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Replaced content with "# USC Nanofabrication Facility – Tool List __Last extracted from provided equipment tables__ ## Thermal Processing / Annealing - RTA (Rapid Thermal Annealer) - Cascade Tek vacuum oven - Blue M furnace big - Blue M furnace little - Narco vacuum oven ## Deposition – CVD - Oxford PECVD - Veeco ALD ## Deposition – PVD (Evaporation) - Angstrom Evaporator - CHA Evaporator - KJL Evaporator - Temescal Metal e-beam evaporator *(not in service)* ## Deposition – PV..."
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# USC Nanofabrication Facility – Tool List
== Anneal & Furnace ==
{| class="wikitable"
|+
!Tool
!Location
!Substrate size
!Gases
!Features
!Links
|-
|<div id="RTA">[[#RTA|RTA (Rapid Thermal Annealer)]]</div>
[[File:RTA (rapid thermal annealer).jpg|frameless|314x314px]]
|Deposition bay 1
|Small pieces, 2″, 3″, 4″, 5″, 6″ wafer capability
|2%H2 in N2, N2, O2, Ar
|
* Model: Allwin AW-610T
* Programmable, 10°C to 120°C per second.
* ERP Pyrometer 450-1250°C with ±1°C
* Thermocouple 100-800°C with ±0.5°C accuracy & rapid response
* Temperature repeatability: ±0.5°C or better at 1150°C wafer-to-wafer
* Temperature uniformity: ±5°C across a 6″ (150 mm) wafer at 1150°C.
|[[:File:RTA standard operation procedures.pdf|SOP]]
|-
|<div id="Cascade Tek vacuum oven">[[#Cascade Tek vacuum oven|Cascade Tek vacuum oven]]</div>
[[File:Cascade tek vacuum oven.jpg|frameless|200x200px]]
|Advanced Photo bay
|
|
|
* Model: Cascade TEK TVO-2
|[[:File:Cascade TEK TVO-2 SOP v1.pdf|SOP]]
|-
|<div id="Blue M furnace big">[[#Blue M furnace big|Blue M furnace big]]</div>
[[File:Blue M oven big.jpg|frameless|177x177px]]
|Advanced Photo bay
|
|
|
* Model: Blue M 0V-12A
* Temp range: up to 260C
|[[:File:Blue M OV-12A Drying Oven SOP v1.pdf|SOP]]
|-
||<div id="Blue M furnace little">[[#Blue M furnace little|Blue M furnace little]]</div>
[[File:Blue M oven little.jpg|frameless|185x185px]]
|Advanced Photo bay
|
|
|
* Model: Blue M 0V-8A
* Temp range: up to 260C
|[[:File:Blue M OV-8A Drying Oven SOP v1.pdf|SOP]]
|-
|<div id="Narco vacuum oven">[[#Narco vacuum oven|Narco vacuum oven]]</div>
[[File:Narco oven.jpg|frameless|174x174px]]
|Advanced Photo bay
|
|
|
* Model: Narco 5831 Vacuum Oven
|
|}


__Last extracted from provided equipment tables__
== Deposition ==
{| class="wikitable"
|+CVD (chemical vapor deposition)
!Tool
!Location
!Substrate size
!Deposition films
!Gases
!Features
!Links
|-
|<div id="Oxford PECVD">[[#Oxford PECVD|Oxford PECVD]]</div>
[[File:PECVD.jpg|frameless|200x200px]]
|Deposition bay 1
|up to 6" wafer
|SiO2, Si3N4, SiNO
|2% SiH4/N2, NH3, N2O, N2, He, CF4
|
* PlasmaPro System 100
* Electrode specs: 240mm diameter, up to 400°C
* Load lock
* No wafer clamping, fixed height
* RF power 300W
* LF power 500W
|[[:File:PECVD SOP v1.pdf|SOP]]
|-
|<div id="Veeco ALD">[[#Veeco ALD|Veeco ALD]]</div>
[[File:ALD.jpg|frameless|212x212px]]
|Deposition bay 1
|up to 4" diameter or small pieces
|MgO, Al2O3, Pt, Ru, HfO2, ZrO2, TiO2
|N2 as a carrier gas
O2 or O3 as film precursor
|
* Savannah S200
* Reactor temperature: 150°C for most recipes, up to 270°C
* Ozone generator can replace O2 with O3
|[[:File:ALD Quick Start Guide - August 2023.pdf|SOP]]
|}
{| class="wikitable"
|+PVD (physical vapor deposition)
!Tool
!Location
!Substrate size
(up to diameter)
!# of pockets
!E-beam voltage
!Deposition materials
!Gases
!Features
!Links
|-
|<div id="Angstrom Evaporator">[[#Angstrom Evaporator|Angstrom Evaporator]]</div>
[[File:Angstrom Evaporator.jpg|frameless|200x200px]]
|Deposition bay 1
|6"
|4
|10kV
|Ti, Al, Al2O3
|Ar, 5% O2 in Ar
|
* variable angle stage
* substrate rotation
* substrate heater
* ion mill for substrate cleaning
* load lock
|[[:File:Angstrom Evaporator SOP v1.pdf|SOP]]
|-
|<div id="CHA Evaporator">[[#CHA Evaporator|CHA Evaporator]]</div>
[[File:CHA Evaporator.jpg|frameless|195x195px]]
|Deposition bay 2
|6"
|6 @ 15cc
|10kV
|Ti, Au, Pt, Pd, Cr, Ni and Ag
|
|
* Sweep controller
* motor-driven deposition shield
* 8kW heater array
* Lift-off fixturing
* substrate rotation
* substrate dome for twenty-two 100mm back loaded wafers
* Inficon IC/6 for thickness control
|[[:File:CHA Evaporator SOP v2.pdf|SOP]]
|-
|<div id="KJL Evaporator">[[#KJL Evaporator|KJL Evaporator]]</div>
[[File:KJL Evaporator.jpg|frameless|200x200px]]
|Deposition bay 1
|6"
|4
|5kV
|Ti, Au, Pt, Pd, Cr, Ni, and Ag. Other materials available upon request.
|
|
* substrate rotation
* source to substrate distance is approx. 15″ (381mm)
|
* [[:File:KJL Metal SOP v1.pdf|SOP]]
* [https://drive.google.com/file/d/1YhiAI7t0Oj1NVDgHsnbHGBm0qvsl0yjb/view?usp=sharing Training video]
|-
|<div id="Temescal Metal e-beam evaporator">[[#Temescal Metal e-beam evaporator|Temescal Metal e-beam evaporator]]</div>
|Deposition bay 1
|
|
|
|
|
|Not in service.
|[[:File:DEP-015 Temescal Ebeam Metal Evaporator 04-28-09.pdf|SOP]]
|-
|
!
!Substrate size
!# of sources
!Sputter power
|
|
|
|
|-
|<div id="KJL Sputter">[[#KJL Sputter|KJL Sputter]]</div>
[[File:KJL Sputter.jpg|frameless|200x200px]]
|Deposition bay 1
|6"
|
* 4 DC
* 1 RF/DC
|
* DC sputter power 500 W
* RF sputter power 300 W
|Au, Pt, Ti, Al, W, Mo, Cu, SiO2, Al2O3, and ITO. Other materials available upon request.
|Ar, O2
|
* Target size: 2"
* Substrate rotation
|[[:File:KJL Sputter SOP v2.pdf|SOP]]
|}


