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| Line 21: | Line 21: | ||
= Deposition = {#Deposition} | = Deposition = {#Deposition} | ||
== Chemical Vapor Deposition (CVD) == | ===== Chemical Vapor Deposition (CVD) ===== | ||
* Oxford PECVD | * Oxford PECVD | ||
* Veeco ALD | * Veeco ALD | ||
== Physical Vapor Deposition (PVD) == | ===== Physical Vapor Deposition (PVD) ===== | ||
* Angstrom E-Beam Evaporator | * Angstrom E-Beam Evaporator | ||
* CHA E-Beam Evaporator | * CHA E-Beam Evaporator | ||
| Line 33: | Line 33: | ||
= Dry Etching & Plasma Cleaning = {#Dry-Etching-&-Plasma-Cleaning} | = Dry Etching & Plasma Cleaning = {#Dry-Etching-&-Plasma-Cleaning} | ||
== Reactive Ion / Deep Reactive Ion Etchers == | ===== Reactive Ion / Deep Reactive Ion Etchers ===== | ||
* Oxford DRIE (Deep Si Etcher) | * Oxford DRIE (Deep Si Etcher) | ||
* Oxford DRIE-ALE (Atomic Layer Etcher – commissioning) | * Oxford DRIE-ALE (Atomic Layer Etcher – commissioning) | ||
| Line 40: | Line 40: | ||
* XeF₂ Etcher | * XeF₂ Etcher | ||
== Plasma Cleaning / Ashing == | ===== Plasma Cleaning / Ashing ===== | ||
* Tegal O₂ Plasma Asher | * Tegal O₂ Plasma Asher | ||
* Tegal Plasma Cleaner (Not in operation) | * Tegal Plasma Cleaner (Not in operation) | ||
| Line 46: | Line 46: | ||
= Lithography = {#Lithography} | = Lithography = {#Lithography} | ||
== Direct-Write / Maskless == | ===== Direct-Write / Maskless ===== | ||
* Raith EBPG5150 Electron Beam Lithography | * Raith EBPG5150 Electron Beam Lithography | ||
* Heidelberg DWL 66+ Direct Write Laser | * Heidelberg DWL 66+ Direct Write Laser | ||
== Contact / Proximity Mask Aligners == | ===== Contact / Proximity Mask Aligners ===== | ||
* Aligner A – SUSS MJB3 (Advanced Photo Bay) | * Aligner A – SUSS MJB3 (Advanced Photo Bay) | ||
* Aligner B – SUSS MJB3 (Photo Bay) | * Aligner B – SUSS MJB3 (Photo Bay) | ||
| Line 57: | Line 57: | ||
= Metrology = {#Metrology} | = Metrology = {#Metrology} | ||
== Thin-Film & Electrical == | ===== Thin-Film & Electrical ===== | ||
* 4-Point Probe | * 4-Point Probe | ||
* DektakXT Profilometer | * DektakXT Profilometer | ||
| Line 63: | Line 63: | ||
* Filmetrics F20 Thin-Film Analyzer | * Filmetrics F20 Thin-Film Analyzer | ||
== Microscopy == | ===== Microscopy ===== | ||
* Phenom ProX Desktop SEM | * Phenom ProX Desktop SEM | ||
* Nikon LV150 Optical Microscope | * Nikon LV150 Optical Microscope | ||
| Line 84: | Line 84: | ||
= Wet Process = {#Wet-Process} | = Wet Process = {#Wet-Process} | ||
== Solvent Fume Hood (Metrology Bay) == | ===== Solvent Fume Hood (Metrology Bay) ===== | ||
* Heated Ultrasonic Bath | * Heated Ultrasonic Bath | ||
* Torrey Pines Hot Plate | * Torrey Pines Hot Plate | ||
| Line 90: | Line 90: | ||
* N₂ Blow Guns | * N₂ Blow Guns | ||
== Acid Fume Hood – Left Side (Etch Bay) == | ===== Acid Fume Hood – Left Side (Etch Bay) ===== | ||
* Imtec Heated Bath | * Imtec Heated Bath | ||
* Quick-Dump-Rinse (QDR) Tank | * Quick-Dump-Rinse (QDR) Tank | ||
| Line 96: | Line 96: | ||
* N₂ Gun | * N₂ Gun | ||
== Acid Fume Hood – Right Side (Etch Bay) == | ===== Acid Fume Hood – Right Side (Etch Bay) ===== | ||
* Imtec Heated Bath | * Imtec Heated Bath | ||
* Torrey Pines Hot Plate (Left) | * Torrey Pines Hot Plate (Left) | ||
| Line 104: | Line 104: | ||
* N₂ Sprayer | * N₂ Sprayer | ||
== Resist Coating / Baking Fume Hood (Advanced Photo Bay) == | ===== Resist Coating / Baking Fume Hood (Advanced Photo Bay) ===== | ||
* Laurell Spinner – Left | * Laurell Spinner – Left | ||
* Laurell Spinner – Right | * Laurell Spinner – Right | ||
| Line 112: | Line 112: | ||
* Apogee Bake Plate 4 | * Apogee Bake Plate 4 | ||
== Developer / Base Fume Hood – Left Side (Advanced Photo Bay) == | ===== Developer / Base Fume Hood – Left Side (Advanced Photo Bay) ===== | ||
* Imtec Heated Bath | * Imtec Heated Bath | ||
