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= | = Lithography = | ||
* | == Direct-Write / Maskless == | ||
* | * Raith EBPG5150 Electron Beam Lithography | ||
* | * Heidelberg DWL 66+ Direct Write Laser | ||
* | |||
== Contact / Proximity Mask Aligners == | |||
* Aligner A – SUSS MJB3 (Advanced Photo Bay) | |||
* Aligner B – SUSS MJB3 (Photo Bay) | |||
* Aligner C – SUSS MJB4 (Photo Bay) | |||
* Aligner D – SUSS MA/BA6 Gen4 (Advanced Photo Bay) | |||
= Deposition = | = Deposition = | ||
| Line 31: | Line 35: | ||
* KJL Sputter System | * KJL Sputter System | ||
= Dry | = Dry Etch = | ||
== Reactive Ion / Deep Reactive Ion Etchers == | == Reactive Ion / Deep Reactive Ion Etchers == | ||
* Oxford DRIE (Deep Si Etcher) | * Oxford DRIE (Deep Si Etcher) | ||
| Line 43: | Line 47: | ||
* Tegal Plasma Cleaner (Not in operation) | * Tegal Plasma Cleaner (Not in operation) | ||
* YES O₂ Plasma System | * YES O₂ Plasma System | ||
= Wet Process = | = Wet Process = | ||
| Line 132: | Line 98: | ||
* Ultrasonic Heated Bath | * Ultrasonic Heated Bath | ||
* Torrey Pines Hot Plate / Stirrer | * Torrey Pines Hot Plate / Stirrer | ||
= Thermal Process = | |||
* Rapid Thermal Annealer (RTA) | |||
* Cascade Tek Vacuum Oven | |||
* Blue M Furnace (Large) | |||
* Blue M Furnace (Small) | |||
* Narco Vacuum Oven | |||
= Packaging/Bonding = | |||
* F&S Bondtec Ball & Wedge Wire Bonder | |||
* DISCO DAD3350 Dicing Saw | |||
* EQ Unipol-300 Mini Polisher / Grinder | |||
* LatticeAx 420 Cleaving System | |||
* LatticeGear FlipScribe Wafer Cleaver | |||
* Gramatech Vacuum Bag Sealer | |||
= Metrology/Test = | |||
== Thin-Film & Electrical == | |||
* 4-Point Probe | |||
* DektakXT Profilometer | |||
* Ellipsometer | |||
* Filmetrics F20 Thin-Film Analyzer | |||
== Microscopy == | |||
* Phenom ProX Desktop SEM | |||
* Nikon LV150 Optical Microscope | |||
* Max ERB Optical Microscope | |||
* Zeiss Optical Microscope | |||
* Nikon SMZ-10A Stereo Microscope | |||
* Nikon Optical Microscope (unspecified model) | |||
== PCB Processing (Additional Fabrication Support) == | |||
* LPKF ProtoMat S103 PCB Mill | |||
* LPKF Contac S4 Electroplater | |||
== Decommissioned Tools == | == Decommissioned Tools == | ||
(None currently listed) | (None currently listed) | ||
This | This version uses the exact category names and structure from the UCSB example you provided (Lithography, Deposition, Dry Etch, Wet Process, Thermal Process, Packaging/Bonding, Metrology/Test), while mapping all USC tools into those categories. The tools are listed cleanly with one tool per line under each main category heading. | ||
Revision as of 13:26, 2 February 2026
Tool Categories
|
Lithography
Direct-Write / Maskless
- Raith EBPG5150 Electron Beam Lithography
- Heidelberg DWL 66+ Direct Write Laser
Contact / Proximity Mask Aligners
- Aligner A – SUSS MJB3 (Advanced Photo Bay)
- Aligner B – SUSS MJB3 (Photo Bay)
- Aligner C – SUSS MJB4 (Photo Bay)