## Thermal Processing / Annealing
== Dry Etching & Plasma Cleaning ==
- RTA (Rapid Thermal Annealer)
See also [[Dry etching recipes|Dry etching recipes.]]
- Cascade Tek vacuum oven
{| class="wikitable"
- Blue M furnace big
|+Etchers
- Blue M furnace little
!Tool
- Narco vacuum oven
!Location
!Substrate
size
!Allowed
materials
!Disallowed
materials
!Gases
!Table temperature
!Features
!Links
|-
|<div id="Oxford DRIE">[[#Oxford DRIE|Oxford DRIE]]</div>
[[File:DRIE.jpg|frameless|200x200px]]
|Etch bay 1
|4" wafer clamp, smaller pieces may go onto carrier wafers
2″, 3″, 4″, 6″, 8″ wafers possible
|Si, SiO2, SiN, Parylene, polyimide, LiNbO3, BCB
|No exposed metals (except Cr)
|Ar, O2, CF4, CHF3, SF6, C4F8
|20C
|
* Model: Oxford System 100 Deep reactive-ion etcher
* Etch deep Si with Bosch process
* ICP power (max) 3000W
* Table RF power (max) 300W
|
* [[:File:DRIE SOP - August 2023.pdf|SOP]]
* [[:File:DRIE Quick Start Guide - August 2023.pdf|Quickstart guide]]
* [https://drive.google.com/file/d/1m-eROS6U5DX9oX8whYGcevRShoGtdpAr/view?usp=drive_link Load lock operation video with chamber open]
* [https://docs.google.com/spreadsheets/d/e/2PACX-1vRAOAaR5tTHyx3b0pJpRsf3p0oh_AjsmcLllQjLOq_5Uod0HPC2WB94mBHw6brxLaQqFUvY6Iu3jJ20/pubhtml?gid=0&single=true Recipes]
|-
|<div id="Oxford DRIE-ALE">[[#Oxford DRIE-ALE|Oxford DRIE-ALE]]</div>
[[File:DRIE-ALE.jpg|frameless|200x200px]]
|Etch bay 1
|
|
|
|
|
|
* Oxford Deep reactive-ion etcher and atomic-layer etcher.
* This new tool is currently being commissioned
|
|-
|<div id="Oxford III-V">[[#Oxford III-V|Oxford III-V]]</div>
[[File:III-V.jpg|frameless|200x200px]]
|Etch bay 1
|4" wafer clamp, smaller pieces may go onto carrier wafers
2″, 3″, 4″, 6″, 8″ wafers possible
|InP, InAs, GaN, AlGaAs, GaAs, InGaAsP, ITO, Si, SiC, MoS2, WSe, Graphene
|No exposed metals (except Cr)
No deep etching polymers (>1 µm)
|Ar, O2, SF6, CH4, H2, Cl2, BCl3, SiCl4
| -120 to 200C
|
* Model: Oxford PlasmaPro 100 Cobra III-V etcher
* Etch III-V materials
* Cryo cooling
* Helium backside cooling
* ICP power (max) 1500W
* Table RF power (max) 1500W
* Optical endpoint detection: Horiba Jobin Yvon LEM G50
|
* [[:File:III V Etcher SOP - August 2023.pdf|SOP]]
* [[:File:III V Quick Start Guide - August 2023.pdf|Quickstart guide]]
|-
|<div id="Oxford RIE">[[#Oxford RIE|Oxford RIE]]</div>
[[File:RIE.jpg|frameless|200x200px]]
|Etch bay 1
|Up to 200 mm wafers
|Si, SiO2, Si3N4
|No exposed metals (except Cr)
No deep etching polymers (>1 µm)
|Ar, O2, CF4, CHF3, SF6
|20C
|
* Model: Oxford PlasmaPro 80 reactive ion etcher
* Etch dielectrics
* Table RF power (max) 300W
* Optical endpoint detection: Horiba Jobin Yvon LEM G50
|
* [[:File:RIE 80 SOP - August 2023.pdf|SOP]]
* [[:File:RIE 80 Quick Start Guide - August 2023.pdf|Quickstart guide]]
* [https://drive.google.com/file/d/15cHZNcl4yK-OBauSIQ__ZOWv5xrtNU40/view?usp=sharing Training video]
* [Https://docs.google.com/spreadsheets/d/1cleuEcpL6Nnjj40jUlnfaEt4aXEZ23ReL1UCT6eQsUY/edit?gid=864539770#gid=864539770 Standard Recipe Calibration]
|-
|<div id="XeF2 etcher">[[#XeF2 etcher|XeF2 etcher]]</div>
[[File:XeF2.jpg|frameless|200x200px]]
|Deposition bay 1
|Up to 6" wafers
|Si
|None
|Crystal XeF2 source
|20C
|
* Etch Si quickly and isotropically with high selectivity
* Custom built by the Armani group
|
* [[:File:XeF2 SOP - June 2023.pdf|SOP]]
* [[:File:XeF2 Quick Start Guide - May 2023.pdf|Quickstart guide]]
|}
{| class="wikitable"
|+Plasma cleaning / ashing
!Tool
!Location
!Substrate size
!Allowed materials
!Gases
!Features
!Links
|-
|<div id="Tegal O2 Plasma Asher">[[#Tegal O2 Plasma Asher|Tegal O2 Plasma Asher]]</div>
[[File:Tegal o2 plasma.jpg|frameless|163x163px]]
|Advanced Photo Bay
|200 mm pieces or wafers
|Photoresist, graphene, CNT
|O2
|
* Model: Tegal CU90??
|[[:File:Tegal Oxygen Plasma Asher.pdf|SOP]]
|-
|<div id="Tegal Plasma">[[#Tegal Plasma|Tegal Plasma]]</div>
[[File:Tegal plasma cleaner.jpg|frameless|178x178px]]
|Advanced Photo Bay
|
|
|
|
* Model: Tegal Plasma 915
* Tool is currently not in operation
|
|-
|<div id="YES O2 Plasma">[[#YES O2 Plasma|YES O2 Plasma]]</div>
[[File:Yes o2 plasma.jpg|frameless|238x238px]]
|Advanced Photo Bay
|200mm pieces or wafers
|
|O2
|
* Model: Yield Engineering System YES-CV200RFS
* 1000W table RF power
* Heat up to 250C
|[[:File:YES Quick Start Guide - August 2023.pdf|Quickstart]]
|}


