Headway Spinner
About
Process: These are high-precision programmable spinners designed for uniform coating of e-beam resists and other sensitive materials. They offer excellent thickness control through adjustable spin speed, acceleration, and time, with vacuum chuck hold-down for flatness. Two units (left and right) are available in the dedicated e-beam resist fume hood.
Hardware: Headway CB15 spinner with vacuum chuck. Headway PWM50 controller for multi-step recipes. Lid with safety interlock. Solvent-resistant bowl. Located in the e-beam resist fume hood to minimize contamination and handle solvent vapors safely.
Key Features:
- Programmable multi-step spin recipes (via PWM50 controller)
- Vacuum chuck for secure hold
- Precise speed control (typically 100–8000 rpm)
- Acceleration/deceleration ramps
- Safety lid interlock
- Two units for parallel processing or dedicated resists
Applications:
- Spin-coating of e-beam resists (PMMA, ZEP520A, HSQ, ma-N series)
- Coating of sensitive polymers or thin films for e-beam lithography
- Application of adhesion promoters or underlayers
- Uniform thin-film deposition for nanoscale patterning
- Preparation of samples for direct-write e-beam exposure
Usage: Place substrate on chuck, apply resist (center or dynamic dispense), close lid, load/select recipe or manual parameters, start spin. Collect excess resist waste, rinse chuck if needed, clean bowl after use. Use in designated fume hood only.
Detailed Specifications
- Model: Headway Research CB15 (with PWM50 controller)
- Location: E-beam Resist Fume Hood – Photo Bay (two units: left & right)
- Chuck: Vacuum hold-down
- Speed range: Typically 100–8000 rpm (confirm on each unit)
- Features: Programmable recipes, precise ramps, safety interlock, solvent-resistant
- Restrictions: Use only in e-beam resist fume hood; avoid strong acids/bases; clean chuck after each use
- Other: Optimized for high-resolution e-beam lithography workflows
Documentation
- SOP – Headway Spinner
- Training required – contact lab staff (Chandan Ramakrishnaiah or Shivakumar Bhaskaran)
Recipes & Data
- Standard Spin Recipes: Common settings include:
* PMMA 950k/495k (e-beam resist): 2000–6000 rpm for 100–500 nm thickness, 30–60 s * ZEP520A: 3000–5000 rpm for 200–400 nm, 45–60 s * HSQ (negative e-beam resist): 1000–4000 rpm for 50–200 nm, multi-step ramp * ma-N 2400 series: 2000–5000 rpm for high-resolution patterns
- Process Control: Measure thickness post-bake (ellipsometer, profilometer, or Filmetrics). Check uniformity visually or with microscope. Calibrate spin speed if needed.
- Notes: Use center dispense for small volumes; dynamic dispense for thicker films. Avoid bubbles in resist. Clean chuck and bowl thoroughly between users. Dispose of waste per lab guidelines.