User contributions for Sevag

23 June 2026

• 11:5311:53, 23 June 2026 diff hist +851 Safety resources →Safety Data Sheets (SDSs) Tag: Visual edit
• 11:4111:41, 23 June 2026 diff hist +78 Safety resources →Safety Data Sheets (SDSs) Tag: Visual edit
• 11:3711:37, 23 June 2026 diff hist +78 N File:SDS A4 LPKF Shine 410.pdf 2025-11-18 08-06-25.pdf `Safety Data Sheet for LPKF Shine 410, used for PCB processing.` current
• 11:3511:35, 23 June 2026 diff hist +84 N File:SDS A4 LPKF Copper Plater 400.pdf 2025-11-17 14-12-20.pdf Safety Data Sheet for LPKF Copper Plater 400, used for PCB processing. current
• 11:3411:34, 23 June 2026 diff hist +78 N File:SDS A4 LPKF Cleaner 210.pdf 2025-11-17 14-11-30.pdf Safety Data Sheet for LPKF Cleaner 210, used for PCB processing. current
• 11:3311:33, 23 June 2026 diff hist +78 N File:SDS A4 LPKF Cleaner 110.pdf 2025-11-17 14-11-20.pdf Safety Data Sheet for LPKF Cleaner 110, used for PCB processing. current
• 11:3011:30, 23 June 2026 diff hist +80 N File:SDS A4 LPKF Activator 310.pdf 2025-11-17 14-09-15.pdf Safety Data Sheet for LPKF Activator 310, used for PCB processing. current
• 11:2811:28, 23 June 2026 diff hist +86 N File:SDS LPKF ProMask Component B USA-en 2,0.pdf Safety Data Sheet for LPKF ProMask Component B, used for PCB processing. current
• 11:2711:27, 23 June 2026 diff hist +86 N File:SDS LPKF ProMask Component A USA-en 1,0.pdf Safety Data Sheet for LPKF ProMask Component A, used for PCB processing. current
• 11:2611:26, 23 June 2026 diff hist +88 N File:SDS LPKF ProLegend Component B USA-en 2,0.pdf Safety Data Sheet for LPKF ProLegend Component B, used for PCB processing. current
• 11:2411:24, 23 June 2026 diff hist +88 N File:SDS LPKF ProLegend Component A USA-en 1,0.pdf Safety Data Sheet for LPKF ProLegend Component A, used for PCB processing. current
• 11:2011:20, 23 June 2026 diff hist +76 N File:SDS LPKF Developer USA-en 1,0.pdf Safety Data Sheet for LPKF Developer, used for PCB processing. current
• 11:1811:18, 23 June 2026 diff hist +88 N File:LPKF Dispense Solder Paste USA-en 1,0.pdf Safety Data Sheet for LPKF Dispense Solder Paste, used for PCB processing. current

12 June 2026

• 15:4015:40, 12 June 2026 diff hist −8 Operations:LPKF ProtoPlace E4 Standard Operating Procedure No edit summary current Tag: Visual edit
• 15:3915:39, 12 June 2026 diff hist 0 N File:Figure 3 vacuum system .png No edit summary current
• 15:3515:35, 12 June 2026 diff hist −22 Operations:LPKF ProtoPlace E4 Standard Operating Procedure No edit summary Tag: Visual edit
• 15:3215:32, 12 June 2026 diff hist 0 N File:Figure 2 - Work area.png No edit summary current
• 15:2515:25, 12 June 2026 diff hist +11 Operations:LPKF ProtoPlace E4 Standard Operating Procedure No edit summary Tag: Visual edit
• 15:2215:22, 12 June 2026 diff hist 0 N File:Figure 1 LPKF Protoplace E4 Main Parts .png No edit summary current
• 15:1815:18, 12 June 2026 diff hist 0 File:Figure 1 LPKF ProtoPlace E4 .png Sevag reverted File:Figure 1 LPKF ProtoPlace E4 .png to an old version current
• 15:1715:17, 12 June 2026 diff hist 0 File:Figure 1 LPKF ProtoPlace E4 .png Sevag reverted File:Figure 1 LPKF ProtoPlace E4 .png to an old version
• 15:1215:12, 12 June 2026 diff hist 0 File:Figure 1 LPKF ProtoPlace E4 .png Sevag uploaded a new version of File:Figure 1 LPKF ProtoPlace E4 .png
• 15:0915:09, 12 June 2026 diff hist 0 File:Figure 1 LPKF ProtoPlace E4 .png Sevag uploaded a new version of File:Figure 1 LPKF ProtoPlace E4 .png
• 11:4511:45, 12 June 2026 diff hist +1,380 Operations:Puhui T-937 Reflow Oven Standard Operating Procedure No edit summary current Tag: Visual edit
• 11:3811:38, 12 June 2026 diff hist +5,956 Operations:Puhui T-937 Reflow Oven Standard Operating Procedure No edit summary Tag: Visual edit
• 11:1011:10, 12 June 2026 diff hist +68 N File:Figure 5 - Side Power Switch and Power Connection.png No edit summary current
• 11:0011:00, 12 June 2026 diff hist 0 File:Figure 3 - Open drawer and PCB tray area.png Sevag uploaded a new version of File:Figure 3 - Open drawer and PCB tray area.png current
• 10:5910:59, 12 June 2026 diff hist 0 File:Figure 3 - Open drawer and PCB tray area.png Sevag uploaded a new version of File:Figure 3 - Open drawer and PCB tray area.png
• 10:5810:58, 12 June 2026 diff hist +634 Operations:Puhui T-937 Reflow Oven Standard Operating Procedure No edit summary Tag: Visual edit
• 10:5310:53, 12 June 2026 diff hist 0 File:Figure 4 - back image of the T-937 oven reflow.png Sevag uploaded a new version of File:Figure 4 - back image of the T-937 oven reflow.png current
• 10:4810:48, 12 June 2026 diff hist 0 N File:Screenshot 2026-06-12 at 10.39.34 AM.png No edit summary current
• 10:4310:43, 12 June 2026 diff hist +72 N File:Figure 4 - back image of the T-937 oven reflow.png No edit summary
• 10:3310:33, 12 June 2026 diff hist +68 N File:Figure 3 - Open drawer and PCB tray area.png No edit summary
• 10:2110:21, 12 June 2026 diff hist +13 File:Figure 1 - T-937 control panel.png No edit summary current Tag: Visual edit
• 10:1910:19, 12 June 2026 diff hist +56 N File:Figure 1 - T-937 control panel.png No edit summary
• 10:0710:07, 12 June 2026 diff hist +6 Operations:Puhui T-937 Reflow Oven Standard Operating Procedure No edit summary Tag: Visual edit

