Temescal Metal e-beam evaporator
About
Status: Not in Service This Temescal metal e-beam evaporator is currently decommissioned or offline and not available for user processing. It may have been used historically for thin-film metal deposition via electron-beam evaporation.
Historical Process: (for reference only) High-vacuum e-beam evaporation system for depositing thin metal films with good thickness control. Likely featured a single or multi-pocket e-beam source, quartz crystal monitoring, and substrate fixturing for uniform deposition. Typical for contact metallization, adhesion layers, and general metal thin films in nanofabrication.
Hardware (historical): - E-beam gun (voltage/power not specified in current records) - Crucible/pocket configuration for metals - Substrate holder (likely with rotation or heating options) - Quartz crystal thickness monitor - High-vacuum chamber with pumping system
Gases: - None standard (high-vacuum thermal evaporation; no process gases required) - Optional inert backfill (e.g., Ar or N₂) if equipped
Applications (historical): - Metal contacts and interconnects - Adhesion/barrier layers - Electrodes and reflective coatings - Liftoff-compatible metal films
Current Usage: The tool is marked as **not in service**. Do not attempt to use it. Refer to active evaporators (e.g., Angstrom, CHA, KJL) for metal deposition needs. If reactivation is planned, contact lab staff for updates.
Detailed Specifications
- Model: Temescal Metal e-beam evaporator
- Location: Deposition bay 1
- Status: Not in service (as of latest wiki update)
- Substrate size: Likely up to 4–6" wafers or pieces (historical; not confirmed)
- Other: Legacy system – limited details available in current documentation
- Restrictions: Unavailable for processing until further notice
Documentation
- Legacy SOP (2009 – for reference only)
- Training: Not applicable (tool offline)
- Contact lab staff (Shiva) for status updates or alternative tools
Recipes & Data
- No active recipes or calibration data (tool not in service)
- Historical use likely included standard metal evaporation processes (e.g., Au, Ti, Cr deposition)
- For current metal deposition needs, refer to active tools: Angstrom Evaporator, CHA Evaporator, KJL Evaporator
Template:Under review This article was generated with assistance from a large language model (LLM) and is currently under human review and editing. Content may contain inaccuracies, unverified claims, or other issues. Please help improve it.