Electroglas 4080X

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File:Electroglas Horizon 4080X wafer prober.jpg

Electroglas 4080X Automated Wafer Prober (typical configuration with vision module and control panel)

Process: Automated wafer prober for wafer-level electrical testing preparation. It loads the wafer, aligns it using vision, positions it under a probe card, and steps across die sites to allow a connected tester to perform measurements and record/sort results. Hardware: Modular system including material handler (MHM), prober control (PCM), display/control (DCM-2), and vision (PRM-3). Configured for 200 mm (8") wafers with hot chuck option. Key Features:

Wafer handling and precise stepping Vision-based auto-alignment Temperature-controlled chuck Standard interfaces for tester integration

Applications:

Wafer alignment and stepping for parametric testing Temperature-dependent device characterization (up to +130 °C) Preparation for I-V, C-V, leakage, and breakdown measurements High-throughput lot processing on 150–200 mm wafers

Usage: Load wafer via handler, run Self-Teach Auto Alignment (STAA), initiate stepping sequence, apply temperature if needed via TC-2000 controller. Monitor via DCM-2. Clean chuck after use.

Detailed Specifications

Capability

Typical value/optionWafer size-Chuck type & temperature-Indexing accuracy/repeatability-Throughput-Vision/alignment-Interfaces} Model: Electroglas 4080X Automated Wafer Prober Location: [Specify lab bay or cleanroom area – e.g., Test Bay] Restrictions: Mechanical handling/alignment only (no electrical measurement); requires external tester Other: Modular (handler + control + vision); commonly paired with Keithley S530 Cross-Reference Typically integrated with the Keithley S530 Parametric Test System as a full wafer test cell. The S530 controls prober actions (e.g., step, align) via GPIB/RS-232/Ethernet. Documentation Training required – contact lab staff (Chandan Ramakrishnaiah or Shivakumar Bhaskaran) Check lab resources for quick guide or manual (no dedicated SOP listed; consider creating one) Recipes & Data Standard Usage: Auto-alignment: Use STAA on alignment marks/patterns Temperature probing: Set chuck to target temp (ambient to +130 °C) Die stepping: Typical 1.5 s per small step Process Control: Verify alignment accuracy; ensure clean contact surfaces Notes: Clean vacuum chuck regularly. Use EG-Commander/ProberBench for manual control if needed. Template:Under review This article was generated with assistance from a large language model (LLM) and is currently under human review and editing. Content may contain inaccuracies, unverified claims, or other issues. Please help improve it.