manual, semi-automatic, and fully automatic alignment	SOP

UV mask aligners

Tool	Location	Substrate size	Mask size	Exposure resolution	Features	Links
Aligner A (MJB3)	Advanced Photo bay	Pieces up to 3”	3” and 4”	0.8um	Backside alignment Exposure modes Soft, Hard, and vacuum contacts Exposure wavelength UV 400, 350-450 nm Exposure source 350 W Hg Arc lamp	SOP
Aligner B (MJB3)	Photo bay	Pieces up to 3”	3” and 4”	0.8um	Exposure modes Soft, Hard, and vacuum contacts Exposure wavelength UV 400, 350-450 nm Exposure source 350 W Hg Arc lamp	SOP
Aligner C (MJB4)	Photo bay	Pieces up to 2"	3", 4", and 5"	0.8um	Exposure wavelength UV 400, 350 – 450nm Eyepieces 10x, objectives 5x, 10x, 20x	SOP
Aligner D (MA BA6 Gen4)	Advanced Photo Bay			0.8um	Backside alignment Exposure wavelength UV400 350 – 450 nm Exposure source 450W LED Digital camera objectives 5x, 10x	SOP

Metrology

Assorted metrology

Tool	Location	Features	Links
4-point Probe	Metrology bay	Model: Signatone 4-point probe SP4 probe Readout with HP 34401A multimeter	Multimeter SOP
Dektak profilometer	Metrology bay	Model: Bruker DektakXT profilometer Scan Length Range 55mm (2in) 150mm (6in) with scan stitching capability Data Points Per Scan 120,000 maximum Max. Sample Thickness 50mm (1.95in) Step Height Repeatability <5Å, 1sigma on 0.1μm step Vertical Range 1mm (0.039in.) Vertical Resolution 1Å max. (@ 6.55μm range)10 Å @ 65.5 μm; 80 Å @ 524μm; 150 Å @ 1mm 3D capability	SOP
Ellipsometer	Photo bay	Thin film thickness measurement Laser wavelengths 4050, 6328, 8300 Angstroms Wafer mapping Yes	SOP
Filmetrics F10	Photo bay	Thin film thickness measurement	SOP

Microscopes

Tool	Location	Features	Links
Desktop SEM	Metrology bay	Model: Phenom ProX G6 Desktop Scanning Electron Microscope Acc Voltage 5 – 15kV Resolution <10nm (for BSED) Magnification 80-150,000x Electron or optical imaging modes Sample Size – up to 32mm	Operation manual
Nikon LV 150 optical microscope	Photo bay	Brightfield & Darkfield Polarizer/Analyzer Halogen Lamp 5x, 10x, 20x, 50x, 100x Camera – 5.9 MP resolution USB output/WIFI for exporting images	SOP
Max ERB optical microscope	Photo bay	Zeiss 47 30 12 9902 binocular microscope head MSA-001 linear encoder
Zeiss optical microscope	Advanced photo bay
Nikon SMZ-10A optical microscope	Advanced photo bay	Dyna Lite 150 light source Olympus UC30 camera
Nikon optical microscope	Advanced photo bay	Dyna Lite 150 light source

Packaging & Mechanical Tooling

Wafer and die processing

Tool	Location	Substrate size	Features	Links
Ball & Wedge bonder	Etch bay 2		Model: F&S Bondtec 53BDA Deep-access & Ball-Wedge bonder	SOP Operation manual
Dicing Saw	Common chase	up to 10" or 250x250 mm	Model: DISCO Corp. DAD3350 Dicing Saw 1.8 kW spindle X-axis Cutting range 260 mm Cutting speed mm/s 0.1 ～ 600 Y-axis Cutting range 260 mm Index step: 0.0001 mm Z-axis Max. stroke: 32.2 mm Moving resolution: 0.00005 mm Repeatability accuracy: 0.001 mm	SOP Operation manual Training video part 1 Training video part 2 Training video part 3
Mini Polisher	Common chase	up to 1" diameter	EQ Unipol-300 Mini (3") Automatic Grinder/ Polisher 20nm, 50nm, 0.25um, 1um, 5um, 10um polishing slurries/pastes available Smooth polishing pads and sanding pads from 60-3000 grit available	SOP Manufacturer product page, including operation videos
LatticeAx Cleaver	Photo bay		LatticeAx 420 Cleaving System 2-axis linear stage Digital camera	SOP Operation video Operation manual
FlipScribe Cleaver	Photo bay		Model: LatticeGear FlipScribe	Operation manual Quickstart
Vacuum Bag Sealer	Advanced photo bay		Model: Gramatech GVS2600R Vacuum Sealer 36" max sealing width N2 purge bags before sealing Foot lever operation Automated purge/vacuum/heat-seal/cool sequence

