Cascade Tek vacuum oven
About
Process: This is a vacuum oven designed for drying, degassing, and baking of samples under controlled vacuum conditions. It removes moisture, solvents, or trapped gases at moderate temperatures while minimizing oxidation or contamination.
Hardware: Stainless steel chamber with three shelves. Manual vacuum control. Temperature controller for stable setpoints. Viewport for monitoring. Suitable for cleanroom use with low outgassing materials.
Gases / Atmosphere:
- Low Vacuum
- N₂ backfill or purge
- No reactive gases
Applications:
- Outgassing / degassing of polymers, photoresists, or adhesives before lithography or deposition
- Low-temperature baking of resists or coatings (e.g., post-exposure or hard bake under vacuum)
- Drying of wet samples after wet processing
- Solvent removal from delicate structures
- Vacuum storage or low-pressure curing
Usage: Load samples, close door, pump down to desired vacuum level, set temperature and time, run cycle. Monitor temperature and pressure during process. Cool down before venting. Follow SOP for pump-down and venting sequences.
Detailed Specifications
- Model: Cascade TEK TVO-2
- Location: Advanced Photo bay
- Substrate size: Flexible (pieces, wafers, or small cassettes – check chamber dimensions)
- Temperature range: Ambient to ~220°C
- Vacuum capability: Rough vacuum (mechanical pump) to low mTorr range
- Features: Heated chamber, vacuum gauge, temperature controller, cleanroom-compatible materials
- Restrictions: No high-temperature processes (>250°C); avoid volatile or corrosive materials that could damage pump or chamber seal.
Documentation
- SOP – Standard Operating Procedure
- Training required – contact lab staff (Joey)
Recipes & Data
- Standard Processes: Typical bakes at 90–150°C under vacuum for photoresist hardening, solvent removal, or degassing (e.g., 30–120 minutes depending on material).
- Process Control: Monitor chamber pressure and temperature stability. Check for contamination or residue post-use.
- Notes: Use vacuum to evaporate solvent and reduce bubble formation in thick films or polymers.
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