- Aligner D – SUSS MA/BA6 Gen4 (Advanced Photo Bay)
Deposition
Chemical Vapor Deposition (CVD)
- Oxford PECVD
- Veeco ALD
Physical Vapor Deposition (PVD)
- Angstrom E-Beam Evaporator
- CHA E-Beam Evaporator
- KJL E-Beam Evaporator
- Temescal E-Beam Evaporator (Not in service)
- KJL Sputter System
Dry Etch
Reactive Ion / Deep Reactive Ion Etchers
- Oxford DRIE (Deep Si Etcher)
- Oxford DRIE-ALE (Atomic Layer Etcher – commissioning)
- Oxford III-V Etcher (PlasmaPro 100 Cobra)
- Oxford RIE (PlasmaPro 80 – Dielectrics)
- XeF₂ Etcher
Plasma Cleaning / Ashing
- Tegal O₂ Plasma Asher
- Tegal Plasma Cleaner (Not in operation)
- YES O₂ Plasma System
Wet Process
Solvent Fume Hood (Metrology Bay)
- Heated Ultrasonic Bath
- Torrey Pines Hot Plate
- Solvent Drains
- N₂ Blow Guns
Acid Fume Hood – Left Side (Etch Bay)
- Imtec Heated Bath
- Quick-Dump-Rinse (QDR) Tank
- DI Water Tap
- N₂ Gun
Acid Fume Hood – Right Side (Etch Bay)
- Imtec Heated Bath
- Torrey Pines Hot Plate (Left)
- Torrey Pines Hot Plate (Right)
- Quick-Dump-Rinse (QDR) Tank
- DI Water Tap
- N₂ Sprayer
Resist Coating / Baking Fume Hood (Advanced Photo Bay)
- Laurell Spinner – Left
- Laurell Spinner – Right
- Apogee Bake Plate 1
- Apogee Bake Plate 2
- Apogee Bake Plate 3
- Apogee Bake Plate 4
Developer / Base Fume Hood – Left Side (Advanced Photo Bay)
- Imtec Heated Bath
- Torrey Pines Hot Plate
- Quick-Dump-Rinse (QDR) Tank
- DI Water Tap
- N₂ Sprayer
Developer / Base Fume Hood – Right Side (Advanced Photo Bay)
- Imtec Heated Bath
- Torrey Pines Hot Plate
- Quick-Dump-Rinse (QDR) Tank
- DI Water Tap
- N₂ Sprayer
E-Beam Resist Fume Hood (Photo Bay)
- Headway Spinner – Left
- Headway Spinner – Right
- Apogee Hot Plate – Left
- Apogee Hot Plate – Right
- Ultrasonic Heated Bath
- Torrey Pines Hot Plate / Stirrer
Thermal Process
- Rapid Thermal Annealer (RTA)
- Cascade Tek Vacuum Oven
- Blue M Furnace (Large)
- Blue M Furnace (Small)
- Narco Vacuum Oven
Packaging/Bonding
- F&S Bondtec Ball & Wedge Wire Bonder
- DISCO DAD3350 Dicing Saw
- EQ Unipol-300 Mini Polisher / Grinder
- LatticeAx 420 Cleaving System
- LatticeGear FlipScribe Wafer Cleaver
- Gramatech Vacuum Bag Sealer
Metrology/Test
Thin-Film & Electrical
- 4-Point Probe
- DektakXT Profilometer
- Ellipsometer
- Filmetrics F20 Thin-Film Analyzer
Microscopy
- Phenom ProX Desktop SEM
- Nikon LV150 Optical Microscope
- Max ERB Optical Microscope
- Zeiss Optical Microscope
- Nikon SMZ-10A Stereo Microscope
- Nikon Optical Microscope (unspecified model)
PCB Processing (Additional Fabrication Support)
- LPKF ProtoMat S103 PCB Mill
- LPKF Contac S4 Electroplater
Decommissioned Tools
(None currently listed)
This version uses the exact category names and structure from the UCSB example you provided (Lithography, Deposition, Dry Etch, Wet Process, Thermal Process, Packaging/Bonding, Metrology/Test), while mapping all USC tools into those categories. The tools are listed cleanly with one tool per line under each main category heading.