Mini Polisher
About
Process: This is a compact, automatic tabletop grinder/polisher designed for small samples. It supports multi-step grinding and polishing with abrasive pads and slurries to achieve smooth, flat surfaces for microscopy, cross-section analysis, or device preparation.
Hardware: 3" polishing platen with variable speed control. Automatic mode for consistent pressure and rotation. Sample holder for up to 1" diameter pieces. Interchangeable pads (smooth polishing pads + sanding pads 60–3000 grit). Slurry delivery system for diamond or colloidal suspensions.
Key Features:
- Sample size: Up to 1" diameter
- Platen size: 3"
- Abrasives: Polishing pads + sanding pads (60–3000 grit)
- Slurries/pastes: 20 nm, 50 nm, 0.25 µm, 1 µm, 5 µm, 10 µm available
- Operation: Automatic grinder/polisher with speed/pressure control
Applications:
- Cross-section polishing for SEM/TEM analysis
- Planarization of small samples or mounted dies
- Surface smoothing after dicing or cleaving
- Preparation of polished metallographic samples
- Removal of damage layers from grinding
- Final polish for optical or electrical characterization
Usage: Mount sample (e.g., in epoxy or holder), select pad/slurry, set speed/pressure/time, run automatic cycle (or manual), rinse/clean between steps, inspect surface. Follow multi-step progression (coarse grit → fine → polish). Clean platen and tools after use.
Detailed Specifications
- Model: EQ Unipol-300 Mini (3") Automatic Grinder/Polisher
- Location: Common Chase
- Sample size: Up to 1" diameter
- Platen: 3" diameter
- Abrasives available:
* Sanding pads: 60–3000 grit * Polishing slurries/pastes: 20 nm, 50 nm, 0.25 µm, 1 µm, 5 µm, 10 µm
- Features: Automatic operation, variable speed, consistent pressure, compact tabletop design
- Other: Ideal for small-sample prep in research and failure analysis
Documentation
- SOP – Standard Operating Procedure
- Manufacturer product page (includes operation videos): [1]
- Training required – contact lab staff (Chandan Ramakrishnaiah or Shivakumar Bhaskaran)
Recipes & Data
- Standard Polishing Sequence: Common multi-step process:
* Coarse grinding: 60–320 grit pads (remove bulk damage) * Fine grinding: 600–1200 grit pads * Pre-polish: 2000–3000 grit pads * Final polish: 0.25 µm or 50 nm slurry on polishing pad (for mirror finish) * Typical time per step: 2–10 min depending on material/removal needed
- Process Control: Inspect surface after each step with optical microscope. Aim for scratch-free, flat finish. Use fresh slurry/pad for final steps.
- Notes: Use DI water rinse between steps. Mount samples securely (e.g., in epoxy or holder). Avoid cross-contamination of abrasives. Clean platen thoroughly after use.