Tools menu: Difference between revisions

From USC Nanofab Wiki
Jump to navigation Jump to search
← Older editNewer edit →
Chandanr (talk | contribs)
Administrators
292 edits
VisualWikitext
No edit summary
No edit summary
Line 3: Line 3:
|
|
=== Tool Categories ===
=== Tool Categories ===
* Anneal & Furnace
* Deposition
* Dry Etching & Plasma Cleaning
* Lithography
* Lithography
* Deposition
* Metrology
* Dry Etch
* Packaging & Mechanical Tooling
* PCB Processing
* Wet Process
* Wet Process
* Thermal Process
* Packaging/Bonding
* Metrology/Test
|}
|}


= Lithography =
= Anneal & Furnace =
== Direct-Write / Maskless ==
* Rapid Thermal Annealer (RTA)
* Raith EBPG5150 Electron Beam Lithography
* Cascade Tek Vacuum Oven
* Heidelberg DWL 66+ Direct Write Laser
* Blue M Furnace (Large)
 
* Blue M Furnace (Small)
== Contact / Proximity Mask Aligners ==
* Narco Vacuum Oven
* Aligner A – SUSS MJB3 (Advanced Photo Bay)
* Aligner B – SUSS MJB3 (Photo Bay)
* Aligner C – SUSS MJB4 (Photo Bay)
* Aligner D – SUSS MA/BA6 Gen4 (Advanced Photo Bay)


= Deposition =
= Deposition =
Line 35: Line 32:
* KJL Sputter System
* KJL Sputter System


= Dry Etch =
= Dry Etching & Plasma Cleaning =
== Reactive Ion / Deep Reactive Ion Etchers ==
== Reactive Ion / Deep Reactive Ion Etchers ==
* Oxford DRIE (Deep Si Etcher)
* Oxford DRIE (Deep Si Etcher)
Line 47: Line 44:
* Tegal Plasma Cleaner (Not in operation)
* Tegal Plasma Cleaner (Not in operation)
* YES O₂ Plasma System
* YES O₂ Plasma System
= Lithography =
== Direct-Write / Maskless ==
* Raith EBPG5150 Electron Beam Lithography
* Heidelberg DWL 66+ Direct Write Laser
== Contact / Proximity Mask Aligners ==
* Aligner A – SUSS MJB3 (Advanced Photo Bay)
* Aligner B – SUSS MJB3 (Photo Bay)
* Aligner C – SUSS MJB4 (Photo Bay)
* Aligner D – SUSS MA/BA6 Gen4 (Advanced Photo Bay)
= Metrology =
== Thin-Film & Electrical ==
* 4-Point Probe
* DektakXT Profilometer
* Ellipsometer
* Filmetrics F20 Thin-Film Analyzer
== Microscopy ==
* Phenom ProX Desktop SEM
* Nikon LV150 Optical Microscope
* Max ERB Optical Microscope
* Zeiss Optical Microscope
* Nikon SMZ-10A Stereo Microscope
* Nikon Optical Microscope (unspecified model)
= Packaging & Mechanical Tooling =
* F&S Bondtec Ball & Wedge Wire Bonder
* DISCO DAD3350 Dicing Saw
* EQ Unipol-300 Mini Polisher / Grinder
* LatticeAx 420 Cleaving System
* LatticeGear FlipScribe Wafer Cleaver
* Gramatech Vacuum Bag Sealer
= PCB Processing =
* LPKF ProtoMat S103 PCB Mill
* LPKF Contac S4 Electroplater


= Wet Process =
= Wet Process =
Line 98: Line 133:
* Ultrasonic Heated Bath
* Ultrasonic Heated Bath
* Torrey Pines Hot Plate / Stirrer
* Torrey Pines Hot Plate / Stirrer
= Thermal Process =
* Rapid Thermal Annealer (RTA)
* Cascade Tek Vacuum Oven
* Blue M Furnace (Large)
* Blue M Furnace (Small)
* Narco Vacuum Oven
= Packaging/Bonding =
* F&S Bondtec Ball & Wedge Wire Bonder
* DISCO DAD3350 Dicing Saw
* EQ Unipol-300 Mini Polisher / Grinder
* LatticeAx 420 Cleaving System
* LatticeGear FlipScribe Wafer Cleaver
* Gramatech Vacuum Bag Sealer
= Metrology/Test =
== Thin-Film & Electrical ==
* 4-Point Probe
* DektakXT Profilometer
* Ellipsometer
* Filmetrics F20 Thin-Film Analyzer
== Microscopy ==
* Phenom ProX Desktop SEM
* Nikon LV150 Optical Microscope
* Max ERB Optical Microscope
* Zeiss Optical Microscope
* Nikon SMZ-10A Stereo Microscope
* Nikon Optical Microscope (unspecified model)
== PCB Processing (Additional Fabrication Support) ==
* LPKF ProtoMat S103 PCB Mill
* LPKF Contac S4 Electroplater


== Decommissioned Tools ==
== Decommissioned Tools ==
(None currently listed)
(None currently listed)


This version uses the exact category names and structure from the UCSB example you provided (Lithography, Deposition, Dry Etch, Wet Process, Thermal Process, Packaging/Bonding, Metrology/Test), while mapping all USC tools into those categories. The tools are listed cleanly with one tool per line under each main category heading.
This version uses the exact category names and simple bullet-list style you requested for the top box (Anneal & Furnace, Deposition, Dry Etching & Plasma Cleaning, Lithography, Metrology, Packaging & Mechanical Tooling, PCB Processing, Wet Process), with each category on its own line, matching the USC nanofab tool list organization. All tools are grouped under their respective categories.

