Dry etching recipes
Dry Etching Tools / Materials Table
Process Maturity Ranking
L1— process has been run at least onceL2— process has been run and procedure is documentedL3— process has been run, procedure is documented, and data is availableL4— documented procedure with regular (≥4× per year) data, no in-situ controlL5— documented procedure with regular data and in-situ control availableL6— fully controlled process with documented procedure and control charts/limitsA— process allowed and materials available but never run–— process not allowed or not applicable
Dry Etching Recipes
| |||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|
| RIE Etching | ICP Etching | Oxygen Plasma Systems | Other Dry Etchers | ||||||||
| Material | Oxford RIE | Tegal Plasma (not in op.) | Tegal O2 Asher | Oxford DRIE | Oxford DRIE-ALE (comm.) | Oxford III-V | YES O2 Plasma | XeF2 etcher | Other | ||
| Ag | |||||||||||
| Al | L4 | ||||||||||
| Au | L3 | ||||||||||
| Cr | L4 | L1 | |||||||||
| Cu | L1 | ||||||||||
| Ge | L1 | ||||||||||
| Mo | L1 | ||||||||||
| Ni | L3 | ||||||||||
| Pt | L3 | ||||||||||
| Ru | L1 | ||||||||||
| Si | L3 | L3 | L6 | L1 | L3 | L3 | L3 | L1 | |||
| SiO₂ | L3 | L3 | L6 | L1 | L3 | L3 | L1 | ||||
| Si₃N₄ | L3 | L3 | L6 | L1 | L3 | L3 | L1 | ||||
| ITO | L1 | ||||||||||
| GaAs | L6 | L1 | |||||||||
| InP | L6 | L1 | |||||||||
| GaN | L6 | L1 | |||||||||
| Photoresist & Organics | L3 | L6 | L3 | L1 | L3 | L6 | L3 | L1 | |||
| Material | Oxford RIE | Tegal Plasma (not in op.) | Tegal O2 Asher | Oxford DRIE | Oxford DRIE-ALE (comm.) | Oxford III-V | YES O2 Plasma | XeF2 etcher | Other | ||
Process Ranking Table
Processes in the table above are ranked by their "Process Maturity Level" as follows:
| Level | Color | Description of Process Level Ranking |
|---|---|---|
| A | A |
Process Allowed and materials available but never done |
| L1 | L1 |
Process has been run at least once |
| L2 | L2 |
Process has been run and procedure is documented |
| L3 | L3 |
Process has been run, procedure is documented, and data is available |
| L4 | L4 |
Documented procedure with regular (≥4× per year) data, no in-situ control |
| L5 | L5 |
Documented procedure with regular data and in-situ control available |
| L6 | L6 |
Fully controlled process with documented procedure and control charts/limits available |
Oxford III-V 100 etcher recipes
Oxford RIE 80 etcher recipes
Oxford DRIE 100 etcher recipes