Electroglas 4080X: Difference between revisions
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== About == | == About == | ||
[[File:Electroglas | [[File:Electroglas-4080X-full-view.jpg|thumb|300px|Electroglas Horizon 4080X Automated Wafer Prober (full system view with hot chuck, vision system, and control modules)]] | ||
[[File:Electroglas-4080X-chuck-detail.jpg|thumb|300px|Close-up of the gold-plated vacuum chuck and wafer stage area (hot chuck configuration)]] | |||
[[File:Electroglas-4080X-wafer-loaded.jpg|thumb|300px|Wafer loaded on the chuck, ready for vision alignment and probing (showing probe card interface area)]] | |||
'''Process:''' This is an automated wafer prober used for precise wafer-level electrical testing preparation. It loads the wafer, performs vision-based alignment, and steps across die sites to make contact with a probe card, enabling the connected tester to perform measurements. | '''Process:''' This is an automated wafer prober used for precise wafer-level electrical testing preparation. It loads the wafer, performs vision-based alignment, and steps across die sites to make contact with a probe card, enabling the connected tester to perform measurements. | ||
'''Hardware:''' Electroglas 4080X prober (modular: handler + prober control + vision). Configured for 200 mm (8") wafers with hot chuck option. Includes DCM-2 (display/control), MHM (material handler), PCM (prober control), PRM-3 (vision). | '''Hardware:''' Electroglas 4080X prober (modular: handler + prober control + vision). Configured for 200 mm (8") wafers with hot chuck option. Includes DCM-2 (display/control), MHM (material handler), PCM (prober control), PRM-3 (vision). | ||
'''Key Features:''' | '''Key Features:''' | ||
* Wafer size: 100 mm (4″) – 200 mm (8″) standard; ring-carrier adapters up to 300 mm available | |||
Wafer size: 100 mm (4″) – 200 mm (8″) standard; ring-carrier adapters up to 300 mm available | * Chuck type & temp: Gold-plated vacuum chuck, ambient → +130 °C with TC-2000 controller (standard “hot chuck”) | ||
* Indexing accuracy/repeatability: ±4 µm X-Y, Z-resolution 0.25 mil (6.3 µm) | |||
Chuck type & temp: Gold-plated vacuum chuck, ambient → +130 °C with TC-2000 controller (standard “hot chuck”) | * Throughput: ≤ 1.5 s die-to-die at 5 mm step; lot-level ≈ 60 wph (150 mm) | ||
* Vision/alignment: PRM-3 CCD camera, Self-Teach Auto Alignment (STAA), optional OCR & Probe-Mark-Inspection (PMI) | |||
Indexing accuracy/repeatability: ±4 µm X-Y, Z-resolution 0.25 mil (6.3 µm) | * Interfaces: GPIB-IEEE 488, RS-232, Ethernet, EG-Commander/ProberBench software | ||
Throughput: ≤ 1.5 s die-to-die at 5 mm step; lot-level ≈ 60 wph (150 mm) | |||
Vision/alignment: PRM-3 CCD camera, Self-Teach Auto Alignment (STAA), optional OCR & Probe-Mark-Inspection (PMI) | |||
Interfaces: GPIB-IEEE 488, RS-232, Ethernet, EG-Commander/ProberBench software | |||
'''Applications:''' | '''Applications:''' | ||
Wafer loading, precise alignment, and stepping for parametric/TEG testing | * Wafer loading, precise alignment, and stepping for parametric/TEG testing | ||
* Integration with external testers (e.g., Keithley S530) for automated electrical characterization | |||
* Temperature-controlled probing for device performance at elevated temps | |||
* High-accuracy die-to-die positioning in production monitoring flows | |||
'''Usage:''' Load wafer via material handler, initiate alignment (STAA/vision), step to die sites, make probe contact. Controlled externally via interfaces (e.g., from tester software). Clean chuck/stage after use. | |||
== Detailed Specifications == | == Detailed Specifications == | ||
Model: Electroglas 4080X Automated Wafer Prober | Model: Electroglas 4080X Automated Wafer Prober | ||
Location: [Specify lab bay if known, e.g., Test Bay] | |||
Location: [Specify lab bay if known, e.g., Test Bay] | Wafer size: Up to 200 mm standard (adapters for larger) | ||
Chuck: Hot chuck (up to +130 °C) | |||
Wafer size: Up to 200 mm standard (adapters for larger) | Accuracy: ±4 µm X-Y indexing | ||
Vision: PRM-3 CCD with STAA | |||
Chuck: Hot chuck (up to +130 °C) | Restrictions: Mechanical handling/alignment only (no electrical measurements); requires external tester | ||
Other: Modular design for cleanroom use; compatible with various probe cards | |||
== Documentation == | == Documentation == | ||