## Deposition – CVD
== Lithography ==
- Oxford PECVD
{| class="wikitable"
- Veeco ALD
|+E-beam and laser
!Tool
!Location
!Substrate size
!Exposure
resolution
!Features
!Links
|-
|<div id="Raith EBL">[[#Raith EBL|Raith EBL]]</div>
[[File:Raith EBPG5150.jpg|frameless|200x200px]]
|Ebeam Bay
|4" wafer, or small pieces up to 2"
|<8nm
|
* Model: EBPG5150
* Thermal Field Emission 50kV and 100kV
* Beam current 350nA
* Pattern Generator 125 MHZ Genlsys – Beamer
|[[:File:Raith EBPG 5150 SOP.pdf|SOP]]
|-
|<div id="Heidelberg DWL">[[#Heidelberg DWL|Heidelberg DWL]]</div>
[[File:Heidelberg DWL 66+.jpg|frameless|200x200px]]
|Metrology Bay
|
* Min substrate/mask size 5x5mm
* Max substrate/mask size 9"x9"
|300nm
|
* Model: Heidelberg DWL 66+ (Direct Write Laser)
* Front and backside alignment
* Exposure wavelength: Grayscale and advanced grayscale exposure 405nm laser (“h-line” photoresists)
* Write modes (trading off high speed and high resolution)
** High resolution (min feature size 0.3um)
** Mode IV: min size 2um
** Mode V: min size 4um
* Alignment modes: Manual, semi-automatic, and fully automatic alignment
|[[:File:Heidelberg DWL 66 plus SOP.pdf|SOP]]
|}
{| class="wikitable"
|+UV mask aligners
!Tool
!Location
!Substrate
size
!Mask
size
!Exposure
resolution
!Features
!Links
|-
|<div id="Aligner A (MJB3)">[[#Aligner A (MJB3)|Aligner A (MJB3)]]</div>
[[File:MJB3 A.jpg|frameless|200x200px]]
|Advanced Photo bay
|Pieces up to 3”
|3” and 4”
|0.8um
|
* Backside alignment
* Exposure modes Soft, Hard, and vacuum contacts
* Exposure wavelength UV 400, 350-450 nm
* Exposure source 350 W Hg Arc lamp
|[[:File:Mask Aligner MJB3 SOP.pdf|SOP]]
|-
|<div id="Aligner B (MJB3)">[[#Aligner B (MJB3)|Aligner B (MJB3)]]</div>
[[File:MJB3 B.jpg|frameless|200x200px]]
|Photo bay
|Pieces up to 3”
|3” and 4”
|0.8um
|
* Exposure modes Soft, Hard, and vacuum contacts
* Exposure wavelength UV 400, 350-450 nm
* Exposure source 350 W Hg Arc lamp
|[[:File:Mask Aligner MJB3 SOP.pdf|SOP]]
|-
|<div id="Aligner C (MJB4)">[[#Aligner C (MJB4)|Aligner C (MJB4)]]</div>
[[File:MJB4 C.jpg|frameless|150x150px]]
|Photo bay
|Pieces up to 2"
|3", 4", and 5"
|0.8um
|
* Exposure wavelength UV 400, 350 – 450nm
* Eyepieces 10x, objectives 5x, 10x, 20x
|[[:File:Mask Aligner MJB4 SOP.pdf|SOP]]
|-
|<div id="Aligner D (MA BA6 Gen4)">[[#Aligner D (MA BA6 Gen4)|Aligner D (MA BA6 Gen4)]]</div>
[[File:MABA6 D.jpg|frameless|200x200px]]
|Advanced Photo Bay
|
|
|0.8um
|
* Backside alignment
* Exposure wavelength UV400 350 – 450 nm
* Exposure source 450W LED
* Digital camera objectives 5x, 10x
|[[:File:Mask Aligner MABA6 SOP.pdf|SOP]]
|}