11 June 2026

• 16:3416:34, 11 June 2026 diff hist +1,053 N Operations:Puhui T-937 Reflow Oven Standard Operating Procedure Created page with "<big>'''Overview'''</big> The <nowiki>'''</nowiki>Puhui T-937 Reflow Oven<nowiki>'''</nowiki> is an amateur use only table-top type of lead-free reflow oven for applying the solder surface-mount devices (SMD) to a printed circuit board after applying Solder Paste and the components. Using a programmed reflow profile, the Puhui T-937 Reflow Oven heats the PCB so that the solder paste melts, wets to the component pads and solidifies to form solder joints as it cools. Fi..." Tag: Visual edit
• 16:3116:31, 11 June 2026 diff hist +81 N File:Figure 1- Puhui T-937 Reflow Oven .jpg No edit summary current
• 15:3815:38, 11 June 2026 diff hist +2 Operations:LPKF ProtoPlace E4 Standard Operating Procedure No edit summary Tags: Manual revert Visual edit
• 15:3615:36, 11 June 2026 diff hist −2 Operations:LPKF ProtoPlace E4 Standard Operating Procedure No edit summary Tag: Visual edit
• 15:3415:34, 11 June 2026 diff hist −6 Operations:LPKF ProtoPlace E4 Standard Operating Procedure No edit summary Tag: Visual edit
• 15:0115:01, 11 June 2026 diff hist +8 Operations:LPKF ProtoPlace E4 Standard Operating Procedure No edit summary Tag: Visual edit
• 15:0015:00, 11 June 2026 diff hist −175 m Operations:LPKF ProtoPlace E4 Standard Operating Procedure No edit summary Tag: Visual edit
• 14:5914:59, 11 June 2026 diff hist +167 m Operations:LPKF ProtoPlace E4 Standard Operating Procedure No edit summary Tag: Visual edit
• 14:5614:56, 11 June 2026 diff hist +10 m Operations:LPKF ProtoPlace E4 Standard Operating Procedure No edit summary Tag: Visual edit
• 14:5514:55, 11 June 2026 diff hist +9,317 Operations:LPKF ProtoPlace E4 Standard Operating Procedure No edit summary Tag: Visual edit
• 13:5913:59, 11 June 2026 diff hist +84 N File:Figure 4 - ProtoPlace E4 placement accessories.png No edit summary current
• 13:5313:53, 11 June 2026 diff hist +10 File:Vacuum and control connections.png No edit summary current Tag: Visual edit
• 13:4413:44, 11 June 2026 diff hist +53 N File:Vacuum and control connections.png No edit summary
• 11:5611:56, 11 June 2026 diff hist +1,425 N Operations:LPKF ProtoPlace E4 Standard Operating Procedure Created page with "'''<big>Overview</big>''' The <nowiki>'''</nowiki>LPKF ProtoPlace E4<nowiki>'''</nowiki> is a hand-operated device designed to position SMDs accurately onto already prepared printed circuit boards. The <nowiki>'''</nowiki>ProtoPlace E4<nowiki>'''</nowiki> uses vacuum needles on the placement/marking head to assist in accurately picking up, locating and dropping SMDs from either loose component trays or tape feeders onto solder-pasted pads on PCBs. The <nowiki>'''</nowi..." Tag: Visual edit