Training required – contact lab staff (Chandan Ramakrishnaiah or Shivakumar Bhaskaran) | Training required – contact lab staff (Chandan Ramakrishnaiah or Shivakumar Bhaskaran) | ||
Check lab resources for manuals (e.g., EG-Commander/ProberBench guides); no dedicated SOP listed – consider creating one | |||
== Recipes & Data == | == Recipes & Data == | ||
Standard Usage: Automated stepping for PCM/TEG lots; hot chuck for temp-dependent tests | Standard Usage: Automated stepping for PCM/TEG lots; hot chuck for temp-dependent tests | ||
Process Control: Use consistent alignment routines; verify probe contact/scrub marks | Process Control: Use consistent alignment routines; verify probe contact/scrub marks | ||
Notes: Interface with tester for full automation (GPIB/RS-232/Ethernet commands). Monitor chuck temp via TC-2000. | Notes: Interface with tester for full automation (GPIB/RS-232/Ethernet commands). Monitor chuck temp via TC-2000. | ||
[[Template:Under review]] This article was generated with assistance from a large language model (LLM) and is currently under human review and editing. Content may contain inaccuracies, unverified claims, or other issues. Please help improve it. | [[Template:Under review]] This article was generated with assistance from a large language model (LLM) and is currently under human review and editing. Content may contain inaccuracies, unverified claims, or other issues. Please help improve it. | ||
Revision as of 13:35, 17 February 2026
About
Process: This is an automated wafer prober used for precise wafer-level electrical testing preparation. It loads the wafer, performs vision-based alignment, and steps across die sites to make contact with a probe card, enabling the connected tester to perform measurements.
Hardware: Electroglas 4080X prober (modular: handler + prober control + vision). Configured for 200 mm (8") wafers with hot chuck option. Includes DCM-2 (display/control), MHM (material handler), PCM (prober control), PRM-3 (vision).
Key Features:
- Wafer size: 100 mm (4″) – 200 mm (8″) standard; ring-carrier adapters up to 300 mm available
- Chuck type & temp: Gold-plated vacuum chuck, ambient → +130 °C with TC-2000 controller (standard “hot chuck”)
- Indexing accuracy/repeatability: ±4 µm X-Y, Z-resolution 0.25 mil (6.3 µm)
- Throughput: ≤ 1.5 s die-to-die at 5 mm step; lot-level ≈ 60 wph (150 mm)
- Vision/alignment: PRM-3 CCD camera, Self-Teach Auto Alignment (STAA), optional OCR & Probe-Mark-Inspection (PMI)
- Interfaces: GPIB-IEEE 488, RS-232, Ethernet, EG-Commander/ProberBench software
Applications:
- Wafer loading, precise alignment, and stepping for parametric/TEG testing
- Integration with external testers (e.g., Keithley S530) for automated electrical characterization
- Temperature-controlled probing for device performance at elevated temps
- High-accuracy die-to-die positioning in production monitoring flows
Usage: Load wafer via material handler, initiate alignment (STAA/vision), step to die sites, make probe contact. Controlled externally via interfaces (e.g., from tester software). Clean chuck/stage after use.
Detailed Specifications
Model: Electroglas 4080X Automated Wafer Prober Location: [Specify lab bay if known, e.g., Test Bay] Wafer size: Up to 200 mm standard (adapters for larger) Chuck: Hot chuck (up to +130 °C) Accuracy: ±4 µm X-Y indexing Vision: PRM-3 CCD with STAA Restrictions: Mechanical handling/alignment only (no electrical measurements); requires external tester Other: Modular design for cleanroom use; compatible with various probe cards
Documentation
Training required – contact lab staff (Chandan Ramakrishnaiah or Shivakumar Bhaskaran) Check lab resources for manuals (e.g., EG-Commander/ProberBench guides); no dedicated SOP listed – consider creating one
Recipes & Data
Standard Usage: Automated stepping for PCM/TEG lots; hot chuck for temp-dependent tests Process Control: Use consistent alignment routines; verify probe contact/scrub marks Notes: Interface with tester for full automation (GPIB/RS-232/Ethernet commands). Monitor chuck temp via TC-2000.
Template:Under review This article was generated with assistance from a large language model (LLM) and is currently under human review and editing. Content may contain inaccuracies, unverified claims, or other issues. Please help improve it.