## Deposition – PVD (Evaporation)
== Metrology ==
- Angstrom Evaporator
{| class="wikitable"
- CHA Evaporator
|+Assorted metrology
- KJL Evaporator
!Tool
- Temescal Metal e-beam evaporator *(not in service)*
!Location
!Features
!Links
|-
|<div id="4-point Probe">[[#4-point Probe|4-point Probe]]</div>
[[File:4 point probe.jpg|frameless|200x200px]]
|Metrology bay
|
* Model: Signatone 4-point probe
* SP4 probe
* Readout with HP 34401A multimeter
|
* [[:File:Hp34401 multimeter for 4ptprobe manual.pdf|Multimeter SOP]]
|-
|<div id="Dektak profilometer">[[#Dektak profilometer|Dektak profilometer]]</div>
[[File:Dektak.jpg|frameless|200x200px]]
|Metrology bay
|
* Model: Bruker DektakXT profilometer
* Scan Length Range 55mm (2in)
* 150mm (6in) with scan stitching capability Data Points Per Scan 120,000 maximum
* Max. Sample Thickness 50mm (1.95in)
* Step Height Repeatability <5Å, 1sigma on 0.1μm step
* Vertical Range 1mm (0.039in.)
* Vertical Resolution 1Å max. (@ 6.55μm range)10 Å @ 65.5 μm; 80 Å @ 524μm;
* 150 Å @ 1mm 3D capability
|[[:File:Dektak XT SOP.pdf|SOP]]
|-
|<div id="Ellipsometer">[[#Ellipsometer|Ellipsometer]]</div>
[[File:Ellipsometer.jpg|frameless|200x200px]]
|Photo bay
|
* Thin film thickness measurement
* Laser wavelengths 4050, 6328, 8300 Angstroms
* Wafer mapping Yes
|[[SOP:Ellipsometer|SOP]]
|-
|<div id="Filmetrics F20">[[#Filmetrics F20|Filmetrics F20]]</div>
[[File:Filmetrics F20.jpg|frameless|233x233px]]
|Photo bay
|Thin film thickness measurement
|[[Filmetrics F20 Standard Operating Procedure|SOP]]
|}
{| class="wikitable"
|+Microscopes
!Tool
!Location
!Features
!Links
|-
|<div id="Desktop SEM">[[#Desktop SEM|Desktop SEM]]</div>
[[File:Phenom SEM.jpg|frameless|200x200px]]
|Metrology bay
|
* Model: Phenom ProX G6 Desktop Scanning Electron Microscope
* Acc Voltage 5 – 15kV
* Resolution <10nm (for BSED)  
* Magnification 80-150,000x
* Electron or optical imaging modes
* Sample Size – up to 32mm
|
* [[:File:SEM-033 Philips XL30.pdf|SOP]]
* [[:File:Phenom SEM operation procedures.pdf|Operation manual]]
|-
|<div id="Nikon LV 150 optical microscope">[[#Nikon LV 150 optical microscope|Nikon LV 150 optical microscope]]</div>
[[File:Nikon LV 150 microscope.jpg|frameless|200x200px]]
|Photo bay
|
* Brightfield & Darkfield Polarizer/Analyzer
* Halogen Lamp 5x, 10x, 20x, 50x, 100x
* Camera – 5.9 MP resolution
* USB output/WIFI for exporting images
|[[:File:Nikon Eclipse LV150N Microscope SOP v1.pdf|SOP]]
|-
|<div id="Max ERB optical microscope">[[#Max ERB optical microscope|Max ERB optical microscope]]</div>
[[File:Max ERB microscope.jpg|frameless|186x186px]]
|Photo bay
|
* Zeiss 47 30 12 9902 binocular microscope head
* MSA-001 linear encoder
|
|-
|<div id="Zeiss optical microscope">[[#Zeiss optical microscope|Zeiss optical microscope]]</div>
[[File:Zeiss microscope.jpg|frameless|200x200px]]
|Advanced photo bay
|
|
|-
|<div id="Nikon SMZ-10A optical microscope">[[#Nikon SMZ-10A optical microscope|Nikon SMZ-10A optical microscope]]</div>
[[File:Nikon smz-10a microscope.jpg|frameless|200x200px]]
|Advanced photo bay
|
* Dyna Lite 150 light source
* Olympus UC30 camera
|
|-
|<div id="Nikon optical microscope">[[#Nikon optical microscope|Nikon optical microscope]]</div>
[[File:Unknown Nikon optical microscope.jpg|frameless|200x200px]]
|Advanced photo bay
|
* Dyna Lite 150 light source
|
|}


## Deposition – PVD (Sputtering)
== Packaging & Mechanical Tooling ==
- KJL Sputter
{| class="wikitable"
|+Wafer and die processing
!Tool
!Location
!Substrate size
!Features
!Links
|-
|<div id="Ball & Wedge bonder">[[#Ball & Wedge bonder|Ball & Wedge bonder]]</div>
[[File:Fs bondtec wire bonder.jpg|frameless|200x200px]]
|Etch bay 2
|
|
* Model: F&S Bondtec 53BDA Deep-access & Ball-Wedge bonder
|
* [[:File:SOP-Wire-Bonder.pdf|SOP]]
* [[:File:Wire bonder 53XXBDA en-manual.pdf|Operation manual]]
|-
|<div id="Dicing Saw">[[#Dicing Saw|Dicing Saw]]</div>
[[File:Dicing saw.jpg|frameless|200x200px]]
|Common chase
|up to 8" or 250x250 mm
|
* Model: DISCO Corp. DAD3350 Dicing Saw
* 1.8 kW spindle
* X-axis Cutting range 260 mm
* Cutting speed mm/s 0.1 ～ 600
* Y-axis Cutting range 260 mm
* Index step: 0.0001 mm Z-axis
* Max. stroke: 32.2 mm
* Moving resolution: 0.00005 mm
* Repeatability accuracy: 0.001 mm
|
* [[:File:Disco Dicing Saw SOP v3.pdf|SOP]]
* [[:File:Dicing Saw Manual.pdf|Operation manual]]
* [https://drive.google.com/file/d/1yX8D712iCx9p6fb6fpUrM641zMq_xhoh/view?usp=sharing Training video part 1]
* [https://drive.google.com/file/d/1d6mJyI4XWhKVxlKeKhPMkS9pXmzbGAkv/view?usp=sharing Training video part 2]
* [https://drive.google.com/file/d/1SOrdsiE0oh6ZT0NZ7HBQ9P030tDoDxnm/view?usp=sharing Training video part 3]
|-
|<div id="Mini Polisher">[[#Mini Polisher|Mini Polisher]]</div>
[[File:Mini polisher with parts installed.jpg|frameless|200x200px]]
|Common chase
|up to 1" diameter
|
* EQ Unipol-300 Mini (3") Automatic Grinder/ Polisher
* 20nm, 50nm, 0.25um, 1um, 5um, 10um polishing slurries/pastes available
* Smooth polishing pads and sanding pads from 60-3000 grit available
|
* [[SOP:Mini Polisher|SOP]]
* [https://mtixtl.com/products/unipol-300 Manufacturer product page, including operation videos]
|-
|<div id="LatticeAx Cleaver">[[#LatticeAx Cleaver|LatticeAx Cleaver]]</div>
[[File:Latticeax cleaver.jpg|frameless|156x156px]]
|Photo bay
|
|
* LatticeAx 420 Cleaving System
* 2-axis linear stage
* Digital camera
|
* [[:File:LatticeAx 420 SOP v1.pdf|SOP]]
* [https://drive.google.com/file/d/1141aO-N5KNwdH-JWKg3Zsqe0k6bCeVLz/view?usp=drive_link Operation video]
* [[:File:LatticeAx 420 Manual.pdf|Operation manual]]
|-
|<div id="FlipScribe Cleaver">[[#FlipScribe Cleaver|FlipScribe Cleaver]]</div>
[[File:Flipscribe cleaver.jpg|frameless|208x208px]]
|Photo bay
|
|
* Model: LatticeGear FlipScribe
|
* [[:File:FlipScribe Manual.pdf|Operation manual]]
* [[:File:FlipScribe Quick Guide.pdf|Quickstart]]
|-
|<div id="Vacuum Bag Sealer">[[#Vacuum Bag Sealer|Vacuum Bag Sealer]]</div>
[[File:Gramatech vacuum bag sealer.jpg|frameless|209x209px]]
|Advanced photo bay
|
|
* Model: Gramatech GVS2600R Vacuum Sealer
* 36" max sealing width
* N2 purge bags before sealing
* Foot lever operation
* Automated purge/vacuum/heat-seal/cool sequence
|
|}


