KJL Evaporator

About

Kurt J. Lesker (KJL) e-beam Evaporator in Deposition Bay 1

Process: This is a high-vacuum electron-beam (e-beam) evaporator designed for depositing thin metal films with good control over thickness and uniformity. It supports multiple materials via a multi-pocket crucible and is suitable for contact metallization, adhesion layers, and general thin-film metal deposition in research and prototyping.

Hardware: 5 kV e-beam gun with 4-pocket crucible turret for sequential deposition without breaking vacuum. Substrate rotation stage for improved film uniformity. Quartz crystal thickness monitor for real-time rate and endpoint control. Source-to-substrate distance approximately 15" (381 mm) for good throw distance and uniformity. Direct load (no load lock mentioned; confirm if present).

Gases:

• None standard (high-vacuum thermal evaporation; no process gases required)
• Optional Ar backfill or purge if equipped (not listed; typically inert vacuum only)

Film Properties:

• High-purity metals with low resistivity and good adhesion
• Directional evaporation (line-of-sight) – ideal for liftoff processes
• Uniformity enhanced by substrate rotation
• Thickness control via quartz crystal monitor

Applications:

• Metal contacts, pads, and interconnects
• Adhesion/barrier layers (e.g., Ti/Au, Cr/Au stacks)
• Electrodes for devices (sensors, MEMS, photonics)
• Schottky/ohmic contacts
• Liftoff metallization
• General thin-film metal research

Usage: Load sample (up to 6" wafer or pieces), pump down, select pocket/material, set power/rate, run deposition with rotation enabled. Monitor thickness via quartz crystal. Cool down before venting.

Detailed Specifications

• Model: Kurt J. Lesker (KJL) e-beam evaporator
• Location: Deposition bay 1
• Substrate size: Up to 6" wafers (pieces/smaller supported)
• Crucibles: 4 pockets
• E-beam: 5 kV gun
• Deposition features:

 * Substrate rotation
 * Source-to-substrate distance: ~15" (381 mm)
 * Quartz crystal thickness/rate monitor

• Materials: Ti, Au, Pt, Pd, Cr, Ni, Ag (other materials available upon request)
• Other: Reliable for standard metal evaporation, good uniformity with rotation, straightforward operation for multi-user environment

Documentation

• SOP – Standard Operating Procedure
• Training video
• Training required – contact lab staff (Joey)

Recipes & Data

• Standard Processes: Common depositions include:

 * Ti adhesion layer: 10–50 nm
 * Au conductor: 100–500 nm
 * Cr/Au or Ti/Pt/Au stacks for contacts
 * Pt or Pd for specific applications

• Process Control: Calibrate deposition rates via quartz crystal monitor and verify post-dep thickness (e.g., Dektak profilometer). Check uniformity across wafer with rotation.
• Notes: Use rotation for best uniformity. Avoid cross-contamination between pockets; clean crucibles as per SOP.

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