Anneal & Furnace
| Tool
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Location
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Substrate size
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Gases
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Features
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Links
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Deposition bay 1
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Small pieces, 2″, 3″, 4″, 5″, 6″ wafer capability
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2%H2 in N2, N2, O2, Ar
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- Model: Allwin AW-610T
- Programmable, 10°C to 120°C per second.
- ERP Pyrometer 450-1250°C with ±1°C
- Thermocouple 100-800°C with ±0.5°C accuracy & rapid response
- Temperature repeatability: ±0.5°C or better at 1150°C wafer-to-wafer
- Temperature uniformity: ±5°C across a 6″ (150 mm) wafer at 1150°C.
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SOP
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Advanced Photo bay
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SOP
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Advanced Photo bay
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- Model: Blue M 0V-12A
- Temp range: up to 260C
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SOP
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Advanced Photo bay
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- Model: Blue M 0V-8A
- Temp range: up to 260C
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SOP
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Advanced Photo bay
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- Model: Narco 5831 Vacuum Oven
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Deposition
CVD (chemical vapor deposition)
| Tool
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Location
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Substrate size
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Deposition films
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Gases
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Features
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Links
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Deposition bay 1
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up to 6" wafer
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SiO2, Si3N4, SiNO
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2% SiH4/N2, NH3, N2O, N2, He, CF4
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- PlasmaPro System 100
- Electrode specs: 240mm diameter, up to 400°C
- Load lock
- No wafer clamping, fixed height
- RF power 300W
- LF power 500W
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SOP
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Deposition bay 1
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up to 4" diameter or small pieces
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MgO, Al2O3, Pt, Ru, HfO2, ZrO2, TiO2
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N2 as a carrier gas
O2 or O3 as film precursor
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- Savannah S200
- Reactor temperature: 150°C for most recipes, up to 270°C
- Ozone generator can replace O2 with O3
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SOP
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PVD (physical vapor deposition)
| Tool
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Location
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Substrate size
(up to diameter)
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# of pockets
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E-beam voltage
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Deposition materials
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Gases
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Features
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Links
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Deposition bay 1
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6"
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4
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10kV
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Ti, Al, Al2O3
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Ar, 5% O2 in Ar
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- variable angle stage
- substrate rotation
- substrate heater
- ion mill for substrate cleaning
- load lock
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SOP
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Deposition bay 2
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6"
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6 @ 15cc
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10kV
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Ti, Au, Pt, Pd, Cr, Ni and Ag
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- Sweep controller
- motor-driven deposition shield
- 8kW heater array
- Lift-off fixturing
- substrate rotation
- substrate dome for twenty-two 100mm back loaded wafers
- Inficon IC/6 for thickness control
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SOP
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Deposition bay 1
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6"
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4
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5kV
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Ti, Au, Pt, Pd, Cr, Ni, and Ag. Other materials available upon request.
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- substrate rotation
- source to substrate distance is approx. 15″ (381mm)
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Deposition bay 1
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Not in service.
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SOP
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Substrate size
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# of sources
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Sputter power
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Deposition bay 1
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6"
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- DC sputter power 500 W
- RF sputter power 300 W
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Au, Pt, Ti, Al, W, Mo, Cu, SiO2, Al2O3, and ITO. Other materials available upon request.
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Ar, O2
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- Target size: 2"
- Substrate rotation
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SOP
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Dry Etching & Plasma Cleaning
See also Dry etching recipes.
Etchers
| Tool
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Location
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Substrate
size
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Allowed
materials
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Disallowed
materials
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Gases
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Table temperature
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Features
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Links
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Etch bay 1
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4" wafer clamp, smaller pieces may go onto carrier wafers
2″, 3″, 4″, 6″, 8″ wafers possible
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Si, SiO2, SiN, Parylene, polyimide, LiNbO3, BCB
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No exposed metals (except Cr)
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Ar, O2, CF4, CHF3, SF6, C4F8
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20C
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- Model: Oxford System 100 Deep reactive-ion etcher
- Etch deep Si with Bosch process
- ICP power (max) 3000W
- Table RF power (max) 300W
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Etch bay 1
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- Oxford Deep reactive-ion etcher and atomic-layer etcher.
