Apogee Hot Plate
About
Process: These are digital hot plates optimized for controlled baking of e-beam resists and other sensitive materials used in high-resolution lithography. They provide uniform heating with precise temperature and time control, critical for pre-exposure bake, post-exposure bake (if applicable), and curing steps in e-beam workflows.
Hardware: Two Apogee hot plates (labeled left and right) with flat, large-area heating surfaces. Digital temperature controllers for accurate setpoint and stability. Timer function for programmable bake cycles. Located in the dedicated e-beam resist fume hood for safe solvent evaporation and fume extraction during baking.
Key Features:
- Precise digital temperature control
- Uniform heating surface
- Timer for reproducible bake times
- Two units for parallel processing or dedicated resists
- Cleanroom-compatible design
Applications:
- Pre-bake of e-beam resists (e.g., PMMA, ZEP, HSQ) to remove solvent and improve adhesion
- Post-exposure bake for certain chemically amplified e-beam resists
- Curing of underlayers or adhesion promoters
- Gentle heating of sensitive polymers or thin films
- Stabilization of coatings before e-beam exposure
Usage: Place substrate on hot plate (use tweezers or vacuum wand), set temperature and time, start bake, monitor process, remove after completion (allow cooling if needed), clean surface after use. Use in fume hood only. Never leave unattended at high temperatures.
Detailed Specifications
- Model: Apogee Hot Plates (two units: left & right)
- Location: E-beam Resist Fume Hood – Photo Bay
- Features: Digital temperature control, timer, uniform heating, cleanroom-compatible
- Temperature range: Ambient to high temperature (confirm max on each unit, typically ~200–300°C for resist baking)
- Restrictions: Use only for approved e-beam resists/polymers; avoid corrosive chemicals or direct contact with acids/bases; clean surface between users
- Other: Dedicated for e-beam lithography baking; separate from the four Apogee plates in the general resist hood
Documentation
- SOP – Apogee Hotplate (shared with general Apogee plates; confirm if e-beam-specific notes exist)
- Training required – contact lab staff (Chandan Ramakrishnaiah or Shivakumar Bhaskaran)
Recipes & Data
- Standard Bake Recipes: Common settings for e-beam resists include:
* PMMA 950k/495k pre-bake: 150–180°C, 60–180 s (solvent removal, thickness control) * ZEP520A pre-bake: 180°C, 90–180 s * HSQ pre-bake: 150–200°C, 60–120 s (curing/hardening) * ma-N series: 100–150°C, 60–120 s
- Process Control: Verify thickness post-bake (ellipsometer or profilometer). Check for uniformity and cracking visually. Use consistent preheat time (10–20 min) for stability.
- Notes: Allow pre-heat stabilization for best uniformity. Use foil or dedicated trays to protect plate from spills. Clean surface with IPA after each use. Avoid exceeding resist recommended temperatures to prevent cracking or reflow.