## Dry Etching
== PCB Processing ==
- Oxford DRIE
{| class="wikitable"
- Oxford DRIE-ALE
|+PCB processing
- Oxford III-V
!Tool
- Oxford RIE
!Location
- XeF₂ etcher
!Features
!Links
|-
|<div id="LPKF PCB mill">[[#LPKF PCB mill|LPKF PCB mill]]</div>
[[File:LPKF ProtoMat S103 PCB mill.jpg|frameless|200x200px]]
|Common chase
|
* Model: LPKF ProtoMat S103
* PCB milling, through hole drilling, contour routing, solder dispensing
* CircuitPro software available for design work
* Accepts design file Gerber export from various CAD softwares
* Mechanical resolution 0.5um
* Max PCB size: A4
|
* [[LPKF Standard Operating Procedure|SOP]]
* [[:File:2406-protomat-s43-serie-manual-.pdf|Operation manual]]
|-
|<div id="LPKF electroplater">[[#LPKF electroplater|LPKF electroplater]]</div>
[[File:LPKF Contac S4 electroplater.jpg|frameless|200x200px]]
|Common chase
|
* Model: LPKF Contac S4
* Multistep clean and plate process
* Through-hole copper electroplating
* Not yet in use. [[Contact Nanofab Staff|Contact Nanofab staff]] if interested and we can procure the chemical set.
|[[:File:3940-manual-contac-s4-v3-0-en.pdf|Operation manual]]
|}


## Plasma Cleaning / Ashing
== Wet Process ==
- Tegal O₂ Plasma Asher
{| class="wikitable"
- Tegal Plasma *(not in operation)*
|+Solvent fume hood (located in Metrology bay)
- YES O₂ Plasma
!
 
!Tool
## Lithography – Direct Write
!Description
- Raith EBL
!Links
- Heidelberg DWL
|-
 
| rowspan="4" |[[File:Fume hood solvent.jpg|frameless|500x500px]]
## Lithography – Mask Aligners
Model: Air Control, Inc CS-41-316LSS-8ft
- Aligner A (MJB3)
|Heated ultrasonic bath
- Aligner B (MJB3)
|
- Aligner C (MJB4)
| rowspan="4" |[[:File:Solvent Fumehoods SOP v1.pdf|SOP]]
- Aligner D (MA BA6 Gen4)
|-
 
|Torrey Pines hot plate
## Metrology
|Model: Torrey Pines HS70
- 4-point Probe
|-
- Dektak profilometer
|Solvent drains
- Ellipsometer
|
- Filmetrics F20
|-
 
|N2 sprayers
## Microscopy
|
- Desktop SEM
|}
- Nikon LV 150 optical microscope
{| class="wikitable"
- Max ERB optical microscope
|+Acid fume hood left-side (located in Etch bay)
- Zeiss optical microscope
!
- Nikon SMZ-10A optical microscope
!Tool
- Nikon optical microscope
!Description
 
!Links
## Packaging & Mechanical Processing
|-
- Ball & Wedge bonder
|This fume hood is the only fume hood where the Piranha and Nanostrip chemicals may be used.
- Dicing Saw
|
- Mini Polisher
|
- LatticeAx Cleaver
|
- FlipScribe Cleaver
|-
- Vacuum Bag Sealer
| rowspan="4" |[[File:Fume hood acid left.jpg|frameless|500x500px]]
 
Model: Air Control, Inc. CS-41-C-PVC-7ft
## PCB Processing
|Heated bath
- LPKF PCB mill
|Model: Imtec Accubath
- LPKF electroplater *(not yet in use)*
| rowspan="4" |[[:File:Etch Bay Fumehoods SOP v1.pdf|SOP]]
 
|-
## Wet Processing Fume Hoods
|Quick-dump-rinse tank (QDR)
### Solvent Fume Hood
|
- Solvent fume hood
|-
 
|DI water tap
### Acid Fume Hoods (Etch Bay)
|
- Acid fume hood left-side
|-
- Acid fume hood right-side
|N2 gun
 
|
### Resist & Developer Fume Hoods (Advanced Photo Bay)
|}
- Resist fume hood
{| class="wikitable"
- Base and developer fume hood left-side
|+Acid fume hood right-side (located in Etch bay)
- Base and developer fume hood right-side
!
 
