Tools menu: Difference between revisions

From USC Nanofab Wiki
Jump to navigation Jump to search
No edit summary
No edit summary
Line 3: Line 3:
|
|
=== Tool Categories ===
=== Tool Categories ===
* Anneal & Furnace
* [[#Anneal-&-Furnace|Anneal & Furnace]]
* Deposition
* [[#Deposition|Deposition]]
* Dry Etching & Plasma Cleaning
* [[#Dry-Etching-&-Plasma-Cleaning|Dry Etching & Plasma Cleaning]]
* Lithography
* [[#Lithography|Lithography]]
* Metrology
* [[#Metrology|Metrology]]
* Packaging & Mechanical Tooling
* [[#Packaging-&-Mechanical-Tooling|Packaging & Mechanical Tooling]]
* PCB Processing
* [[#PCB-Processing|PCB Processing]]
* Wet Process
* [[#Wet-Process|Wet Process]]
|}
|}


= Anneal & Furnace =
= Anneal & Furnace = {#Anneal-&-Furnace}
* Rapid Thermal Annealer (RTA)
* Rapid Thermal Annealer (RTA)
* Cascade Tek Vacuum Oven
* Cascade Tek Vacuum Oven
Line 20: Line 20:
* Narco Vacuum Oven
* Narco Vacuum Oven


= Deposition =
= Deposition = {#Deposition}
== Chemical Vapor Deposition (CVD) ==
== Chemical Vapor Deposition (CVD) ==
* Oxford PECVD
* Oxford PECVD
Line 32: Line 32:
* KJL Sputter System
* KJL Sputter System


= Dry Etching & Plasma Cleaning =
= Dry Etching & Plasma Cleaning = {#Dry-Etching-&-Plasma-Cleaning}
== Reactive Ion / Deep Reactive Ion Etchers ==
== Reactive Ion / Deep Reactive Ion Etchers ==
* Oxford DRIE (Deep Si Etcher)
* Oxford DRIE (Deep Si Etcher)
Line 45: Line 45:
* YES O₂ Plasma System
* YES O₂ Plasma System


= Lithography =
= Lithography = {#Lithography}
== Direct-Write / Maskless ==
== Direct-Write / Maskless ==
* Raith EBPG5150 Electron Beam Lithography
* Raith EBPG5150 Electron Beam Lithography
Line 56: Line 56:
* Aligner D – SUSS MA/BA6 Gen4 (Advanced Photo Bay)
* Aligner D – SUSS MA/BA6 Gen4 (Advanced Photo Bay)


= Metrology =
= Metrology = {#Metrology}
== Thin-Film & Electrical ==
== Thin-Film & Electrical ==
* 4-Point Probe
* 4-Point Probe
Line 71: Line 71:
* Nikon Optical Microscope (unspecified model)
* Nikon Optical Microscope (unspecified model)


= Packaging & Mechanical Tooling =
= Packaging & Mechanical Tooling = {#Packaging-&-Mechanical-Tooling}
* F&S Bondtec Ball & Wedge Wire Bonder
* F&S Bondtec Ball & Wedge Wire Bonder
* DISCO DAD3350 Dicing Saw
* DISCO DAD3350 Dicing Saw
Line 79: Line 79:
* Gramatech Vacuum Bag Sealer
* Gramatech Vacuum Bag Sealer


= PCB Processing =
= PCB Processing = {#PCB-Processing}
* LPKF ProtoMat S103 PCB Mill
* LPKF ProtoMat S103 PCB Mill
* LPKF Contac S4 Electroplater
* LPKF Contac S4 Electroplater


= Wet Process =
= Wet Process = {#Wet-Process}
== Solvent Fume Hood (Metrology Bay) ==
== Solvent Fume Hood (Metrology Bay) ==
* Heated Ultrasonic Bath
* Heated Ultrasonic Bath
Line 136: Line 136:
== Decommissioned Tools ==
== Decommissioned Tools ==
(None currently listed)
(None currently listed)
This version uses the exact category names and simple bullet-list style you requested for the top box (Anneal & Furnace, Deposition, Dry Etching & Plasma Cleaning, Lithography, Metrology, Packaging & Mechanical Tooling, PCB Processing, Wet Process), with each category on its own line, matching the USC nanofab tool list organization. All tools are grouped under their respective categories.