- This new tool is currently being commissioned
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Etch bay 1
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4" wafer clamp, smaller pieces may go onto carrier wafers
2″, 3″, 4″, 6″, 8″ wafers possible
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InP, InAs, GaN, AlGaAs, GaAs, InGaAsP, ITO, Si, SiC, MoS2, WSe, Graphene
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No exposed metals (except Cr)
No deep etching polymers (>1 µm)
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Ar, O2, SF6, CH4, H2, Cl2, BCl3, SiCl4
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-120 to 200C
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- Model: Oxford PlasmaPro 100 Cobra III-V etcher
- Etch III-V materials
- Cryo cooling
- Helium backside cooling
- ICP power (max) 1500W
- Table RF power (max) 1500W
- Optical endpoint detection: Horiba Jobin Yvon LEM G50
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Etch bay 1
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Up to 200 mm wafers
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Si, SiO2, Si3N4
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No exposed metals (except Cr)
No deep etching polymers (>1 µm)
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Ar, O2, CF4, CHF3, SF6
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20C
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- Model: Oxford PlasmaPro 80 reactive ion etcher
- Etch dielectrics
- Table RF power (max) 300W
- Optical endpoint detection: Horiba Jobin Yvon LEM G50
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Deposition bay 1
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Up to 6" wafers
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Si
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None
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Crystal XeF2 source
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20C
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- Etch Si quickly and isotropically with high selectivity
- Custom built by the Armani group
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Plasma cleaning / ashing
| Tool
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Location
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Substrate size
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Allowed materials
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Gases
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Features
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Links
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Advanced Photo Bay
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200 mm pieces or wafers
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Photoresist, graphene, CNT
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O2
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SOP
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Advanced Photo Bay
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- Model: Tegal Plasma 915
- Tool is currently not in operation
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Advanced Photo Bay
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200mm pieces or wafers
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O2
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- Model: Yield Engineering System YES-CV200RFS
- 1000W table RF power
- Heat up to 250C
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Quickstart
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Lithography
E-beam and laser
| Tool
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Location
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Substrate size
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Exposure
resolution
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Features
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Links
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Ebeam Bay
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4" wafer, or small pieces up to 2"
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<8nm
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- Model: EBPG5150
- Thermal Field Emission 50kV and 100kV
- Beam current 350nA
- Pattern Generator 125 MHZ Genlsys – Beamer
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SOP
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Metrology Bay
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- Min substrate/mask size 5x5mm
- Max substrate/mask size 9"x9"
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300nm
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- Model: Heidelberg DWL 66+ (Direct Write Laser)
- Front and backside alignment
- Exposure wavelength: Grayscale and advanced grayscale exposure 405nm laser (“h-line” photoresists)
- Write modes (trading off high speed and high resolution)
- High resolution (min feature size 0.3um)
- Mode IV: min size 2um
- Mode V: min size 4um
- Alignment modes: Manual, semi-automatic, and fully automatic alignment
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SOP
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UV mask aligners
| Tool
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Location
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Substrate
size
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Mask
size
|
Exposure
resolution
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Features
|
Links
|
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Advanced Photo bay
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Pieces up to 3”
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3” and 4”
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0.8um
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- Backside alignment
- Exposure modes Soft, Hard, and vacuum contacts
- Exposure wavelength UV 400, 350-450 nm
- Exposure source 350 W Hg Arc lamp
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SOP
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Photo bay
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Pieces up to 3”
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3” and 4”
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0.8um
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- Exposure modes Soft, Hard, and vacuum contacts
- Exposure wavelength UV 400, 350-450 nm
- Exposure source 350 W Hg Arc lamp
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SOP
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Photo bay
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Pieces up to 2"
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3", 4", and 5"
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0.8um
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- Exposure wavelength UV 400, 350 – 450nm
- Eyepieces 10x, objectives 5x, 10x, 20x
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SOP
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Advanced Photo Bay
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0.8um
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- Backside alignment
- Exposure wavelength UV400 350 – 450 nm
- Exposure source 450W LED
- Digital camera objectives 5x, 10x
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SOP
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Metrology
Assorted metrology
| Tool
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Location
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Features
|
Links
|
|
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Metrology bay
|
- Model: Signatone 4-point probe
- SP4 probe
- Readout with HP 34401A multimeter
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Metrology bay
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- Model: Bruker DektakXT profilometer
- Scan Length Range 55mm (2in)
- 150mm (6in) with scan stitching capability Data Points Per Scan 120,000 maximum
- Max. Sample Thickness 50mm (1.95in)
- Step Height Repeatability <5Å, 1sigma on 0.1μm step
- Vertical Range 1mm (0.039in.)