PCB Processing

PCB processing

Tool	Location	Features	Links
LPKF PCB mill and solder dispenser	Common chase	Model: LPKF ProtoMat S103 PCB milling, through hole drilling, contour routing, solder dispensing CircuitPro software available for design work Accepts design file Gerber export from various CAD softwares Mechanical resolution 0.5um Max PCB size: A4	SOP Operation manual
LPKF electroplater	Common chase	Model: LPKF Contac S4 Multistep clean and plate process Through-hole copper electroplating This tool is in the commissioning process. Contact Nanofab staff if interested.	Operation manual
LPKF riveting kit for vias	Common chase	Model: LPKF EasyContac Kit Rivets made out of copper alloy. They are placed in the hole by hand and riveted with the help of a punch tool. The hole can still be populated with a component lead if required before soldering. Rivet external diameters available: 0.8mm (31mil) 1.0mm (39mil) 1.4mm (55mil) 1.6mm (63mil) The inner diameters of the rivets are 0.2mm (8mil) or 0.4mm (16mil) smaller	Product page
LPKF manual pick-and-place	N/A	Model: LPKF ProtoPlace E4 This tool is in the commissioning process. Contact Nanofab staff if interested.	Product flyer
LPKF solder masking / silkscreening system	N/A	Model: LPKF ProMask / ProLegend Uses photolithography process with chemical rolling applicators, UV exposure bed, baking oven This tool is in the commissioning process. Contact Nanofab staff if interested.	Product page
Reflow oven	N/A	Model: INTSUPERMAI Reflow Oven T-937 Power: 2300W Cycle time: 2-16 min Temp range: Room temp-350℃ 8 preprogrammed temperature curves Dedicated heating and forced cooling functions This tool is on loan from the Khan lab. This tool is in the commissioning process. Contact Nanofab staff if interested.	Product page

Wet Process

Solvent fume hood (located in Metrology bay)

	Tool	Description	Links
Model: Air Control, Inc CS-41-316LSS-8ft	Heated ultrasonic bath		SOP
	Torrey Pines hot plate	Model: Torrey Pines HS70
	Solvent drains
	N2 sprayers

Acid fume hood left-side (located in Etch bay)

	Tool	Description	Links
This fume hood is the only fume hood where the Piranha and Nanostrip chemicals may be used.
Model: Air Control, Inc. CS-41-C-PVC-7ft	Heated bath	Model: Imtec Accubath	SOP
	Quick-dump-rinse tank (QDR)
	DI water tap
	N2 gun

Acid fume hood right-side (located in Etch bay)

	Tool	Description	Links
Piranha and Nanostrip chemicals are NOT allowed in this fume hood.
Model: Air Control, Inc. CS-41-C-PVC-7ft	Heated bath	Model: Imtec Accubath	SOP
	Torrey Pines hot plate left	Model: Torrey Pines HS70
	Torrey Pines hot plate right
	Quick-dump-rinse tank (QDR)
	DI water tap
	N2 sprayer

Resist fume hood (located in Advanced Photo bay)

	Tool	Description	Links
Model: Air Control, Inc. CS-41-316-LSS-8ft	Spinner left	Laurell resist spinner	SOP
	Spinner right
	Bake plate 1	Apogee bake plate	SOP
	Bake plate 2
	Bake plate 3
	Bake plate 4
	N2 sprayer left
	N2 sprayer right

Base and developer fume hood left-side (located in Advanced Photo bay)

	Tool	Description	Links
Model: Air Control, Inc. CS-41-C-PVC-6ft	Heated bath	Model: Imtec Accubath	SOP
	Torrey Pines hot plate	Model: Torrey Pines HS70
	Quick-dump-rinse tank (QDR)
	DI water tap
	DI water gun
	N2 sprayer

Base and developer fume hood right-side (located in Advanced Photo bay)

	Tool	Description	Links
Model: Air Control, Inc. CS-41-C-PVC-6ft	Heated bath	Model: Imtec Accubath	SOP
	Torrey Pines hot plate	Model: Torrey Pines HS70
	Quick-dump-rinse tank (QDR)
	DI water tap
	DI water gun
	N2 sprayer

E-beam resist fume hood (located in Photo bay)

	Tool	Description	Links
Model: Precision Air Technology CS-41-316LSS-8ft	Headway spinner left	Model: Headway Research CB15 Controller model: Headway Research PWM50	SOP
	Headway spinner right
	Apogee hot plate left		SOP
	Apogee hot plate right
	Ultrasonic heated bath
	Torrey Pines hot plate/ stirrer	Model: Torrey Pines HS70
	N2 gun left
	N2 gun right