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=== Tool Categories ===
=== Tool Categories ===
* [[:Category:Anneal & Furnace|Anneal & Furnace]]
* Anneal & Furnace
* [[:Category:Deposition|Deposition]]
* Deposition
* [[:Category:Dry Etching & Plasma Cleaning|Dry Etching & Plasma Cleaning]]
* Dry Etching & Plasma Cleaning
* [[:Category:Lithography|Lithography]]
* Lithography
* [[:Category:Metrology|Metrology]]
* Metrology
* [[:Category:Packaging & Mechanical Tooling|Packaging & Mechanical Tooling]]
* Packaging & Mechanical Tooling
* [[:Category:PCB Processing|PCB Processing]]
* PCB Processing
* [[:Category:Wet Process|Wet Process]]
* Wet Process
|}
|}


=Anneal & Furnace=
= Anneal & Furnace =
* RTA (Rapid Thermal Annealer)
* Rapid Thermal Annealer (RTA)
* Cascade Tek vacuum oven
* Cascade Tek Vacuum Oven
* Blue M furnace big
* Blue M Furnace (Large)
* Blue M furnace little
* Blue M Furnace (Small)
* Narco vacuum oven
* Narco Vacuum Oven


=Deposition=
= Deposition =
=====CVD (chemical vapor deposition)=====
== Chemical Vapor Deposition (CVD) ==
* Oxford PECVD
* Oxford PECVD
* Veeco ALD
* Veeco ALD


=====PVD (physical vapor deposition)=====
== Physical Vapor Deposition (PVD) ==
* Angstrom Evaporator
* Angstrom E-Beam Evaporator
* CHA Evaporator
* CHA E-Beam Evaporator
* KJL Evaporator
* KJL E-Beam Evaporator
* Temescal Metal e-beam evaporator (Not in service)
* Temescal E-Beam Evaporator (Not in service)
* KJL Sputter
* KJL Sputter System


=Dry Etching & Plasma Cleaning=
= Dry Etching & Plasma Cleaning =
=====Etchers=====
== Reactive Ion / Deep Reactive Ion Etchers ==
* Oxford DRIE
* Oxford DRIE (Deep Si Etcher)
* Oxford DRIE-ALE
* Oxford DRIE-ALE (Atomic Layer Etcher – commissioning)
* Oxford III-V
* Oxford III-V Etcher (PlasmaPro 100 Cobra)
* Oxford RIE
* Oxford RIE (PlasmaPro 80 – Dielectrics)
* XeF2 etcher
* XeF₂ Etcher


=====Plasma cleaning / ashing=====
== Plasma Cleaning / Ashing ==
* Tegal O2 Plasma Asher
* Tegal O₂ Plasma Asher
* Tegal Plasma (Not in operation)
* Tegal Plasma Cleaner (Not in operation)
* YES O2 Plasma
* YES O₂ Plasma System


=Lithography=
= Lithography =
=====E-beam and laser=====
== Direct-Write / Maskless ==
* Raith EBL
* Raith EBPG5150 Electron Beam Lithography
* Heidelberg DWL
* Heidelberg DWL 66+ Direct Write Laser


=====UV mask aligners=====
== Contact / Proximity Mask Aligners ==
* Aligner A (MJB3)
* Aligner A – SUSS MJB3 (Advanced Photo Bay)
* Aligner B (MJB3)
* Aligner B – SUSS MJB3 (Photo Bay)
* Aligner C (MJB4)
* Aligner C – SUSS MJB4 (Photo Bay)
* Aligner D (MA BA6 Gen4)
* Aligner D – SUSS MA/BA6 Gen4 (Advanced Photo Bay)


=Metrology=
= Metrology =
=====Assorted metrology=====
== Thin-Film & Electrical ==
* 4-point Probe
* 4-Point Probe
* Dektak profilometer
* DektakXT Profilometer
* Ellipsometer
* Ellipsometer
* Filmetrics F20
* Filmetrics F20 Thin-Film Analyzer


=====Microscopes=====
== Microscopy ==
* Desktop SEM
* Phenom ProX Desktop SEM
* Nikon LV 150 optical microscope
* Nikon LV150 Optical Microscope
* Max ERB optical microscope
* Max ERB Optical Microscope
* Zeiss optical microscope
* Zeiss Optical Microscope
* Nikon SMZ-10A optical microscope
* Nikon SMZ-10A Stereo Microscope
* Nikon optical microscope
* Nikon Optical Microscope (unspecified model)


