Electroglas 4080X
TOC
About
Process: This is an automated wafer prober used for wafer-level electrical testing preparation. It accurately places the wafer under a probe card, uses vision for alignment, and steps across die sites to enable a connected tester to perform electrical measurements and record/sort results. Hardware: Electroglas 4080X prober (modular: handler + prober control + vision). Configured for 200 mm (8") wafers with hot chuck option. Includes DCM-2 (display/control), MHM (material handler), PCM (prober control), PRM-3 vision system. Key Features:
Wafer size: 100 mm (4″) – 200 mm (8″) standard; ring-carrier adapters up to 300 mm available Chuck type & temp.: Gold-plated vacuum chuck, ambient → +130 °C with TC-2000 controller (standard “hot chuck”) Indexing accuracy/repeatability: ±4 µm X-Y, Z-resolution 0.25 mil (6.3 µm) Throughput: ≤ 1.5 s die-to-die at 5 mm step; lot-level throughput ≈ 60 wph (150 mm) Vision/alignment: PRM-3 CCD camera, Self-Teach Auto Alignment (STAA), optional OCR & Probe-Mark-Inspection (PMI) Interfaces: GPIB-IEEE 488, RS-232, Ethernet, EG-Commander/ProberBench software Applications: Automated wafer loading, alignment, and stepping for parametric electrical testing Wafer-level testing preparation for devices on 150 mm or 200 mm wafers Temperature-controlled probing (up to +130 °C) for device characterization under thermal conditions Integration with external testers (e.g., parametric analyzers) via standard interfaces High-accuracy die-to-die positioning for consistent probe contact Usage: Load wafer via material handler, perform vision alignment (STAA), step across die sites automatically or manually, ensure proper contact with probe card. Use hot chuck for elevated temperature tests if needed. Monitor via DCM-2 control/display. Clean chuck and stage after use.
Detailed Specifications
Model: Electroglas 4080X Automated Wafer Prober Location: [Specify lab bay or cleanroom area – e.g., Test Bay] Wafer size: 100–200 mm standard (up to 300 mm with adapters) Chuck: Gold-plated vacuum, hot chuck to +130 °C Accuracy: ±4 µm X-Y indexing/repeatability, 6.3 µm Z-resolution Vision: PRM-3 CCD with STAA, optional OCR/PMI Interfaces: GPIB, RS-232, Ethernet Restrictions: Mechanical handling and alignment only (no electrical measurement); requires external tester for parametric data Other: Modular design (handler + control + vision); commonly paired with Keithley S530 or similar parametric testers
Documentation
Training required – contact lab staff (Chandan Ramakrishnaiah or Shivakumar Bhaskaran) Check lab resources for any existing quick guide or manual (no dedicated SOP file listed; consider creating one if needed)
Recipes & Data
Standard Usage: Common tasks include: Wafer alignment and stepping: Use STAA for auto-alignment on patterns Temperature probing: Set hot chuck to desired temp via TC-2000 (ambient to +130 °C) Die stepping: 1.5 s per die typical for small steps
Process Control: Ensure clean wafer/chuck contact; verify alignment accuracy visually or via PMI option. Compare positioning with test results from paired tester. Notes: Regularly clean vacuum chuck and probe area. Use EG-Commander/ProberBench for control/monitoring if available. Interface commands sent via GPIB/RS-232 from tester software. Template:Under review This article was generated with assistance from a large language model (LLM) and is currently under human review and editing. Content may contain inaccuracies, unverified claims, or other issues. Please help improve it.