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=== Tool Categories === | === Tool Categories === | ||
* Anneal & Furnace | * [[#Anneal-&-Furnace|Anneal & Furnace]] | ||
* Deposition | * [[#Deposition|Deposition]] | ||
* Dry Etching & Plasma Cleaning | * [[#Dry-Etching-&-Plasma-Cleaning|Dry Etching & Plasma Cleaning]] | ||
* Lithography | * [[#Lithography|Lithography]] | ||
* Metrology | * [[#Metrology|Metrology]] | ||
* Packaging & Mechanical Tooling | * [[#Packaging-&-Mechanical-Tooling|Packaging & Mechanical Tooling]] | ||
* PCB Processing | * [[#PCB-Processing|PCB Processing]] | ||
* Wet Process | * [[#Wet-Process|Wet Process]] | ||
|} | |} | ||
= Anneal & Furnace = | = Anneal & Furnace = {#Anneal-&-Furnace} | ||
* Rapid Thermal Annealer (RTA) | * Rapid Thermal Annealer (RTA) | ||
* Cascade Tek Vacuum Oven | * Cascade Tek Vacuum Oven | ||
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* Narco Vacuum Oven | * Narco Vacuum Oven | ||
= Deposition = | = Deposition = {#Deposition} | ||
== Chemical Vapor Deposition (CVD) == | == Chemical Vapor Deposition (CVD) == | ||
* Oxford PECVD | * Oxford PECVD | ||
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* KJL Sputter System | * KJL Sputter System | ||
= Dry Etching & Plasma Cleaning = | = Dry Etching & Plasma Cleaning = {#Dry-Etching-&-Plasma-Cleaning} | ||
== Reactive Ion / Deep Reactive Ion Etchers == | == Reactive Ion / Deep Reactive Ion Etchers == | ||
* Oxford DRIE (Deep Si Etcher) | * Oxford DRIE (Deep Si Etcher) | ||
| Line 45: | Line 45: | ||
* YES O₂ Plasma System | * YES O₂ Plasma System | ||
= Lithography = | = Lithography = {#Lithography} | ||
== Direct-Write / Maskless == | == Direct-Write / Maskless == | ||
* Raith EBPG5150 Electron Beam Lithography | * Raith EBPG5150 Electron Beam Lithography | ||
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* Aligner D – SUSS MA/BA6 Gen4 (Advanced Photo Bay) | * Aligner D – SUSS MA/BA6 Gen4 (Advanced Photo Bay) | ||
= Metrology = | = Metrology = {#Metrology} | ||
== Thin-Film & Electrical == | == Thin-Film & Electrical == | ||
* 4-Point Probe | * 4-Point Probe | ||
| Line 71: | Line 71: | ||
* Nikon Optical Microscope (unspecified model) | * Nikon Optical Microscope (unspecified model) | ||
= Packaging & Mechanical Tooling = | = Packaging & Mechanical Tooling = {#Packaging-&-Mechanical-Tooling} | ||
* F&S Bondtec Ball & Wedge Wire Bonder | * F&S Bondtec Ball & Wedge Wire Bonder | ||
* DISCO DAD3350 Dicing Saw | * DISCO DAD3350 Dicing Saw | ||
| Line 79: | Line 79: | ||
* Gramatech Vacuum Bag Sealer | * Gramatech Vacuum Bag Sealer | ||
= PCB Processing = | = PCB Processing = {#PCB-Processing} | ||
* LPKF ProtoMat S103 PCB Mill | * LPKF ProtoMat S103 PCB Mill | ||
* LPKF Contac S4 Electroplater | * LPKF Contac S4 Electroplater | ||
= Wet Process = | = Wet Process = {#Wet-Process} | ||
== Solvent Fume Hood (Metrology Bay) == | == Solvent Fume Hood (Metrology Bay) == | ||
* Heated Ultrasonic Bath | * Heated Ultrasonic Bath | ||
| Line 136: | Line 136: | ||
== Decommissioned Tools == | == Decommissioned Tools == | ||
(None currently listed) | (None currently listed) | ||
