Electroglas 4080X

About

Electroglas Horizon 4080X Automated Wafer Prober (typical configuration with hot chuck and vision system)

Close-up of the gold-plated vacuum chuck and wafer stage area (hot chuck configuration)

Wafer loaded on the chuck, ready for vision alignment and probing (showing probe card interface area)

The Electroglas 4080X is an automated wafer prober used for wafer-level electrical testing. It accurately places a wafer under a probe card, uses vision for alignment, and steps across die sites so a tester can measure devices and record/sort results.

Typical systems are modular (handler + prober control + vision), often configured for 150 mm or 200 mm wafers, with common options such as a hot chuck (temperature probing) and GPIB/serial I/O for integration with parametric/test equipment.

DCM-2 (display/control), MHM (material handler), PCM (prober control), PRM-3

Configured for 200 mm (8") wafers with a hot chuck option

Key Features:

• Wafer size: 100 mm (4″) – 200 mm (8″) standard; ring-carrier adapters up to 300 mm available
• Chuck type & temp: Gold-plated vacuum chuck, ambient → +130 °C with TC-2000 controller (standard “hot chuck”)
• Indexing accuracy/repeatability: ±4 µm X-Y, Z-resolution 0.25 mil (6.3 µm)
• Throughput: ≤ 1.5 s die-to-die at 5 mm step; lot-level throughput ≈ 60 wph (150 mm)
• Vision/alignment: PRM-3 CCD camera, Self-Teach Auto Alignment (STAA), optional OCR & Probe-Mark-Inspection (PMI)
• Interfaces: GPIB-IEEE 488, RS-232, Ethernet, EG-Commander/ProberBench software

Applications:

• Wafer loading, precise alignment, and stepping for parametric/TEG testing
• Integration with external testers (e.g., Keithley S530) for automated electrical characterization
• Temperature-controlled probing for device performance at elevated temps
• High-accuracy die-to-die positioning in production monitoring flows

Detailed Specifications

Model: Electroglas 4080X Automated Wafer Prober Configured for 200 mm (8") wafers with a hot chuck option Location: [Specify lab bay if known, e.g., Test Bay]

Capability → Typical value/option

• Wafer size → 100 mm (4″) – 200 mm (8″) standard; ring-carrier adapters up to 300 mm available
• Chuck type & temp. → Gold-plated vacuum chuck, ambient → +130 °C with TC-2000 controller (standard “hot chuck”)
• Indexing accuracy/repeatability → ±4 µm X-Y, Z-resolution 0.25 mil (6.3 µm)
• Throughput → ≤ 1.5 s die-to-die at 5 mm step; lot-level throughput ≈ 60 wph (150 mm)
• Vision/alignment → PRM-3 CCD camera, Self-Teach Auto Alignment (STAA), optional OCR & Probe-Mark-Inspection (PMI)
• Interfaces → GPIB-IEEE 488, RS-232, Ethernet, EG-Commander/ProberBench software

Restrictions: Mechanical handling/alignment only (no electrical measurements); requires external tester Other: Modular design for cleanroom use; compatible with various probe cards

Documentation

Training required – contact lab staff (Chandan Ramakrishnaiah or Shivakumar Bhaskaran) Check lab resources for manuals (e.g., EG-Commander/ProberBench guides); no dedicated SOP listed – consider creating one

Recipes & Data

Standard Usage: Automated stepping for PCM/TEG lots; hot chuck for temp-dependent tests Process Control: Use consistent alignment routines; verify probe contact/scrub marks Notes: Interface with tester for full automation (GPIB/RS-232/Ethernet commands). Monitor chuck temp via TC-2000.