Ball & Wedge bonder
About
Process: This is an automated/manual wire bonder capable of both ball bonding (typically gold wire) and wedge bonding (gold or aluminum wire). It is used for making electrical interconnections between chip pads and package leads or substrates in device packaging and prototyping.
Hardware: F&S Bondtec 53BDA deep-access model with fine-pitch capability. Ultrasonic transducer for bonding energy. Heated stage/chuck for substrate temperature control. Deep-access head for bonding in recessed areas or tall packages. Vision system for alignment and pattern recognition. Capable of thermosonic (gold ball) and ultrasonic (wedge) bonding modes.
Key Features:
- Bonding types: Ball (gold thermosonic) and wedge (gold/aluminum ultrasonic)
- Wire diameter: Typically 18–50 µm (confirm available wire spools)
- Deep-access capability: For bonding in cavities or high-profile packages
- Alignment: Optical pattern recognition and manual alignment
- Bonding parameters: Adjustable force, time, power, temperature
Applications:
- Wire bonding of die to package leads (e.g., DIP, QFN, ceramic packages)
- Chip-on-board (COB) or hybrid assembly
- Prototyping of MEMS, sensors, or photonic devices
- Repair or modification of bonded assemblies
- Low-volume production or test device interconnection
Usage: Load substrate and die, align bond pads using vision system, thread wire, set bonding parameters (force/time/power/temp), perform ball/wedge bonds, stitch loops as needed, cut/terminate wire, unload. Clean tools after use.
Detailed Specifications
- Model: F&S Bondtec 53BDA Deep-access & Ball-Wedge bonder
- Location: Etch bay 2
- Bonding modes: Ball (thermosonic) and wedge (ultrasonic)
- Capabilities: Deep-access head, fine-pitch bonding, pattern recognition
- Features: Ultrasonic transducer, heated stage, vision alignment, manual/automated operation
- Restrictions: Requires compatible bond pads and wire; avoid contamination of capillary/tool
- Other: Versatile bonder for research packaging and device interconnection
Documentation
- SOP – Standard Operating Procedure
- Operation Manual
- Training required – contact lab staff (Chandan)
Recipes & Data
- Standard Bonding: Common setups include:
* Gold ball bonding: Thermosonic, 100–200°C stage, 18–25 µm wire, typical force 20–50 g * Aluminum wedge bonding: Ultrasonic, room temp or low heat, 25–50 µm wire, higher force/time * Loop height/stitch control: Adjusted for package geometry
- Process Control: Perform pull/shear tests on sample bonds. Check bond placement and loop shape visually. Monitor capillary wear.
- Notes: Use nitrogen purge if available to reduce oxidation. Clean capillary periodically. Calibrate parameters for each wire type and pad material.
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