Revision as of 13:29, 2 February 2026

Tool Categories

= Anneal & Furnace = {#Anneal-&-Furnace}

  • Rapid Thermal Annealer (RTA)
  • Cascade Tek Vacuum Oven
  • Blue M Furnace (Large)
  • Blue M Furnace (Small)
  • Narco Vacuum Oven

= Deposition = {#Deposition}

Chemical Vapor Deposition (CVD)

  • Oxford PECVD
  • Veeco ALD

Physical Vapor Deposition (PVD)

  • Angstrom E-Beam Evaporator
  • CHA E-Beam Evaporator
  • KJL E-Beam Evaporator
  • Temescal E-Beam Evaporator (Not in service)
  • KJL Sputter System

= Dry Etching & Plasma Cleaning = {#Dry-Etching-&-Plasma-Cleaning}

Reactive Ion / Deep Reactive Ion Etchers

  • Oxford DRIE (Deep Si Etcher)
  • Oxford DRIE-ALE (Atomic Layer Etcher – commissioning)
  • Oxford III-V Etcher (PlasmaPro 100 Cobra)
  • Oxford RIE (PlasmaPro 80 – Dielectrics)
  • XeF₂ Etcher

Plasma Cleaning / Ashing

  • Tegal O₂ Plasma Asher
  • Tegal Plasma Cleaner (Not in operation)
  • YES O₂ Plasma System

= Lithography = {#Lithography}

Direct-Write / Maskless

  • Raith EBPG5150 Electron Beam Lithography
  • Heidelberg DWL 66+ Direct Write Laser

Contact / Proximity Mask Aligners

  • Aligner A – SUSS MJB3 (Advanced Photo Bay)
  • Aligner B – SUSS MJB3 (Photo Bay)
  • Aligner C – SUSS MJB4 (Photo Bay)
  • Aligner D – SUSS MA/BA6 Gen4 (Advanced Photo Bay)

= Metrology = {#Metrology}

Thin-Film & Electrical

  • 4-Point Probe
  • DektakXT Profilometer
  • Ellipsometer
  • Filmetrics F20 Thin-Film Analyzer

Microscopy

  • Phenom ProX Desktop SEM
  • Nikon LV150 Optical Microscope
  • Max ERB Optical Microscope
  • Zeiss Optical Microscope
  • Nikon SMZ-10A Stereo Microscope
  • Nikon Optical Microscope (unspecified model)

= Packaging & Mechanical Tooling = {#Packaging-&-Mechanical-Tooling}

  • F&S Bondtec Ball & Wedge Wire Bonder
  • DISCO DAD3350 Dicing Saw
  • EQ Unipol-300 Mini Polisher / Grinder
  • LatticeAx 420 Cleaving System
  • LatticeGear FlipScribe Wafer Cleaver
  • Gramatech Vacuum Bag Sealer

= PCB Processing = {#PCB-Processing}

  • LPKF ProtoMat S103 PCB Mill
  • LPKF Contac S4 Electroplater

= Wet Process = {#Wet-Process}

Solvent Fume Hood (Metrology Bay)

  • Heated Ultrasonic Bath
  • Torrey Pines Hot Plate
  • Solvent Drains
  • N₂ Blow Guns

Acid Fume Hood – Left Side (Etch Bay)

  • Imtec Heated Bath
  • Quick-Dump-Rinse (QDR) Tank
  • DI Water Tap
  • N₂ Gun

Acid Fume Hood – Right Side (Etch Bay)

  • Imtec Heated Bath
  • Torrey Pines Hot Plate (Left)
  • Torrey Pines Hot Plate (Right)
  • Quick-Dump-Rinse (QDR) Tank
  • DI Water Tap
  • N₂ Sprayer

Resist Coating / Baking Fume Hood (Advanced Photo Bay)

  • Laurell Spinner – Left
  • Laurell Spinner – Right
  • Apogee Bake Plate 1
  • Apogee Bake Plate 2
  • Apogee Bake Plate 3
  • Apogee Bake Plate 4

Developer / Base Fume Hood – Left Side (Advanced Photo Bay)

  • Imtec Heated Bath
  • Torrey Pines Hot Plate
  • Quick-Dump-Rinse (QDR) Tank
  • DI Water Tap
  • N₂ Sprayer

Developer / Base Fume Hood – Right Side (Advanced Photo Bay)

  • Imtec Heated Bath
  • Torrey Pines Hot Plate
  • Quick-Dump-Rinse (QDR) Tank
  • DI Water Tap
  • N₂ Sprayer

E-Beam Resist Fume Hood (Photo Bay)

  • Headway Spinner – Left
  • Headway Spinner – Right
  • Apogee Hot Plate – Left
  • Apogee Hot Plate – Right
  • Ultrasonic Heated Bath
  • Torrey Pines Hot Plate / Stirrer

Decommissioned Tools

(None currently listed)