LPKF ProtoPlace E4 Standard Operating Procedure

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Overview

The '''LPKF ProtoPlace E4''' is a hand-operated device designed to position SMDs accurately onto already prepared printed circuit boards. The '''ProtoPlace E4''' uses vacuum needles on the placement/marking head to assist in accurately picking up, locating and dropping SMDs from either loose component trays or tape feeders onto solder-pasted pads on PCBs. The '''ProtoPlace E4''' is ideal for prototyping the assembly of a printed circuit board, or for small volume assembly in a laboratory.

Figure 1: LPKF Protoplace E4 main parts

The main tool includes the monitor/camera display, placement head, work area, tape feeder lanes, component trays, and vacuum/air system.


Manual placement of surface mounted devices (SMD) should be performed in the ProtoPlace E4 and dispense test approvals should only be done by staff members. It is expected that PCB solder paste will be applied to the printed circuit board (PCB) prior to any use of the ProtoPlace E4, either via stencil printing or by any other form of solder paste dispense process that has been approved.


Tool Parts

Figure 2: Work area and placement head

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