- Vertical Resolution 1Å max. (@ 6.55μm range)10 Å @ 65.5 μm; 80 Å @ 524μm;
- 150 Å @ 1mm 3D capability
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SOP
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Photo bay
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- Thin film thickness measurement
- Laser wavelengths 4050, 6328, 8300 Angstroms
- Wafer mapping Yes
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SOP
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Photo bay
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Thin film thickness measurement
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SOP
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Microscopes
| Tool
|
Location
|
Features
|
Links
|
|
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Metrology bay
|
- Model: Phenom ProX G6 Desktop Scanning Electron Microscope
- Acc Voltage 5 – 15kV
- Resolution <10nm (for BSED)
- Magnification 80-150,000x
- Electron or optical imaging modes
- Sample Size – up to 32mm
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Photo bay
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- Brightfield & Darkfield Polarizer/Analyzer
- Halogen Lamp 5x, 10x, 20x, 50x, 100x
- Camera – 5.9 MP resolution
- USB output/WIFI for exporting images
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SOP
|
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Photo bay
|
- Zeiss 47 30 12 9902 binocular microscope head
- MSA-001 linear encoder
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Advanced photo bay
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Advanced photo bay
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- Dyna Lite 150 light source
- Olympus UC30 camera
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Advanced photo bay
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- Dyna Lite 150 light source
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Packaging & Mechanical Tooling
Wafer and die processing
| Tool
|
Location
|
Substrate size
|
Features
|
Links
|
|
|
Etch bay 2
|
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- Model: F&S Bondtec 53BDA Deep-access & Ball-Wedge bonder
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Common chase
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up to 8" or 250x250 mm
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- Model: DISCO Corp. DAD3350 Dicing Saw
- 1.8 kW spindle
- X-axis Cutting range 260 mm
- Cutting speed mm/s 0.1 ～ 600
- Y-axis Cutting range 260 mm
- Index step: 0.0001 mm Z-axis
- Max. stroke: 32.2 mm
- Moving resolution: 0.00005 mm
- Repeatability accuracy: 0.001 mm
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Common chase
|
up to 1" diameter
|
- EQ Unipol-300 Mini (3") Automatic Grinder/ Polisher
- 20nm, 50nm, 0.25um, 1um, 5um, 10um polishing slurries/pastes available
- Smooth polishing pads and sanding pads from 60-3000 grit available
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Photo bay
|
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- LatticeAx 420 Cleaving System
- 2-axis linear stage
- Digital camera
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Photo bay
|
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- Model: LatticeGear FlipScribe
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Advanced photo bay
|
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- Model: Gramatech GVS2600R Vacuum Sealer
- 36" max sealing width
- N2 purge bags before sealing
- Foot lever operation
- Automated purge/vacuum/heat-seal/cool sequence
|
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PCB Processing
PCB processing
| Tool
|
Location
|
Features
|
Links
|
|
|
Common chase
|
- Model: LPKF ProtoMat S103
- PCB milling, through hole drilling, contour routing, solder dispensing
- CircuitPro software available for design work
- Accepts design file Gerber export from various CAD softwares
- Mechanical resolution 0.5um
- Max PCB size: A4
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Common chase
|
- Model: LPKF Contac S4
- Multistep clean and plate process
- Through-hole copper electroplating
- Not yet in use
|
Operation manual
|
Wet Process
Solvent fume hood (located in Metrology bay)
|
|
Tool
|
Description
|
Links
|
|
Heated ultrasonic bath
|
|
SOP
|
| Torrey Pines hot plate
|
Model: Torrey Pines HS70
|
| Solvent drains
|
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| N2 sprayers
|
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Acid fume hood left-side (located in Etch bay)
|
|
Tool
|
Description
|
Links
|
| This fume hood is the only fume hood where the Piranha and Nanostrip chemicals may be used.
|
|
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Heated bath
|
Model: Imtec Accubath
|
SOP
|
| Quick-dump-rinse tank (QDR)
|
|
| DI water tap
|
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| N2 gun
|
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Acid fume hood right-side (located in Etch bay)
|
|
Tool
|
Description
|
Links
|
| Piranha and Nanostrip chemicals are NOT allowed in this fume hood.
|
|
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Heated bath
|
Model: Imtec Accubath
|
SOP
|
| Torrey Pines hot plate left
|
Model: Torrey Pines HS70
|
| Torrey Pines hot plate right
|
| Quick-dump-rinse tank (QDR)
|
|
| DI water tap
|
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| N2 sprayer
|
|
Resist fume hood (located in Advanced Photo bay)
|
|
Tool
|
Description
|
Links
|
|
Spinner left
|
Laurell resist spinner
|
SOP
|
| Spinner right
|
| Bake plate 1
|
Apogee bake plate
|
SOP
|
| Bake plate 2
|
| Bake plate 3
|
| Bake plate 4
|
Base and developer fume hood left-side (located in Advanced Photo bay)
|
|
Tool
|
Description
|
Links
|
|
Heated bath
|
Model: Imtec Accubath
|
SOP
|
| Torrey Pines hot plate
|
Model: Torrey Pines HS70
|
| Quick-dump-rinse tank (QDR)
|
|
| DI water tap
|
|
| N2 sprayer
|
|
Base and developer fume hood right-side (located in Advanced Photo bay)
|
|
Tool
|
Description
|
Links
|
|
Heated bath
|
Model: Imtec Accubath
|
SOP
|
| Torrey Pines hot plate
|
Model: Torrey Pines HS70
|
| Quick-dump-rinse tank (QDR)
|
|
| DI water tap
|
|
| N2 sprayer
|
|
E-beam resist fume hood (located in Photo bay)
|
|
Tool
|
Description
|
Links
|
|
Headway spinner left
|
- Model: Headway Research CB15
- Controller model: Headway Research PWM50
|
SOP
|
| Headway spinner right
|
| Apogee hot plate left
|
|
SOP
|
| Apogee hot plate right
|
|
| Ultrasonic heated bath
|
|
|
| Torrey Pines hot plate/ stirrer
|
Model: Torrey Pines HS70
|
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