!Tool
### E-beam Resist Fume Hood (Photo Bay)
!Description
- E-beam resist fume hood
!Links
|-
|Piranha and Nanostrip chemicals are NOT allowed in this fume hood.
|
|
|
|-
| rowspan="6" |[[File:Fume hood acid right.jpg|frameless|500x500px]]
Model: Air Control, Inc. CS-41-C-PVC-7ft
|Heated bath
|Model: Imtec Accubath
| rowspan="6" |[[:File:Etch Bay Fumehoods SOP v1.pdf|SOP]]
|-
|Torrey Pines hot plate left
| rowspan="2" |Model: Torrey Pines HS70
|-
|Torrey Pines hot plate right
|-
|Quick-dump-rinse tank (QDR)
|
|-
|DI water tap
|
|-
|N2 sprayer
|
|}
{| class="wikitable"
|+Resist fume hood (located in Advanced Photo bay)
!
!Tool
!Description
!Links
|-
| rowspan="6" |[[File:Fume hood resist.jpg|frameless|400x400px]]
Model: Air Control, Inc. CS-41-316-LSS-8ft
|Spinner left
| rowspan="2" |Laurell resist spinner
| rowspan="2" |[[:File:Laurell Spinner SOP v1.pdf|SOP]]
|-
|Spinner right
|-
|Bake plate 1
| rowspan="4" |Apogee bake plate
| rowspan="4" |[[:File:Apogee Hotplate SOP v1.pdf|SOP]]
|-
|Bake plate 2
|-
|Bake plate 3
|-
|Bake plate 4
|}
{| class="wikitable"
|+Base and developer fume hood left-side (located in Advanced Photo bay)
!
!Tool
!Description
!Links
|-
| rowspan="5" |[[File:Fume hood development left.jpg|frameless|500x500px]]
Model: Air Control, Inc. CS-41-C-PVC-6ft
|Heated bath
|Model: Imtec Accubath
| rowspan="5" |[[:File:Advanced Photobay Fumehoods SOP v1.pdf|SOP]]
|-
|Torrey Pines hot plate
|Model: Torrey Pines HS70
|-
|Quick-dump-rinse tank (QDR)
|
|-
|DI water tap
|
|-
|N2 sprayer
|
|}
{| class="wikitable"
|+Base and developer fume hood right-side (located in Advanced Photo bay)
!
!Tool
!Description
!Links
|-
| rowspan="5" |[[File:Fume hood development right.jpg|frameless|500x500px]]
Model: Air Control, Inc. CS-41-C-PVC-6ft
|Heated bath
|Model: Imtec Accubath
| rowspan="5" |[[:File:Advanced Photobay Fumehoods SOP v1.pdf|SOP]]
|-
|Torrey Pines hot plate
|Model: Torrey Pines HS70
|-
|Quick-dump-rinse tank (QDR)
|
|-
|DI water tap
|
|-
|N2 sprayer
|
|}
{| class="wikitable"
|+E-beam resist fume hood (located in Photo bay)
!
!Tool
!Description
!Links
|-
| rowspan="6" |[[File:Fume hood ebeam resist.jpg|frameless|500x500px]]
Model: Precision Air Technology CS-41-316LSS-8ft
|Headway spinner left
| rowspan="2" |
* Model: Headway Research CB15
* Controller model: Headway Research PWM50
| rowspan="2" |[[:File:Headway Spinner SOP v1.pdf|SOP]]
|-
|Headway spinner right
|-
|Apogee hot plate left
|
| rowspan="2" |[[:File:Apogee Hotplate SOP v1.pdf|SOP]]
|-
|Apogee hot plate right
|
|-
|Ultrasonic heated bath
|
|
|-
|Torrey Pines hot plate/ stirrer
|Model: Torrey Pines HS70
|
|}

Revision as of 14:39, 2 February 2026

Anneal & Furnace

Tool Location Substrate size Gases Features Links

Deposition bay 1 Small pieces, 2″, 3″, 4″, 5″, 6″ wafer capability 2%H2 in N2, N2, O2, Ar
  • Model: Allwin AW-610T
  • Programmable, 10°C to 120°C per second.
  • ERP Pyrometer 450-1250°C with ±1°C
  • Thermocouple 100-800°C with ±0.5°C accuracy & rapid response
  • Temperature repeatability: ±0.5°C or better at 1150°C wafer-to-wafer
  • Temperature uniformity: ±5°C across a 6″ (150 mm) wafer at 1150°C.
 SOP

Advanced Photo bay
  • Model: Cascade TEK TVO-2
 SOP

Advanced Photo bay
  • Model: Blue M 0V-12A
  • Temp range: up to 260C
 SOP

Advanced Photo bay
  • Model: Blue M 0V-8A
  • Temp range: up to 260C
 SOP

Advanced Photo bay
  • Model: Narco 5831 Vacuum Oven

Deposition

CVD (chemical vapor deposition)
Tool Location Substrate size Deposition films Gases Features Links

Deposition bay 1 up to 6" wafer SiO2, Si3N4, SiNO 2% SiH4/N2, NH3, N2O, N2, He, CF4
  • PlasmaPro System 100
  • Electrode specs: 240mm diameter, up to 400°C
  • Load lock
  • No wafer clamping, fixed height
  • RF power 300W
  • LF power 500W
 SOP

Deposition bay 1 up to 4" diameter or small pieces MgO, Al2O3, Pt, Ru, HfO2, ZrO2, TiO2 N2 as a carrier gas

O2 or O3 as film precursor

  • Savannah S200
  • Reactor temperature: 150°C for most recipes, up to 270°C
  • Ozone generator can replace O2 with O3
 SOP
PVD (physical vapor deposition)
Tool Location Substrate size

(up to diameter)

# of pockets E-beam voltage Deposition materials Gases Features Links

Deposition bay 1 6" 4 10kV Ti, Al, Al2O3 Ar, 5% O2 in Ar
  • variable angle stage
  • substrate rotation
  • substrate heater
  • ion mill for substrate cleaning
  • load lock
 SOP