=Packaging & Mechanical Tooling=
= Packaging & Mechanical Tooling =
=====Wafer and die processing=====
* F&S Bondtec Ball & Wedge Wire Bonder
* Ball & Wedge bonder
* DISCO DAD3350 Dicing Saw
* Dicing Saw
* EQ Unipol-300 Mini Polisher / Grinder
* Mini Polisher
* LatticeAx 420 Cleaving System
* LatticeAx Cleaver
* LatticeGear FlipScribe Wafer Cleaver
* FlipScribe Cleaver
* Gramatech Vacuum Bag Sealer
* Vacuum Bag Sealer


=PCB Processing=
= PCB Processing =
* LPKF PCB mill
* LPKF ProtoMat S103 PCB Mill
* LPKF electroplater
* LPKF Contac S4 Electroplater


=Wet Process=
= Wet Process =
=====Solvent fume hood=====
== Solvent Fume Hood (Metrology Bay) ==
* Heated ultrasonic bath
* Heated Ultrasonic Bath
* Torrey Pines hot plate
* Torrey Pines Hot Plate
* Solvent drains
* Solvent Drains
* N2 sprayers
* N₂ Blow Guns


=====Acid fume hood left-side=====
== Acid Fume Hood – Left Side (Etch Bay) ==
* Heated bath
* Imtec Heated Bath
* Quick-dump-rinse tank (QDR)
* Quick-Dump-Rinse (QDR) Tank
* DI water tap
* DI Water Tap
* N2 gun
* N₂ Gun


=====Acid fume hood right-side=====
== Acid Fume Hood – Right Side (Etch Bay) ==
* Heated bath
* Imtec Heated Bath
* Torrey Pines hot plate left
* Torrey Pines Hot Plate (Left)
* Torrey Pines hot plate right
* Torrey Pines Hot Plate (Right)
* Quick-dump-rinse tank (QDR)
* Quick-Dump-Rinse (QDR) Tank
* DI water tap
* DI Water Tap
* N2 sprayer
* N₂ Sprayer


=====Resist fume hood=====
== Resist Coating / Baking Fume Hood (Advanced Photo Bay) ==
* Spinner left
* Laurell Spinner – Left
* Spinner right
* Laurell Spinner – Right
* Bake plate 1
* Apogee Bake Plate 1
* Bake plate 2
* Apogee Bake Plate 2
* Bake plate 3
* Apogee Bake Plate 3
* Bake plate 4
* Apogee Bake Plate 4


=====Base and developer fume hood left-side=====
== Developer / Base Fume Hood – Left Side (Advanced Photo Bay) ==
* Heated bath
* Imtec Heated Bath
* Torrey Pines hot plate
* Torrey Pines Hot Plate
* Quick-dump-rinse tank (QDR)
* Quick-Dump-Rinse (QDR) Tank
* DI water tap
* DI Water Tap
* N2 sprayer
* N₂ Sprayer


=====Base and developer fume hood right-side=====
== Developer / Base Fume Hood – Right Side (Advanced Photo Bay) ==
* Heated bath
* Imtec Heated Bath
* Torrey Pines hot plate
* Torrey Pines Hot Plate
* Quick-dump-rinse tank (QDR)
* Quick-Dump-Rinse (QDR) Tank
* DI water tap
* DI Water Tap
* N2 sprayer
* N₂ Sprayer


=====E-beam resist fume hood=====
== E-Beam Resist Fume Hood (Photo Bay) ==
* Headway spinner left
* Headway Spinner – Left
* Headway spinner right
* Headway Spinner – Right
* Apogee hot plate left
* Apogee Hot Plate – Left
* Apogee hot plate right
* Apogee Hot Plate – Right
* Ultrasonic heated bath
* Ultrasonic Heated Bath
* Torrey Pines hot plate/stirrer
* Torrey Pines Hot Plate / Stirrer


== Decommissioned Tools ==
== Decommissioned Tools ==
(If any exist, list here; currently none specified in the provided structure)
(None currently listed)
 
This version uses clearer hierarchy with headings/subheadings, consistent naming, grouped logically within sections, and removes redundancy while keeping the structure clean and easy to scan.