* Torrey Pines Hot Plate | * Torrey Pines Hot Plate | ||
| Line 119: | Line 119: | ||
* N₂ Sprayer | * N₂ Sprayer | ||
== Developer / Base Fume Hood – Right Side (Advanced Photo Bay) == | ===== Developer / Base Fume Hood – Right Side (Advanced Photo Bay) ===== | ||
* Imtec Heated Bath | * Imtec Heated Bath | ||
* Torrey Pines Hot Plate | * Torrey Pines Hot Plate | ||
| Line 126: | Line 126: | ||
* N₂ Sprayer | * N₂ Sprayer | ||
== E-Beam Resist Fume Hood (Photo Bay) == | ===== E-Beam Resist Fume Hood (Photo Bay) ===== | ||
* Headway Spinner – Left | * Headway Spinner – Left | ||
* Headway Spinner – Right | * Headway Spinner – Right | ||
Revision as of 13:30, 2 February 2026
Tool Categories |
= Anneal & Furnace = {#Anneal-&-Furnace}
- Rapid Thermal Annealer (RTA)
- Cascade Tek Vacuum Oven
- Blue M Furnace (Large)
- Blue M Furnace (Small)
- Narco Vacuum Oven
= Deposition = {#Deposition}
Chemical Vapor Deposition (CVD)
- Oxford PECVD
- Veeco ALD
Physical Vapor Deposition (PVD)
- Angstrom E-Beam Evaporator
- CHA E-Beam Evaporator
- KJL E-Beam Evaporator
- Temescal E-Beam Evaporator (Not in service)
- KJL Sputter System
= Dry Etching & Plasma Cleaning = {#Dry-Etching-&-Plasma-Cleaning}
Reactive Ion / Deep Reactive Ion Etchers
- Oxford DRIE (Deep Si Etcher)
- Oxford DRIE-ALE (Atomic Layer Etcher – commissioning)
- Oxford III-V Etcher (PlasmaPro 100 Cobra)
- Oxford RIE (PlasmaPro 80 – Dielectrics)
- XeF₂ Etcher
Plasma Cleaning / Ashing
- Tegal O₂ Plasma Asher
- Tegal Plasma Cleaner (Not in operation)
- YES O₂ Plasma System
= Lithography = {#Lithography}
Direct-Write / Maskless
- Raith EBPG5150 Electron Beam Lithography
- Heidelberg DWL 66+ Direct Write Laser
Contact / Proximity Mask Aligners
- Aligner A – SUSS MJB3 (Advanced Photo Bay)
- Aligner B – SUSS MJB3 (Photo Bay)
- Aligner C – SUSS MJB4 (Photo Bay)
- Aligner D – SUSS MA/BA6 Gen4 (Advanced Photo Bay)
= Metrology = {#Metrology}
Thin-Film & Electrical
- 4-Point Probe
- DektakXT Profilometer
- Ellipsometer
- Filmetrics F20 Thin-Film Analyzer
Microscopy
- Phenom ProX Desktop SEM
- Nikon LV150 Optical Microscope
- Max ERB Optical Microscope
- Zeiss Optical Microscope
- Nikon SMZ-10A Stereo Microscope
- Nikon Optical Microscope (unspecified model)
= Packaging & Mechanical Tooling = {#Packaging-&-Mechanical-Tooling}
- F&S Bondtec Ball & Wedge Wire Bonder
- DISCO DAD3350 Dicing Saw
- EQ Unipol-300 Mini Polisher / Grinder
- LatticeAx 420 Cleaving System
- LatticeGear FlipScribe Wafer Cleaver
- Gramatech Vacuum Bag Sealer
= PCB Processing = {#PCB-Processing}
- LPKF ProtoMat S103 PCB Mill
- LPKF Contac S4 Electroplater
= Wet Process = {#Wet-Process}
Solvent Fume Hood (Metrology Bay)
- Heated Ultrasonic Bath
- Torrey Pines Hot Plate
- Solvent Drains
- N₂ Blow Guns
Acid Fume Hood – Left Side (Etch Bay)
- Imtec Heated Bath
- Quick-Dump-Rinse (QDR) Tank
- DI Water Tap
- N₂ Gun
Acid Fume Hood – Right Side (Etch Bay)
- Imtec Heated Bath
- Torrey Pines Hot Plate (Left)
- Torrey Pines Hot Plate (Right)
- Quick-Dump-Rinse (QDR) Tank
- DI Water Tap
- N₂ Sprayer
Resist Coating / Baking Fume Hood (Advanced Photo Bay)
- Laurell Spinner – Left
- Laurell Spinner – Right
- Apogee Bake Plate 1
- Apogee Bake Plate 2
- Apogee Bake Plate 3
- Apogee Bake Plate 4
Developer / Base Fume Hood – Left Side (Advanced Photo Bay)
- Imtec Heated Bath
- Torrey Pines Hot Plate
- Quick-Dump-Rinse (QDR) Tank
- DI Water Tap
- N₂ Sprayer
Developer / Base Fume Hood – Right Side (Advanced Photo Bay)
- Imtec Heated Bath
- Torrey Pines Hot Plate
- Quick-Dump-Rinse (QDR) Tank
- DI Water Tap
- N₂ Sprayer
E-Beam Resist Fume Hood (Photo Bay)
- Headway Spinner – Left
- Headway Spinner – Right
- Apogee Hot Plate – Left
- Apogee Hot Plate – Right
- Ultrasonic Heated Bath
- Torrey Pines Hot Plate / Stirrer
Decommissioned Tools
(None currently listed)