Narco vacuum oven
About
Process: This is a classic vacuum oven used for thermal processing under reduced pressure. It facilitates drying, solvent removal, degassing, and low-to-moderate temperature baking while minimizing oxidation, moisture re-adsorption, or bubble formation in sensitive materials.
Hardware: Vacuum-tight chamber (typically stainless steel or aluminum) with heated shelves or base plate. Manual vacuum valve and gauge. Temperature controller for stable setpoints. Likely includes a mechanical roughing pump connection (external or built-in). Observation window and internal lighting for monitoring samples during operation.
Atmosphere:
- Vacuum (rough vacuum to low mTorr range, depending on pump and seals)
- Optional N₂ backfill or purge (if equipped; confirm on tool)
- No reactive or specialty gases standard (use RTA or other tools for forming gas/O₂/forming gas anneals)
Applications:
- Degassing and outgassing of photoresists, polymers, or adhesives before lithography or deposition
- Vacuum baking of resists (e.g., post-coat or hard bake under vacuum)
- Drying wafers after wet processing or solvent rinse
- Solvent evaporation from thick films or delicate structures
- Low-pressure curing of epoxies, polyimides, or spin-on materials
- Vacuum-assisted thermal treatment for small samples
Usage: Load samples, close and seal door, pump down to target vacuum, set temperature and time, run process. Monitor pressure and temperature. Cool under vacuum or with controlled backfill (N₂ if available) before venting. Follow SOP for pump-down, venting, and chamber maintenance to avoid contamination.
Detailed Specifications
- Model: Narco 5831 Vacuum Oven
- Location: Advanced Photo bay
- Substrate size: Flexible (small pieces, wafers up to ~4–6", trays – check chamber dimensions)
- Temperature range: Ambient to ~200–250°C (typical for legacy vacuum ovens; confirm exact max on tool label/controller)
- Vacuum capability: Rough vacuum (mechanical pump) to low mTorr range
- Features: Vacuum gauge, temperature controller, cleanroom-compatible materials, observation window
- Restrictions: Max temperature limited (not for >250–300°C processes); avoid corrosive/volatile materials that could damage seals, pump, or contaminate chamber
- Other: Legacy model – reliable for basic vacuum thermal processing in research environments
Documentation
- Training required – contact lab staff (Chandan Ramakrishnaiah or Shivakumar Bhaskaran)
- Check lab resources for any existing SOP or quick guide (if no dedicated file exists, consider creating one based on standard vacuum oven protocols)
Recipes & Data
- Standard Processes: Typical vacuum bakes include:
* Photoresist degas / soft bake: 90–120°C under vacuum (30–90 min) * Hard bake or curing: 120–200°C under vacuum * Outgassing before deposition: 100–150°C overnight or extended hold
- Process Control: Monitor chamber pressure stability and temperature uniformity. Inspect for residue or contamination post-use.
- Notes: Use slow venting (e.g., via needle valve or N₂ bleed) to prevent turbulence/particle disturbance. Clean chamber regularly per lab guidelines.
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