Deposition bay 2 6" 6 @ 15cc 10kV Ti, Au, Pt, Pd, Cr, Ni and Ag
  • Sweep controller
  • motor-driven deposition shield
  • 8kW heater array
  • Lift-off fixturing
  • substrate rotation
  • substrate dome for twenty-two 100mm back loaded wafers
  • Inficon IC/6 for thickness control
 SOP

Deposition bay 1 6" 4 5kV Ti, Au, Pt, Pd, Cr, Ni, and Ag. Other materials available upon request.
  • substrate rotation
  • source to substrate distance is approx. 15″ (381mm)
Deposition bay 1 Not in service. SOP
Substrate size # of sources Sputter power

Deposition bay 1 6"
  • 4 DC
  • 1 RF/DC
  • DC sputter power 500 W
  • RF sputter power 300 W
 Au, Pt, Ti, Al, W, Mo, Cu, SiO2, Al2O3, and ITO. Other materials available upon request. Ar, O2
  • Target size: 2"
  • Substrate rotation
 SOP

Dry Etching & Plasma Cleaning

See also Dry etching recipes.

Etchers
Tool Location Substrate

size

Allowed

materials

Disallowed

materials

Gases Table temperature Features Links

Etch bay 1 4" wafer clamp, smaller pieces may go onto carrier wafers

2″, 3″, 4″, 6″, 8″ wafers possible

Si, SiO2, SiN, Parylene, polyimide, LiNbO3, BCB No exposed metals (except Cr) Ar, O2, CF4, CHF3, SF6, C4F8 20C
  • Model: Oxford System 100 Deep reactive-ion etcher
  • Etch deep Si with Bosch process
  • ICP power (max) 3000W
  • Table RF power (max) 300W

Etch bay 1
  • Oxford Deep reactive-ion etcher and atomic-layer etcher.
  • This new tool is currently being commissioned

Etch bay 1 4" wafer clamp, smaller pieces may go onto carrier wafers

2″, 3″, 4″, 6″, 8″ wafers possible

InP, InAs, GaN, AlGaAs, GaAs, InGaAsP, ITO, Si, SiC, MoS2, WSe, Graphene No exposed metals (except Cr)

No deep etching polymers (>1 µm)

Ar, O2, SF6, CH4, H2, Cl2, BCl3, SiCl4 -120 to 200C
  • Model: Oxford PlasmaPro 100 Cobra III-V etcher
  • Etch III-V materials
  • Cryo cooling
  • Helium backside cooling
  • ICP power (max) 1500W
  • Table RF power (max) 1500W
  • Optical endpoint detection: Horiba Jobin Yvon LEM G50

Etch bay 1 Up to 200 mm wafers Si, SiO2, Si3N4 No exposed metals (except Cr)

No deep etching polymers (>1 µm)

Ar, O2, CF4, CHF3, SF6 20C
  • Model: Oxford PlasmaPro 80 reactive ion etcher
  • Etch dielectrics
  • Table RF power (max) 300W
  • Optical endpoint detection: Horiba Jobin Yvon LEM G50

Deposition bay 1 Up to 6" wafers Si None Crystal XeF2 source 20C
  • Etch Si quickly and isotropically with high selectivity
  • Custom built by the Armani group
Plasma cleaning / ashing
Tool Location Substrate size Allowed materials Gases Features Links

Advanced Photo Bay 200 mm pieces or wafers Photoresist, graphene, CNT O2
  • Model: Tegal CU90??
 SOP

Advanced Photo Bay
  • Model: Tegal Plasma 915
  • Tool is currently not in operation

Advanced Photo Bay 200mm pieces or wafers O2
  • Model: Yield Engineering System YES-CV200RFS
  • 1000W table RF power
  • Heat up to 250C
 Quickstart

Lithography

E-beam and laser
Tool Location Substrate size Exposure

resolution

Features Links

Ebeam Bay 4" wafer, or small pieces up to 2" <8nm
  • Model: EBPG5150
  • Thermal Field Emission 50kV and 100kV
  • Beam current 350nA
  • Pattern Generator 125 MHZ Genlsys – Beamer
 SOP

Metrology Bay
  • Min substrate/mask size 5x5mm
  • Max substrate/mask size 9"x9"
 300nm
  • Model: Heidelberg DWL 66+ (Direct Write Laser)
  • Front and backside alignment
  • Exposure wavelength: Grayscale and advanced grayscale exposure 405nm laser (“h-line” photoresists)
  • Write modes (trading off high speed and high resolution)
    • High resolution (min feature size 0.3um)
    • Mode IV: min size 2um
    • Mode V: min size 4um
  • Alignment modes: Manual, semi-automatic, and fully automatic alignment
 SOP
UV mask aligners
Tool Location Substrate

size

Mask

size

Exposure

resolution

Features Links

Advanced Photo bay Pieces up to 3” 3” and 4” 0.8um
  • Backside alignment
  • Exposure modes Soft, Hard, and vacuum contacts
  • Exposure wavelength UV 400, 350-450 nm
  • Exposure source 350 W Hg Arc lamp
 SOP

Photo bay Pieces up to 3” 3” and 4” 0.8um
  • Exposure modes Soft, Hard, and vacuum contacts
  • Exposure wavelength UV 400, 350-450 nm
  • Exposure source 350 W Hg Arc lamp
 SOP

Photo bay Pieces up to 2" 3", 4", and 5" 0.8um
  • Exposure wavelength UV 400, 350 – 450nm
  • Eyepieces 10x, objectives 5x, 10x, 20x
 SOP

Advanced Photo Bay 0.8um
  • Backside alignment
  • Exposure wavelength UV400 350 – 450 nm
  • Exposure source 450W LED
  • Digital camera objectives 5x, 10x
 SOP

Metrology

Assorted metrology
Tool Location Features Links

Metrology bay
  • Model: Signatone 4-point probe
  • SP4 probe
  • Readout with HP 34401A multimeter