Revision as of 13:27, 2 February 2026

Tool Categories

  • Anneal & Furnace
  • Deposition
  • Dry Etching & Plasma Cleaning
  • Lithography
  • Metrology
  • Packaging & Mechanical Tooling
  • PCB Processing
  • Wet Process

Anneal & Furnace

  • Rapid Thermal Annealer (RTA)
  • Cascade Tek Vacuum Oven
  • Blue M Furnace (Large)
  • Blue M Furnace (Small)
  • Narco Vacuum Oven

Deposition

Chemical Vapor Deposition (CVD)

  • Oxford PECVD
  • Veeco ALD

Physical Vapor Deposition (PVD)

  • Angstrom E-Beam Evaporator
  • CHA E-Beam Evaporator
  • KJL E-Beam Evaporator
  • Temescal E-Beam Evaporator (Not in service)
  • KJL Sputter System

Dry Etching & Plasma Cleaning

Reactive Ion / Deep Reactive Ion Etchers

  • Oxford DRIE (Deep Si Etcher)
  • Oxford DRIE-ALE (Atomic Layer Etcher – commissioning)
  • Oxford III-V Etcher (PlasmaPro 100 Cobra)
  • Oxford RIE (PlasmaPro 80 – Dielectrics)
  • XeF₂ Etcher

Plasma Cleaning / Ashing

  • Tegal O₂ Plasma Asher
  • Tegal Plasma Cleaner (Not in operation)
  • YES O₂ Plasma System

Lithography

Direct-Write / Maskless

  • Raith EBPG5150 Electron Beam Lithography
  • Heidelberg DWL 66+ Direct Write Laser

Contact / Proximity Mask Aligners

  • Aligner A – SUSS MJB3 (Advanced Photo Bay)
  • Aligner B – SUSS MJB3 (Photo Bay)
  • Aligner C – SUSS MJB4 (Photo Bay)
  • Aligner D – SUSS MA/BA6 Gen4 (Advanced Photo Bay)

Metrology

Thin-Film & Electrical

  • 4-Point Probe
  • DektakXT Profilometer
  • Ellipsometer
  • Filmetrics F20 Thin-Film Analyzer

Microscopy

  • Phenom ProX Desktop SEM
  • Nikon LV150 Optical Microscope
  • Max ERB Optical Microscope
  • Zeiss Optical Microscope
  • Nikon SMZ-10A Stereo Microscope
  • Nikon Optical Microscope (unspecified model)

Packaging & Mechanical Tooling

  • F&S Bondtec Ball & Wedge Wire Bonder
  • DISCO DAD3350 Dicing Saw
  • EQ Unipol-300 Mini Polisher / Grinder
  • LatticeAx 420 Cleaving System
  • LatticeGear FlipScribe Wafer Cleaver
  • Gramatech Vacuum Bag Sealer

PCB Processing

  • LPKF ProtoMat S103 PCB Mill
  • LPKF Contac S4 Electroplater

Wet Process

Solvent Fume Hood (Metrology Bay)

  • Heated Ultrasonic Bath
  • Torrey Pines Hot Plate
  • Solvent Drains
  • N₂ Blow Guns

Acid Fume Hood – Left Side (Etch Bay)

  • Imtec Heated Bath
  • Quick-Dump-Rinse (QDR) Tank
  • DI Water Tap
  • N₂ Gun

Acid Fume Hood – Right Side (Etch Bay)

  • Imtec Heated Bath
  • Torrey Pines Hot Plate (Left)
  • Torrey Pines Hot Plate (Right)
  • Quick-Dump-Rinse (QDR) Tank
  • DI Water Tap
  • N₂ Sprayer

Resist Coating / Baking Fume Hood (Advanced Photo Bay)

  • Laurell Spinner – Left
  • Laurell Spinner – Right
  • Apogee Bake Plate 1
  • Apogee Bake Plate 2
  • Apogee Bake Plate 3
  • Apogee Bake Plate 4

Developer / Base Fume Hood – Left Side (Advanced Photo Bay)

  • Imtec Heated Bath
  • Torrey Pines Hot Plate
  • Quick-Dump-Rinse (QDR) Tank
  • DI Water Tap
  • N₂ Sprayer

Developer / Base Fume Hood – Right Side (Advanced Photo Bay)

  • Imtec Heated Bath
  • Torrey Pines Hot Plate
  • Quick-Dump-Rinse (QDR) Tank
  • DI Water Tap
  • N₂ Sprayer

E-Beam Resist Fume Hood (Photo Bay)

  • Headway Spinner – Left
  • Headway Spinner – Right
  • Apogee Hot Plate – Left
  • Apogee Hot Plate – Right
  • Ultrasonic Heated Bath
  • Torrey Pines Hot Plate / Stirrer

Decommissioned Tools

(None currently listed)

This version uses the exact category names and simple bullet-list style you requested for the top box (Anneal & Furnace, Deposition, Dry Etching & Plasma Cleaning, Lithography, Metrology, Packaging & Mechanical Tooling, PCB Processing, Wet Process), with each category on its own line, matching the USC nanofab tool list organization. All tools are grouped under their respective categories.

Retrieved from "https://wiki.nanofab.usc.edu/index.php?title=Tools_menu&oldid=523"