Blue M furnace little
About
Process: This is a compact forced-air convection drying oven designed for precise, uniform heating at moderate temperatures. It is ideal for small batches, individual wafers/pieces, or space-constrained processes such as baking photoresists, curing thin films, drying samples, or low-temperature annealing in a clean environment.
Hardware: Forced-air circulation with adjustable fan for good temperature uniformity. Stainless steel interior for cleanroom compatibility and easy cleaning. Digital temperature controller with over-temperature protection. Removable shelves or fixed tray for samples. Door with observation window and tight gasket seal.
Atmosphere:
- Ambient air (forced convection)
- No vacuum or special gases (for inert/forming gas or vacuum processes, use RTA, vacuum ovens, or other tools)
- Optional N₂ purge if modified (not standard – confirm if equipped)
Applications:
- Soft bake and hard bake of photoresists (e.g., 90–180°C)
- Post-exposure bake (PEB) for smaller samples
- Curing of spin-on materials, adhesives, or thin polymers
- Drying after wet etch/rinse or solvent clean
- Low-temperature outgassing or degassing of small pieces
- Gentle thermal treatment for research prototypes
Usage: Load sample(s) on shelf/tray, set temperature and time via controller, allow stabilization, run process. Use timer or manual monitoring. Cool down before opening to prevent thermal shock or particle contamination. Follow SOP for loading, unloading, and chamber cleaning.
Detailed Specifications
- Model: Blue M OV-8A
- Location: Advanced Photo bay
- Substrate size: Flexible (small pieces, up to ~4–6" wafers, or cassettes – check interior dimensions)
- Temperature range: Ambient to 260°C
- Temperature control: Digital PID controller with uniformity typically ±2–5°C across chamber (depending on load)
- Heating: Electric elements with forced-air circulation
- Features: Over-temperature safety cutoff, compact footprint, observation window, cleanroom-compatible design
- Restrictions: Max 260°C (not for high-temperature processes); avoid volatile/corrosive chemicals that could damage interior or contaminate other users
- Other: Smaller interior volume compared to OV-12A, suitable for quick single-sample or low-volume processing
Documentation
- SOP – Standard Operating Procedure
- Training required – contact lab staff (Joey)
Recipes & Data
- Standard Processes: Common bakes include:
* Photoresist soft bake: 90–110°C (1–5 min) * Post-exposure bake (PEB): 100–130°C * Hard bake: 120–180°C * Curing of thin films or adhesives: 150–250°C
- Process Control: Verify temperature uniformity with thermocouple checks if needed. Monitor for contamination (e.g., particles) after use.
- Notes: Allow pre-heat stabilization time (20–40 min) for best uniformity. Use foil or trays to protect shelves from spills.
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