Revision as of 13:29, 2 February 2026
Tool Categories |
= Anneal & Furnace = {#Anneal-&-Furnace}
- Rapid Thermal Annealer (RTA)
- Cascade Tek Vacuum Oven
- Blue M Furnace (Large)
- Blue M Furnace (Small)
- Narco Vacuum Oven
= Deposition = {#Deposition}
Chemical Vapor Deposition (CVD)
- Oxford PECVD
- Veeco ALD
Physical Vapor Deposition (PVD)
- Angstrom E-Beam Evaporator
- CHA E-Beam Evaporator
- KJL E-Beam Evaporator
- Temescal E-Beam Evaporator (Not in service)
- KJL Sputter System
= Dry Etching & Plasma Cleaning = {#Dry-Etching-&-Plasma-Cleaning}
Reactive Ion / Deep Reactive Ion Etchers
- Oxford DRIE (Deep Si Etcher)
- Oxford DRIE-ALE (Atomic Layer Etcher – commissioning)
- Oxford III-V Etcher (PlasmaPro 100 Cobra)
- Oxford RIE (PlasmaPro 80 – Dielectrics)
- XeF₂ Etcher
Plasma Cleaning / Ashing
- Tegal O₂ Plasma Asher
- Tegal Plasma Cleaner (Not in operation)
- YES O₂ Plasma System
= Lithography = {#Lithography}
Direct-Write / Maskless
- Raith EBPG5150 Electron Beam Lithography
- Heidelberg DWL 66+ Direct Write Laser
Contact / Proximity Mask Aligners
- Aligner A – SUSS MJB3 (Advanced Photo Bay)
- Aligner B – SUSS MJB3 (Photo Bay)
- Aligner C – SUSS MJB4 (Photo Bay)
- Aligner D – SUSS MA/BA6 Gen4 (Advanced Photo Bay)
= Metrology = {#Metrology}
Thin-Film & Electrical
- 4-Point Probe
- DektakXT Profilometer
- Ellipsometer
- Filmetrics F20 Thin-Film Analyzer
Microscopy
- Phenom ProX Desktop SEM
- Nikon LV150 Optical Microscope
- Max ERB Optical Microscope
- Zeiss Optical Microscope
- Nikon SMZ-10A Stereo Microscope
- Nikon Optical Microscope (unspecified model)
= Packaging & Mechanical Tooling = {#Packaging-&-Mechanical-Tooling}
- F&S Bondtec Ball & Wedge Wire Bonder
- DISCO DAD3350 Dicing Saw
- EQ Unipol-300 Mini Polisher / Grinder
- LatticeAx 420 Cleaving System
- LatticeGear FlipScribe Wafer Cleaver
- Gramatech Vacuum Bag Sealer
= PCB Processing = {#PCB-Processing}
- LPKF ProtoMat S103 PCB Mill
- LPKF Contac S4 Electroplater
= Wet Process = {#Wet-Process}
Solvent Fume Hood (Metrology Bay)
- Heated Ultrasonic Bath
- Torrey Pines Hot Plate
- Solvent Drains
- N₂ Blow Guns
Acid Fume Hood – Left Side (Etch Bay)
- Imtec Heated Bath
- Quick-Dump-Rinse (QDR) Tank
- DI Water Tap
- N₂ Gun
Acid Fume Hood – Right Side (Etch Bay)
- Imtec Heated Bath
- Torrey Pines Hot Plate (Left)
- Torrey Pines Hot Plate (Right)
- Quick-Dump-Rinse (QDR) Tank
- DI Water Tap
- N₂ Sprayer
Resist Coating / Baking Fume Hood (Advanced Photo Bay)
- Laurell Spinner – Left
- Laurell Spinner – Right
- Apogee Bake Plate 1
- Apogee Bake Plate 2
- Apogee Bake Plate 3
- Apogee Bake Plate 4
Developer / Base Fume Hood – Left Side (Advanced Photo Bay)
- Imtec Heated Bath
- Torrey Pines Hot Plate
- Quick-Dump-Rinse (QDR) Tank
- DI Water Tap
- N₂ Sprayer
Developer / Base Fume Hood – Right Side (Advanced Photo Bay)
- Imtec Heated Bath
- Torrey Pines Hot Plate
- Quick-Dump-Rinse (QDR) Tank
- DI Water Tap
- N₂ Sprayer
E-Beam Resist Fume Hood (Photo Bay)
- Headway Spinner – Left
- Headway Spinner – Right
- Apogee Hot Plate – Left
- Apogee Hot Plate – Right
- Ultrasonic Heated Bath
- Torrey Pines Hot Plate / Stirrer
Decommissioned Tools
(None currently listed)