Dicing Saw

About

DISCO DAD3350 Precision Dicing Saw in Common Chase

Process: This is a high-precision automatic dicing saw used for cutting wafers and substrates into individual dies or pieces. It employs a high-speed diamond blade with programmable X/Y/Z control for accurate, repeatable cuts with minimal chipping or kerf damage.

Hardware: 1.8 kW high-torque spindle for fast blade rotation. X/Y axes with 260 mm travel range. Z-axis max stroke 32.2 mm with 0.00005 mm resolution. High-accuracy linear motors and vision alignment system. Programmable cutting speed (0.1–600 mm/s) and index step (0.0001 mm). Repeatability 0.001 mm.

Key Features:

• Substrate size: Up to 8" wafers or 250×250 mm substrates
• Spindle power: 1.8 kW
• X/Y travel: 260 mm each axis
• Z-axis: Max stroke 32.2 mm, resolution 0.00005 mm
• Repeatability: 0.001 mm
• Cutting speed: 0.1 to 600 mm/s
• Index step: 0.0001 mm

Applications:

• Wafer dicing into individual dies (Si, GaAs, SiC, glass, etc.)
• Singulation of MEMS, photonic, or sensor devices
• Cutting of ceramic or composite substrates
• Precision sectioning for failure analysis or cross-section prep
• High-volume or prototype die separation

Usage: Mount wafer/substrate on dicing tape/frame, align using vision system, load program (cut depth, speed, step size), set blade height, run automatic or step-by-step cuts, unload after completion. Clean blade/chuck after use. Follow SOP for blade change and safety.

Detailed Specifications

• Model: DISCO Corp. DAD3350
• Location: Common Chase
• Substrate size: Up to 8" wafers or 250×250 mm
• Spindle: 1.8 kW
• X/Y-axis cutting range: 260 mm
• Cutting speed: 0.1 to 600 mm/s
• Index step: 0.0001 mm
• Z-axis max stroke: 32.2 mm
• Moving resolution: 0.00005 mm
• Repeatability accuracy: 0.001 mm
• Features: High-precision linear motors, vision alignment, programmable parameters, automatic operation
• Other: Industry-standard dicing saw for clean, accurate singulation in research and prototyping

Documentation

• SOP – Standard Operating Procedure
• Operation Manual
• Training videos:

 * Part 1
 * Part 2
 * Part 3

• Training required – contact lab staff (Chandan Ramakrishnaiah or Shivakumar Bhaskaran)

Recipes & Data

• Standard Cutting: Common parameters include:

 * Si wafers: Blade speed 30,000–60,000 rpm, feed rate 5–50 mm/s, depth 50–100 µm past substrate
 * Glass/ceramics: Lower feed rate (2–20 mm/s) to minimize chipping
 * Step size: Match die size (e.g., 1–10 mm streets)

• Process Control: Perform test cuts on sample pieces. Check kerf width, chipping, and die quality via microscope/SEM. Adjust blade height/depth for full cut without damaging tape.
• Notes: Use appropriate blade (hubbed or hubless) for material. Coolant (DI water) required. Secure tape/frame properly to avoid vibration. Blade dressing may be needed for new blades.

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