LPKF electroplater
About
Status: Not Yet in Use This tool is installed but not currently operational. It requires procurement and setup of the appropriate plating chemistry set. Contact lab staff if interested in bringing it online for through-hole copper electroplating.
Process (planned): The LPKF Contac S4 is a compact, multistep electroplating system designed for through-hole metallization of drilled PCBs. It performs automated cleaning, activation, and copper plating to create conductive vias, enabling double-sided or multilayer PCB prototyping when combined with the LPKF PCB mill.
Hardware: Multistep tank system with automated sequencing for clean, activate, plate. Rack or basket for PCB panels. Power supply for controlled current/voltage plating. Integrated agitation and filtration. Compact footprint suitable for lab use.
Key Features (planned):
- Multistep clean-and-plate process
- Through-hole copper electroplating
- Automated chemistry handling
- Suitable for small to medium PCB panels
Applications (planned):
- Metallization of drilled vias in double-sided PCBs
- Creating conductive through-holes after LPKF milling
- Rapid prototyping of multilayer or high-density interconnect boards
- Repair or modification of existing PCBs
Current Usage: The tool is **not yet in use**. No chemistry set has been procured. Do not attempt to operate it. Contact lab staff (Chandan Ramakrishnaiah or Shivakumar Bhaskaran) if interested in setting it up — we can coordinate chemical procurement and commissioning.
Detailed Specifications
- Model: LPKF Contac S4
- Location: Common Chase
- Capabilities: Through-hole copper electroplating, multistep cleaning/activation/plating
- Status: Not yet in use (awaiting chemistry procurement)
- Features: Automated process sequence, compact design, suitable for rapid PCB prototyping
- Restrictions: Unavailable until chemistry and training are set up
- Other: Complements the LPKF ProtoMat S103 mill for full subtractive/additive PCB workflow
Documentation
- Operation Manual
- Training: Not yet offered (tool not operational) – contact lab staff for future commissioning and training
- Note: No SOP available yet (to be created upon activation)
Recipes & Data
- No active recipes or data (tool not in use)
- Planned Process: Typical sequence includes:
* Cleaning/degreasing * Micro-etch or activation * Electroless copper seed (if required) * Electroplating of copper for via filling
- Future Use: Once commissioned, refer to manual for chemistry mixing, current density, plating time, and bath maintenance.
- Contact staff for interest in procurement and activation.