FlipScribe Cleaver

About

LatticeGear FlipScribe Cleaver in Photo Bay

Process: The FlipScribe is a specialized scribing tool that allows precise backside (or frontside) scribing of wafers and substrates while keeping the active device side protected. After scribing, manual or tool-assisted cleaving produces clean breaks with minimal chipping, making it ideal for preparing cross-sections or singulating delicate samples without exposing the front surface to damage.

Hardware: Compact manual scribing system with flip-over mechanism to scribe from the backside. Adjustable scribing force and position control. Diamond scribe tip for consistent indentation. Simple, no-power-required design (manual operation). Compatible with vacuum chuck or tape mounting for stability.

Key Features:

• Backside scribing capability (protects front/device side)
• Precise control of scribe location and force
• Manual cleaving after scribing
• Sample size: Flexible (small pieces to full wafers – confirm max on tool)
• Cleave quality: Clean edges, reduced chipping compared to frontside scribing

Applications:

• Cross-section preparation for SEM/TEM/FIB analysis (scribe backside, cleave to expose active features)
• Singulation of delicate devices or MEMS without front-side contact
• Cleaving along crystal planes or predefined lines
• Sample prep for failure analysis or device testing
• Low-damage alternative to dicing for small or fragile pieces

Usage: Mount sample (tape or chuck), flip to expose backside, align scribe position, apply controlled indent/scribe, flip back, cleave manually or with breaker. Inspect edge quality. Clean tool after use. Follow manual for safe operation.

Detailed Specifications

• Model: LatticeGear FlipScribe
• Location: Photo Bay
• Features: Backside scribing mechanism, adjustable scribe force/position, manual cleaving
• Capabilities: Clean, low-damage cleaving with front-side protection
• Restrictions: Best for brittle/cleavable materials; confirm sample size limits on tool
• Other: Simple, manual tool for precise sample preparation in research

Documentation

• Operation Manual
• Quickstart Guide
• Training required – contact lab staff (Chandan Ramakrishnaiah or Shivakumar Bhaskaran)

Recipes & Data

• Standard Cleaving: Common process:

 * Mount sample securely (e.g., on dicing tape, device side down)
 * Flip to backside, align scribe line using visual guides
 * Apply scribe (single or multiple indents for controlled propagation)
 * Flip back and cleave (manual break or gentle pressure)
 * Typical for Si: Scribe along <110> for straight cleavage

• Process Control: Inspect cleaved edge with optical microscope or SEM for chipping/quality. Adjust scribe force for material thickness.
• Notes: Use backside scribing to protect sensitive front-side features. Practice on test pieces. Clean scribe tip periodically.