Dektak profilometer
About
Process: This is a contact stylus profilometer that measures surface topography by scanning a diamond-tipped stylus across the sample. It provides high-resolution 2D line scans and 3D maps for step heights, film thickness, roughness, trench depth, and surface profiles with angstrom-level precision.
Hardware: Diamond stylus tip (low force, typically 1–15 mg) for minimal sample damage. High-precision X/Y stage with stitching for long scans. Optical viewing system for positioning. Bruker DektakXT software for scan control, data analysis, and 3D visualization. Automated or manual operation.
Key Features:
- Scan length: 55 mm standard (2 in); up to 150 mm (6 in) with stitching
- Max sample thickness: 50 mm (1.95 in)
- Step height repeatability: <5 Å (1 sigma on 0.1 µm step)
- Vertical range: 1 mm (0.039 in)
- Vertical resolution: 1 Å max (at 6.55 µm range); 10 Å at 65.5 µm; 80 Å at 524 µm; 150 Å at 1 mm
- 3D capability: Yes (raster scans for topography maps)
- Data points per scan: Up to 120,000
Applications:
- Step height and film thickness measurement (post-deposition/etch)
- Surface roughness (Ra, Rq) of thin films or substrates
- Trench depth and sidewall profiling
- Etch uniformity across wafers
- MEMS structure characterization
- Quality control of patterned features
Usage: Place sample on stage, align with optical viewer, set scan parameters (length, speed, force, range), run scan (2D line or 3D map), analyze data (level, step height, roughness). Export profiles or 3D images. Use low stylus force for soft materials.
Detailed Specifications
- Model: Bruker DektakXT
- Location: Metrology Bay
- Scan length range: 55 mm (2 in); 150 mm (6 in) with stitching
- Max sample thickness: 50 mm (1.95 in)
- Step height repeatability: <5 Å (1 sigma on 0.1 µm step)
- Vertical range: 1 mm (0.039 in)
- Vertical resolution: Down to 1 Å (depending on range)
- 3D capability: Yes (multiple line scans or raster maps)
- Other: High-precision stylus profilometry for thin-film and topography analysis in cleanroom
Documentation
- SOP – Standard Operating Procedure
- Training required – contact lab staff (Chandan Ramakrishnaiah or Shivakumar Bhaskaran)
Recipes & Data
- Standard Measurements: Common setups include:
* Thin film thickness: Scan across patterned step (e.g., 10–1000 nm films) * Roughness: 500 µm–5 mm scan length, Ra/Rq calculation * Trench depth: Cross-section scan of etched features * Wafer uniformity: Multiple points or stitched scans
- Process Control: Use leveling and tilt correction for accurate step heights. Verify repeatability with standard samples. Compare with ellipsometer/Filmetrics for cross-validation.
- Notes: Use lowest stylus force for soft/delicate films (e.g., polymers). Avoid scanning over very sharp edges to prevent tip damage. Stitching enabled for long profiles.
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