Metrology bay
  • Model: Bruker DektakXT profilometer
  • Scan Length Range 55mm (2in)
  • 150mm (6in) with scan stitching capability Data Points Per Scan 120,000 maximum
  • Max. Sample Thickness 50mm (1.95in)
  • Step Height Repeatability <5Å, 1sigma on 0.1μm step
  • Vertical Range 1mm (0.039in.)
  • Vertical Resolution 1Å max. (@ 6.55μm range)10 Å @ 65.5 μm; 80 Å @ 524μm;
  • 150 Å @ 1mm 3D capability
 SOP

Photo bay
  • Thin film thickness measurement
  • Laser wavelengths 4050, 6328, 8300 Angstroms
  • Wafer mapping Yes
 SOP

Photo bay Thin film thickness measurement SOP
Microscopes
Tool Location Features Links

Metrology bay
  • Model: Phenom ProX G6 Desktop Scanning Electron Microscope
  • Acc Voltage 5 – 15kV
  • Resolution <10nm (for BSED)
  • Magnification 80-150,000x
  • Electron or optical imaging modes
  • Sample Size – up to 32mm

Photo bay
  • Brightfield & Darkfield Polarizer/Analyzer
  • Halogen Lamp 5x, 10x, 20x, 50x, 100x
  • Camera – 5.9 MP resolution
  • USB output/WIFI for exporting images
 SOP

Photo bay
  • Zeiss 47 30 12 9902 binocular microscope head
  • MSA-001 linear encoder

Advanced photo bay

Advanced photo bay
  • Dyna Lite 150 light source
  • Olympus UC30 camera

Advanced photo bay
  • Dyna Lite 150 light source

Packaging & Mechanical Tooling

Wafer and die processing
Tool Location Substrate size Features Links

Etch bay 2
  • Model: F&S Bondtec 53BDA Deep-access & Ball-Wedge bonder

Common chase up to 8" or 250x250 mm
  • Model: DISCO Corp. DAD3350 Dicing Saw
  • 1.8 kW spindle
  • X-axis Cutting range 260 mm
  • Cutting speed mm/s 0.1 ～ 600
  • Y-axis Cutting range 260 mm
  • Index step: 0.0001 mm Z-axis
  • Max. stroke: 32.2 mm
  • Moving resolution: 0.00005 mm
  • Repeatability accuracy: 0.001 mm

Common chase up to 1" diameter
  • EQ Unipol-300 Mini (3") Automatic Grinder/ Polisher
  • 20nm, 50nm, 0.25um, 1um, 5um, 10um polishing slurries/pastes available
  • Smooth polishing pads and sanding pads from 60-3000 grit available

Photo bay
  • LatticeAx 420 Cleaving System
  • 2-axis linear stage
  • Digital camera

Photo bay
  • Model: LatticeGear FlipScribe

Advanced photo bay
  • Model: Gramatech GVS2600R Vacuum Sealer
  • 36" max sealing width
  • N2 purge bags before sealing
  • Foot lever operation
  • Automated purge/vacuum/heat-seal/cool sequence

PCB Processing

PCB processing
Tool Location Features Links

Common chase
  • Model: LPKF ProtoMat S103
  • PCB milling, through hole drilling, contour routing, solder dispensing
  • CircuitPro software available for design work
  • Accepts design file Gerber export from various CAD softwares
  • Mechanical resolution 0.5um
  • Max PCB size: A4

Common chase
  • Model: LPKF Contac S4
  • Multistep clean and plate process
  • Through-hole copper electroplating
  • Not yet in use. Contact Nanofab staff if interested and we can procure the chemical set.
 Operation manual

Wet Process

Solvent fume hood (located in Metrology bay)
Tool Description Links

Model: Air Control, Inc CS-41-316LSS-8ft

Heated ultrasonic bath SOP
Torrey Pines hot plate Model: Torrey Pines HS70
Solvent drains
N2 sprayers
Acid fume hood left-side (located in Etch bay)
Tool Description Links
This fume hood is the only fume hood where the Piranha and Nanostrip chemicals may be used.

Model: Air Control, Inc. CS-41-C-PVC-7ft

Heated bath Model: Imtec Accubath SOP
Quick-dump-rinse tank (QDR)
DI water tap
N2 gun
Acid fume hood right-side (located in Etch bay)
Tool Description Links
Piranha and Nanostrip chemicals are NOT allowed in this fume hood.

Model: Air Control, Inc. CS-41-C-PVC-7ft

Heated bath Model: Imtec Accubath SOP
Torrey Pines hot plate left Model: Torrey Pines HS70
Torrey Pines hot plate right
Quick-dump-rinse tank (QDR)
DI water tap
N2 sprayer
Resist fume hood (located in Advanced Photo bay)
Tool Description Links

Model: Air Control, Inc. CS-41-316-LSS-8ft

Spinner left Laurell resist spinner SOP
Spinner right
Bake plate 1 Apogee bake plate SOP
Bake plate 2
Bake plate 3
Bake plate 4
Base and developer fume hood left-side (located in Advanced Photo bay)
Tool Description Links

Model: Air Control, Inc. CS-41-C-PVC-6ft

Heated bath Model: Imtec Accubath SOP
Torrey Pines hot plate Model: Torrey Pines HS70
Quick-dump-rinse tank (QDR)
DI water tap
N2 sprayer
Base and developer fume hood right-side (located in Advanced Photo bay)
Tool Description Links

Model: Air Control, Inc. CS-41-C-PVC-6ft

Heated bath Model: Imtec Accubath SOP
Torrey Pines hot plate Model: Torrey Pines HS70
Quick-dump-rinse tank (QDR)
DI water tap
N2 sprayer
E-beam resist fume hood (located in Photo bay)
Tool Description Links

Model: Precision Air Technology CS-41-316LSS-8ft

Headway spinner left
  • Model: Headway Research CB15
  • Controller model: Headway Research PWM50
 SOP
Headway spinner right
Apogee hot plate left SOP
Apogee hot plate right
Ultrasonic heated bath
Torrey Pines hot plate/ stirrer Model: Torrey Pines HS70
Retrieved from "https://wiki.nanofab.usc.edu/index.php?title=Tool_list&oldid=546"