Revision as of 13:19, 2 February 2026

Tool Categories

  • Anneal & Furnace
  • Deposition
  • Dry Etching & Plasma Cleaning
  • Lithography
  • Metrology
  • Packaging & Mechanical Tooling
  • PCB Processing
  • Wet Process

Anneal & Furnace

  • Rapid Thermal Annealer (RTA)
  • Cascade Tek Vacuum Oven
  • Blue M Furnace (Large)
  • Blue M Furnace (Small)
  • Narco Vacuum Oven

Deposition

Chemical Vapor Deposition (CVD)

  • Oxford PECVD
  • Veeco ALD

Physical Vapor Deposition (PVD)

  • Angstrom E-Beam Evaporator
  • CHA E-Beam Evaporator
  • KJL E-Beam Evaporator
  • Temescal E-Beam Evaporator (Not in service)
  • KJL Sputter System

Dry Etching & Plasma Cleaning

Reactive Ion / Deep Reactive Ion Etchers

  • Oxford DRIE (Deep Si Etcher)
  • Oxford DRIE-ALE (Atomic Layer Etcher – commissioning)
  • Oxford III-V Etcher (PlasmaPro 100 Cobra)
  • Oxford RIE (PlasmaPro 80 – Dielectrics)
  • XeF₂ Etcher

Plasma Cleaning / Ashing

  • Tegal O₂ Plasma Asher
  • Tegal Plasma Cleaner (Not in operation)
  • YES O₂ Plasma System

Lithography

Direct-Write / Maskless

  • Raith EBPG5150 Electron Beam Lithography
  • Heidelberg DWL 66+ Direct Write Laser

Contact / Proximity Mask Aligners

  • Aligner A – SUSS MJB3 (Advanced Photo Bay)
  • Aligner B – SUSS MJB3 (Photo Bay)
  • Aligner C – SUSS MJB4 (Photo Bay)
  • Aligner D – SUSS MA/BA6 Gen4 (Advanced Photo Bay)

Metrology

Thin-Film & Electrical

  • 4-Point Probe
  • DektakXT Profilometer
  • Ellipsometer
  • Filmetrics F20 Thin-Film Analyzer

Microscopy

  • Phenom ProX Desktop SEM
  • Nikon LV150 Optical Microscope
  • Max ERB Optical Microscope
  • Zeiss Optical Microscope
  • Nikon SMZ-10A Stereo Microscope
  • Nikon Optical Microscope (unspecified model)

Packaging & Mechanical Tooling

  • F&S Bondtec Ball & Wedge Wire Bonder
  • DISCO DAD3350 Dicing Saw
  • EQ Unipol-300 Mini Polisher / Grinder
  • LatticeAx 420 Cleaving System
  • LatticeGear FlipScribe Wafer Cleaver
  • Gramatech Vacuum Bag Sealer

PCB Processing

  • LPKF ProtoMat S103 PCB Mill
  • LPKF Contac S4 Electroplater

Wet Process

Solvent Fume Hood (Metrology Bay)

  • Heated Ultrasonic Bath
  • Torrey Pines Hot Plate
  • Solvent Drains
  • N₂ Blow Guns

Acid Fume Hood – Left Side (Etch Bay)

  • Imtec Heated Bath
  • Quick-Dump-Rinse (QDR) Tank
  • DI Water Tap
  • N₂ Gun

Acid Fume Hood – Right Side (Etch Bay)

  • Imtec Heated Bath
  • Torrey Pines Hot Plate (Left)
  • Torrey Pines Hot Plate (Right)
  • Quick-Dump-Rinse (QDR) Tank
  • DI Water Tap
  • N₂ Sprayer

Resist Coating / Baking Fume Hood (Advanced Photo Bay)

  • Laurell Spinner – Left
  • Laurell Spinner – Right
  • Apogee Bake Plate 1
  • Apogee Bake Plate 2
  • Apogee Bake Plate 3
  • Apogee Bake Plate 4

Developer / Base Fume Hood – Left Side (Advanced Photo Bay)

  • Imtec Heated Bath
  • Torrey Pines Hot Plate
  • Quick-Dump-Rinse (QDR) Tank
  • DI Water Tap
  • N₂ Sprayer

Developer / Base Fume Hood – Right Side (Advanced Photo Bay)

  • Imtec Heated Bath
  • Torrey Pines Hot Plate
  • Quick-Dump-Rinse (QDR) Tank
  • DI Water Tap
  • N₂ Sprayer

E-Beam Resist Fume Hood (Photo Bay)

  • Headway Spinner – Left
  • Headway Spinner – Right
  • Apogee Hot Plate – Left
  • Apogee Hot Plate – Right
  • Ultrasonic Heated Bath
  • Torrey Pines Hot Plate / Stirrer

Decommissioned Tools

(None currently listed)

This version uses clearer hierarchy with headings/subheadings, consistent naming, grouped logically within sections, and removes redundancy while keeping the structure clean and easy to scan.