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= Anneal & Furnace =
== Anneal & Furnace ==
* [[#RTA|RTA (Rapid Thermal Annealer)]]
* [[#RTA|RTA (Rapid Thermal Annealer)]]
* [[#Cascade Tek vacuum oven|Cascade Tek vacuum oven]]
* [[#Cascade Tek vacuum oven|Cascade Tek vacuum oven]]
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* [[#Narco vacuum oven|Narco vacuum oven]]
* [[#Narco vacuum oven|Narco vacuum oven]]


= Deposition =
== Deposition ==


== CVD ==
=== CVD (Chemical Vapor Deposition) ===
* [[#Oxford PECVD|Oxford PECVD]]
* [[#Oxford PECVD|Oxford PECVD]]
* [[#Veeco ALD|Veeco ALD]]
* [[#Veeco ALD|Veeco ALD]]


== PVD ==
=== PVD (Physical Vapor Deposition) ===
* [[#Angstrom Evaporator|Angstrom Evaporator]]
* [[#Angstrom Evaporator|Angstrom Evaporator]]
* [[#CHA Evaporator|CHA Evaporator]]
* [[#CHA Evaporator|CHA Evaporator]]
* [[#KJL Evaporator|KJL Evaporator]]
* [[#KJL Evaporator|KJL Evaporator]]
* [[#Temescal Metal e-beam evaporator|Temescal Metal e-beam evaporator]] (not in service)
* [[#Temescal Metal e-beam evaporator|Temescal Metal e-beam evaporator]] (Not in service)
* [[#KJL Sputter|KJL Sputter]]
* [[#KJL Sputter|KJL Sputter]]


= Dry Etching & Plasma Cleaning =
== Dry Etching & Plasma Cleaning ==


== Etchers ==
=== Etchers ===
* [[#Oxford DRIE|Oxford DRIE]]
* [[#Oxford DRIE|Oxford DRIE]]
* [[#Oxford DRIE-ALE|Oxford DRIE-ALE]] (commissioning in progress)
* [[#Oxford DRIE-ALE|Oxford DRIE-ALE]] (being commissioned)
* [[#Oxford III-V|Oxford III-V]]
* [[#Oxford III-V|Oxford III-V]]
* [[#Oxford RIE|Oxford RIE]]
* [[#Oxford RIE|Oxford RIE]]
* [[#XeF2 etcher|XeF2 etcher]]
* [[#XeF2 etcher|XeF2 etcher]]


== Plasma cleaning / ashing ==
=== Plasma Cleaning / Ashing ===
* [[#Tegal O2 Plasma Asher|Tegal O2 Plasma Asher]]
* [[#Tegal O2 Plasma Asher|Tegal O2 Plasma Asher]]
* [[#Tegal Plasma|Tegal Plasma]] (not in operation)
* [[#Tegal Plasma|Tegal Plasma]] (not in operation)
* [[#YES O2 Plasma|YES O2 Plasma]]
* [[#YES O2 Plasma|YES O2 Plasma]]


= Lithography =
== Lithography ==


== E-beam and laser ==
=== E-beam and Laser ===
* [[#Raith EBL|Raith EBL]]
* [[#Raith EBL|Raith EBL]]
* [[#Heidelberg DWL|Heidelberg DWL]]
* [[#Heidelberg DWL|Heidelberg DWL]]


== UV mask aligners ==
=== UV Mask Aligners ===
* [[#Aligner A (MJB3)|Aligner A (MJB3)]]
* [[#Aligner A (MJB3)|Aligner A (MJB3)]]
* [[#Aligner B (MJB3)|Aligner B (MJB3)]]
* [[#Aligner B (MJB3)|Aligner B (MJB3)]]
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* [[#Aligner D (MA BA6 Gen4)|Aligner D (MA BA6 Gen4)]]
* [[#Aligner D (MA BA6 Gen4)|Aligner D (MA BA6 Gen4)]]


= Metrology =
== Metrology ==


== Assorted metrology ==
=== Assorted Metrology ===
* [[#4-point Probe|4-point Probe]]
* [[#4-point Probe|4-point Probe]]
* [[#Dektak profilometer|Dektak profilometer]]
* [[#Dektak profilometer|Dektak profilometer]]
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* [[#Filmetrics F20|Filmetrics F20]]
* [[#Filmetrics F20|Filmetrics F20]]


== Microscopes ==
=== Microscopes ===
* [[#Desktop SEM|Desktop SEM]]
* [[#Desktop SEM|Desktop SEM]]
* [[#Nikon LV 150 optical microscope|Nikon LV 150 optical microscope]]
* [[#Nikon LV 150 optical microscope|Nikon LV 150 optical microscope]]
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* [[#Nikon optical microscope|Nikon optical microscope]]
* [[#Nikon optical microscope|Nikon optical microscope]]


= Packaging & Mechanical Tooling =
== Packaging & Mechanical Tooling ==


== Wafer and die processing ==
=== Wafer and Die Processing ===
* [[#Ball & Wedge bonder|Ball & Wedge bonder]]
* [[#Ball & Wedge bonder|Ball & Wedge bonder]]
* [[#Dicing Saw|Dicing Saw]]
* [[#Dicing Saw|Dicing Saw]]
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* [[#Vacuum Bag Sealer|Vacuum Bag Sealer]]
* [[#Vacuum Bag Sealer|Vacuum Bag Sealer]]


