LatticeAx Cleaver
About
Process: This is a precision cleaving tool designed for accurate, repeatable scribing and breaking of wafers and substrates. It allows controlled cleaving along crystal planes or predefined lines with minimal chipping and high edge quality, ideal for preparing samples for SEM, TEM, or device singulation without full dicing.
Hardware: 2-axis linear stage for precise positioning of scribe and break points. Integrated digital camera for accurate alignment and targeting of cleave lines. Indenter/scribe mechanism for controlled indentation. Cleave arm or guillotine-style breaker for clean fracture. Compact, manual operation with high repeatability.
Key Features:
- 2-axis linear stage for X/Y positioning
- Digital camera for real-time alignment and targeting
- Precision scribing and cleaving for controlled fractures
- Sample size: Flexible (small pieces to full wafers – confirm max on tool)
- Cleave quality: High edge quality, minimal chipping, accurate along crystal planes
Applications:
- Sample preparation for cross-section SEM/TEM analysis
- Precise die singulation or substrate cleaving
- Creating sharp edges for device testing or bonding
- Cleaving along crystal orientations (e.g., Si <110> planes)
- Alternative to dicing for low-volume or delicate samples
- Failure analysis and material characterization
Usage: Place sample on stage, align target cleave line using digital camera, position indenter, apply controlled scribe/indent, cleave using breaker arm. Inspect edge quality. Clean tool after use. Follow SOP for safe operation and sample handling.
Detailed Specifications
- Model: LatticeAx 420 Cleaving System
- Location: Photo Bay
- Features: 2-axis linear stage, digital camera for alignment, precision indenter and cleave mechanism
- Capabilities: High-accuracy cleaving with minimal damage, suitable for brittle materials
- Restrictions: Best for brittle/cleavable materials (avoid ductile metals); confirm sample size limits on tool
- Other: Compact, user-friendly cleaving tool for research sample prep
Documentation
- SOP – Standard Operating Procedure
- Operation video
- Operation Manual
- Training required – contact lab staff (Chandan Ramakrishnaiah or Shivakumar Bhaskaran)
Recipes & Data
- Standard Cleaving: Common process:
* Align: Use digital camera to target cleave line (e.g., along crystal plane or scribe mark) * Indent: Apply controlled force for scribe/indent * Cleave: Use breaker arm for clean fracture * Typical for Si: Cleave along <110> for straight edges
- Process Control: Inspect cleaved edge with optical microscope or SEM for chipping/quality. Adjust indent force for material thickness.
- Notes: Use protective tape if needed to reduce chipping. Practice on test pieces. Clean stage and tools after use.