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{{tool2|{{PAGENAME}} | |||
|picture=Blue M oven big.jpg | |||
|type = Thermal Processing | |||
|super = Chandan Ramakrishnaiah | |||
|super2 = Shivakumar Bhaskaran | |||
|phone = (213) 551 6726 | |||
|location = Advanced Photo bay | |||
|email = <!-- Add USC email if needed, e.g. chandan@usc.edu or leave blank --> | |||
|description = Blue M OV-12A Large Drying Oven for baking, curing, and low-temperature annealing up to 260°C | |||
|manufacturer = Blue M (now part of Thermal Product Solutions) | |||
|materials = Substrates, photoresist, polymers, glass, metals (check restrictions per process) | |||
|toolid = <!-- Add your internal tool ID if you have one, or leave blank --> | |||
}} | |||
__TOC__ | |||
== About == | |||
[[File:Blue M oven big.jpg|thumb|300px|Blue M OV-12A Large Drying Oven in Advanced Photo Bay]] | |||
'''Process:''' This is a large-capacity forced-air convection drying oven designed for reliable, uniform heating at moderate temperatures. It is commonly used for baking photoresists, curing polymers, drying samples after wet processing, outgassing, or low-temperature annealing in a clean, controlled air environment. | |||
'''Hardware:''' Forced-air circulation with adjustable fan speed for excellent temperature uniformity. Stainless steel interior for cleanroom compatibility and easy cleaning. Digital temperature controller with over-temperature protection. Shelving system for multiple samples or larger substrates. Door with observation window and gasket seal. | |||
'''Atmosphere:''' | |||
* | * Ambient air (forced convection) | ||
* | * No vacuum or special gases (for inert or forming gas anneals, use RTA or other tools) | ||
* Optional N₂ purge if modified (not standard – confirm if equipped) | |||
'''Applications:''' | |||
* | * Post-bake and hard bake of photoresists (e.g., 90–180°C) | ||
* | * Curing of spin-on dielectrics, polyimides, or adhesives | ||
* | * Drying wafers/substrates after rinse or solvent clean | ||
* | * Low-temperature outgassing or degassing | ||
* | * Gentle thermal treatment of delicate samples | ||
* Aging or stability testing of materials | |||
'''Usage:''' Load samples on shelves, set temperature and time via controller, allow stabilization, run process. Use timer or manual monitoring. Cool down before opening door to avoid thermal shock or contamination. Follow SOP for loading/unloading and cleaning. | |||
== | == Detailed Specifications == | ||
* | * Model: Blue M OV-12A | ||
* | * Location: Advanced Photo bay | ||
* | * Substrate size: Flexible (wafers up to 8–12", cassettes, trays, or multiple pieces – check interior dimensions) | ||
* | * Temperature range: Ambient to 260°C | ||
* | * Temperature control: Digital PID controller with uniformity typically ±2–5°C across chamber (depending on load) | ||
* Heating: Electric elements with forced-air circulation | |||
* Features: Over-temperature safety cutoff, adjustable shelves, observation window, cleanroom-compatible design | |||
* Restrictions: Max 260°C (not for high-temperature processes); avoid volatile/corrosive chemicals that could damage interior or contaminate other users | |||
* Other: Large interior volume suitable for batch processing or bigger substrates | |||
== | == Documentation == | ||
* [[ | * [[:File:Blue M OV-12A Drying Oven SOP v1.pdf|SOP – Standard Operating Procedure]] | ||
* | * Training required – contact lab staff (Chandan Ramakrishnaiah or Shivakumar Bhaskaran) | ||
== | == Recipes & Data == | ||
* Standard Processes: Common bakes include: | |||
* Photoresist soft bake: 90–110°C | |||
* Post-exposure bake (PEB): 100–130°C | |||
* Hard bake: 120–180°C | |||
* Curing of SU-8 or polyimide: 150–250°C | |||
* Process Control: Verify temperature uniformity with thermocouple checks if needed. Monitor for contamination (e.g., particles) after use. | |||
* Notes: Allow pre-heat stabilization time (30–60 min) for best uniformity. Use foil or trays to protect shelves from spills. | |||
<!-- Optional: Add more images here if you have interior views, shelving, control panel, or example sample setups. --> | |||
Revision as of 14:26, 2 February 2026
About
Process: This is a large-capacity forced-air convection drying oven designed for reliable, uniform heating at moderate temperatures. It is commonly used for baking photoresists, curing polymers, drying samples after wet processing, outgassing, or low-temperature annealing in a clean, controlled air environment.
Hardware: Forced-air circulation with adjustable fan speed for excellent temperature uniformity. Stainless steel interior for cleanroom compatibility and easy cleaning. Digital temperature controller with over-temperature protection. Shelving system for multiple samples or larger substrates. Door with observation window and gasket seal.
Atmosphere:
- Ambient air (forced convection)
- No vacuum or special gases (for inert or forming gas anneals, use RTA or other tools)
- Optional N₂ purge if modified (not standard – confirm if equipped)
Applications:
- Post-bake and hard bake of photoresists (e.g., 90–180°C)
- Curing of spin-on dielectrics, polyimides, or adhesives
- Drying wafers/substrates after rinse or solvent clean
- Low-temperature outgassing or degassing
- Gentle thermal treatment of delicate samples
- Aging or stability testing of materials
Usage: Load samples on shelves, set temperature and time via controller, allow stabilization, run process. Use timer or manual monitoring. Cool down before opening door to avoid thermal shock or contamination. Follow SOP for loading/unloading and cleaning.
Detailed Specifications
- Model: Blue M OV-12A
- Location: Advanced Photo bay
- Substrate size: Flexible (wafers up to 8–12", cassettes, trays, or multiple pieces – check interior dimensions)
- Temperature range: Ambient to 260°C
- Temperature control: Digital PID controller with uniformity typically ±2–5°C across chamber (depending on load)
- Heating: Electric elements with forced-air circulation
- Features: Over-temperature safety cutoff, adjustable shelves, observation window, cleanroom-compatible design
- Restrictions: Max 260°C (not for high-temperature processes); avoid volatile/corrosive chemicals that could damage interior or contaminate other users
- Other: Large interior volume suitable for batch processing or bigger substrates
Documentation
- SOP – Standard Operating Procedure
- Training required – contact lab staff (Chandan Ramakrishnaiah or Shivakumar Bhaskaran)
Recipes & Data
- Standard Processes: Common bakes include:
* Photoresist soft bake: 90–110°C * Post-exposure bake (PEB): 100–130°C * Hard bake: 120–180°C * Curing of SU-8 or polyimide: 150–250°C
- Process Control: Verify temperature uniformity with thermocouple checks if needed. Monitor for contamination (e.g., particles) after use.
- Notes: Allow pre-heat stabilization time (30–60 min) for best uniformity. Use foil or trays to protect shelves from spills.