Laurell Spinner

About

Laurell Resist Spinners in Resist Fume Hood (Advanced Photo Bay)

Process: These are high-precision programmable spinners used for uniform coating of photoresists, polymers, and thin films on substrates. They provide excellent thickness control through adjustable spin speed, acceleration, and time, with vacuum chuck hold-down for flatness.

Hardware: Laurell spinner with vacuum chuck for wafer/piece hold-down. Digital controller for multi-step recipes (speed, ramp, time). Lid with safety interlock. Solvent-resistant bowl. Two units available (left and right) in the resist fume hood for parallel processing or dedicated resists.

Key Features:

• Programmable multi-step spin recipes
• Vacuum chuck for secure hold
• Precise speed control (typically 100–8000 rpm)
• Acceleration/deceleration ramps
• Safety lid interlock

Applications:

• Spin-coating of positive/negative photoresists (AZ, SPR, ma-N, etc.)
• Coating of thick resists (SU-8, KMPR)
• Application of adhesion promoters (HMDS, AP)
• Spin-on dielectrics or planarization layers
• Uniform thin-film polymer deposition

Usage: Place substrate on chuck, apply resist (center dispense or dynamic), close lid, select/load recipe or manual parameters, start spin. Collect excess resist waste, rinse chuck if needed, clean bowl after use. Use in fume hood only.

Detailed Specifications

• Model: Laurell (standard resist spinner)
• Location: Resist Fume Hood – Advanced Photo Bay (two units: left & right)
• Chuck: Vacuum hold-down
• Speed range: Typically 100–8000 rpm (confirm on each unit)
• Features: Programmable recipes, precise ramps, safety interlock, solvent-resistant
• Restrictions: Use only in resist fume hood; avoid strong acids/bases; clean chuck after each use
• Other: Essential for lithography and thin-film coating workflows

Documentation

• SOP – Laurell Spinner
• Training required – contact lab staff (Chandan Ramakrishnaiah or Shivakumar Bhaskaran)

Recipes & Data

• Standard Spin Recipes: Common settings include:

 * Thin photoresist (1–2 µm): 3000–5000 rpm, 30–60 s
 * Thick SU-8: 1000–3000 rpm, 30–90 s (multi-step ramp)
 * HMDS primer: 2000–4000 rpm, 20–40 s
 * Spin-on glass/dielectric: 2000–4000 rpm, 30–60 s

• Process Control: Measure thickness post-bake (ellipsometer, profilometer, or Filmetrics). Check uniformity visually or with microscope. Calibrate spin speed if needed.
• Notes: Use center dispense for small volumes; dynamic dispense for thicker films. Avoid bubbles in resist. Clean chuck and bowl thoroughly between users. Dispose of waste per lab guidelines.