LPKF PCB mill
About
Process: This is a high-precision desktop PCB milling, drilling, and routing system for rapid prototyping of single- and double-sided printed circuit boards. It uses mechanical milling bits to remove copper and substrate material, enabling fast turnaround from design file to functional PCB without chemicals or etching.
Hardware: High-speed spindle for milling/drilling. Automatic tool change (if equipped) or manual tool selection. X/Y/Z precision linear drives. Integrated vision/camera for alignment and fiducial recognition. CircuitPro software for design import (Gerber, Excellon drill), toolpath generation, and machine control. Solder paste dispensing capability.
Key Features:
- Max PCB size: A4 (210 × 297 mm)
- Mechanical resolution: 0.5 µm
- Capabilities: PCB milling, through-hole drilling, contour routing, solder paste dispensing
- Software: CircuitPro (supports Gerber export from various CAD tools)
- Tooling: Milling bits, drills, end mills (various sizes available)
Applications:
- Rapid prototyping of custom PCBs (single/double-sided)
- Quick-turn test boards and proof-of-concept circuits
- Milling of RF/microwave substrates (Rogers, alumina)
- Drilling vias or holes in PCBs
- Contour cutting of PCB outlines
- Solder paste dispensing for SMT assembly
Usage: Import Gerber files into CircuitPro, generate toolpaths, select tools, load substrate, align (fiducials or manual), run job (mill/drill/route/dispense), unload board, clean machine. Inspect board quality post-process.
Detailed Specifications
- Model: LPKF ProtoMat S103
- Location: Common Chase
- Max PCB size: A4 (210 × 297 mm)
- Mechanical resolution: 0.5 µm
- Capabilities: Milling, through-hole drilling, contour routing, solder paste dispensing
- Software: CircuitPro (Gerber import from various CAD packages)
- Features: High-speed spindle, precision drives, vision alignment, automated toolpath generation
- Other: Fast, chemical-free PCB prototyping for research and development
Documentation
- SOP – Standard Operating Procedure
- Operation Manual (note: may be for similar S43 series; confirm for S103)
- Training required – contact lab staff (Chandan Ramakrishnaiah or Shivakumar Bhaskaran)
Recipes & Data
- Standard Processing: Common workflows include:
* Single-sided PCB: Mill copper traces + drill holes * Double-sided: Front/back alignment + through-hole plating (if combined with electroplater) * RF board: Use finer bits for controlled impedance on Rogers material * Solder paste dispense: For SMT pad filling after milling
- Process Control: Inspect milled features with optical microscope. Check for burrs/chipping. Verify alignment accuracy on double-sided boards.
- Notes: Use appropriate bit size/speed/feed for material (e.g., slower for FR4, higher for ceramics). Secure substrate with vacuum or tape. Clean dust/vacuum after runs. Dispose of copper dust properly.