= PCB Processing =
== PCB Processing ==
 
* [[#LPKF PCB mill|LPKF PCB mill]]
* [[#LPKF PCB mill|LPKF PCB mill]]
* [[#LPKF electroplater|LPKF electroplater]]
* [[#LPKF electroplater|LPKF electroplater]]


= Wet Process =
== Wet Process ==
 
=== Fume Hoods & Stations ===
* Solvent Fume Hood (Metrology bay)
** Heated ultrasonic bath
** Torrey Pines hot plate / stirrer
** Solvent drains
** N2 sprayers


== Solvent fume hood (Metrology bay) ==
* Acid Fume Hood – Left (Etch bay) – Piranha & Nanostrip allowed
* Heated ultrasonic bath
** Heated bath (Imtec Accubath)
* Torrey Pines hot plate / stirrer
** Quick-dump-rinse tank (QDR)
* Solvent drains
** DI water tap
* N2 sprayers
** N2 gun


== Acid fume hood left (Etch bay) ==
* Acid Fume Hood – Right (Etch bay) – No Piranha/Nanostrip
* Heated bath (Imtec Accubath)
** Heated bath (Imtec Accubath)
* Quick-dump-rinse tank (QDR)
** Torrey Pines hot plate left
* DI water tap
** Torrey Pines hot plate right
* N2 gun
** Quick-dump-rinse tank (QDR)
** DI water tap
** N2 sprayer


== Acid fume hood right (Etch bay) ==
* Resist Fume Hood (Advanced Photo bay)
* Heated bath (Imtec Accubath)
** Spinner left (Laurell)
* Torrey Pines hot plate left
** Spinner right (Laurell)
* Torrey Pines hot plate right
** Bake plate 1 (Apogee)
* Quick-dump-rinse tank (QDR)
** Bake plate 2 (Apogee)
* DI water tap
** Bake plate 3 (Apogee)
* N2 sprayer
** Bake plate 4 (Apogee)


== Resist fume hood (Advanced Photo bay) ==
* Base & Developer Fume Hood – Left (Advanced Photo bay)
* Spinner left (Laurell)
** Heated bath (Imtec Accubath)
* Spinner right (Laurell)
** Torrey Pines hot plate
* Bake plate 1 (Apogee)
** Quick-dump-rinse tank (QDR)
* Bake plate 2 (Apogee)
** DI water tap
* Bake plate 3 (Apogee)
** N2 sprayer
* Bake plate 4 (Apogee)


== Base and developer fume hoods (Advanced Photo bay) ==
* Base & Developer Fume Hood – Right (Advanced Photo bay)
* Heated bath (Imtec Accubath)
** Heated bath (Imtec Accubath)
* Torrey Pines hot plate
** Torrey Pines hot plate
* Quick-dump-rinse tank (QDR)
** Quick-dump-rinse tank (QDR)
* DI water tap
** DI water tap
* N2 sprayer
** N2 sprayer


== E-beam resist fume hood (Photo bay) ==
* E-beam Resist Fume Hood (Photo bay)
* Headway spinner left
** Headway spinner left
* Headway spinner right
** Headway spinner right
* Apogee hot plate left
** Apogee hot plate left
* Apogee hot plate right
** Apogee hot plate right
* Ultrasonic heated bath
** Ultrasonic heated bath
* Torrey Pines hot plate / stirrer
** Torrey Pines hot plate / stirrer

Revision as of 13:43, 2 February 2026


Tool Categories

Anneal & Furnace

Deposition

CVD (Chemical Vapor Deposition)

PVD (Physical Vapor Deposition)

Dry Etching & Plasma Cleaning

Etchers

Plasma Cleaning / Ashing

Lithography

E-beam and Laser

UV Mask Aligners

Metrology

Assorted Metrology

Microscopes

Packaging & Mechanical Tooling

Wafer and Die Processing

PCB Processing

Wet Process

Fume Hoods & Stations

  • Solvent Fume Hood (Metrology bay)
    • Heated ultrasonic bath
    • Torrey Pines hot plate / stirrer
    • Solvent drains
    • N2 sprayers
  • Acid Fume Hood – Left (Etch bay) – Piranha & Nanostrip allowed
    • Heated bath (Imtec Accubath)
    • Quick-dump-rinse tank (QDR)
    • DI water tap
    • N2 gun
  • Acid Fume Hood – Right (Etch bay) – No Piranha/Nanostrip
    • Heated bath (Imtec Accubath)
    • Torrey Pines hot plate left
    • Torrey Pines hot plate right
    • Quick-dump-rinse tank (QDR)
    • DI water tap
    • N2 sprayer
  • Resist Fume Hood (Advanced Photo bay)
    • Spinner left (Laurell)
    • Spinner right (Laurell)
    • Bake plate 1 (Apogee)
    • Bake plate 2 (Apogee)
    • Bake plate 3 (Apogee)
    • Bake plate 4 (Apogee)
  • Base & Developer Fume Hood – Left (Advanced Photo bay)
    • Heated bath (Imtec Accubath)
    • Torrey Pines hot plate
    • Quick-dump-rinse tank (QDR)
    • DI water tap
    • N2 sprayer
  • Base & Developer Fume Hood – Right (Advanced Photo bay)
    • Heated bath (Imtec Accubath)
    • Torrey Pines hot plate
    • Quick-dump-rinse tank (QDR)
    • DI water tap
    • N2 sprayer
  • E-beam Resist Fume Hood (Photo bay)
    • Headway spinner left
    • Headway spinner right
    • Apogee hot plate left
    • Apogee hot plate right
    • Ultrasonic heated bath
    • Torrey Pines hot plate / stirrer
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