Tool list: Difference between revisions
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|+Resist fume hood | |||
!Tool | |||
!Description | |||
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|Spinner 1 | |||
|Laurell resist spinner (left side) | |||
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|Spinner 2 | |||
|Laurell resist spinner (right side) | |||
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|Bake plate 1 | |||
|Apogee bake plate | |||
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|Bake plate 2 | |||
|Apogee bake plate | |||
|- | |||
|Bake plate 3 | |||
|Apogee bake plate | |||
|- | |||
|Bake plate 4 | |||
|Apogee bake plate | |||
|} | |} | ||
{| class="wikitable" | {| class="wikitable" | ||
Revision as of 09:31, 10 February 2025
Annealing
| Tool | Description |
|---|---|
| RTA | Rapid Thermal Annealer |
Deposition
| Tool | Description |
|---|---|
| Veeco ALD | Atomic Layer Deposition |
| Oxford PECVD | Plasma-enhanced chemical vapor deposition |
| Tool | Description |
|---|---|
| Angstrom Evaporator | Angstrom Engineering e-beam evaporator |
| CHA Evaporator | CHA Industries e-beam evaporator |
| KJL Evaporator | Kurt J. Lesker e-beam evaporator |
| Temescal Metal | Temescal e-beam evaporator |
| KJL Sputter | Kurt J. Lesker sputterer |
Lithography
| Tool | Description |
|---|---|
| Raith EBL | Raith e-beam lithography EBPG5150 |
| Tool | Description |
|---|---|
| Heidelberg DWL | Heidelberg DWL 66+ (Direct Write Laser) |
| Tool | Description |
|---|---|
| Aligner A (MJB3) | MJB3 aligner |
| Aligner B (MJB3) | MJB3 aligner |
| Aligner C (MJB4) | MJB4 aligner |
| Aligner D (MA/BA) | MA/BA aligner |
| Tool | Description |
|---|---|
| O2 Plasma Asher | |
| Tegal Plasma | Tegal 915 Plasma Strip |
| YES O2 Plasma | YES Engineering O2 Plasma |
Etching
| Tool | Description |
|---|---|
| Oxford DRIE | Oxford System 100 Deep reactive-ion etcher |
| Oxford DRIE2 | Oxford System ? Deep reactive-ion etcher |
| Oxford III-V | Oxford PlasmaPro 100 Cobra III-V etcher |
| Oxford RIE | Oxford PlasmaPro 80 reactive ion etcher |
| XeF2 etcher | XeF2 etcher |
Metrology
| Tool | Description |
|---|---|
| 4-point Probe | Signatone 4-point probe |
| Dektak | Bruker DektakXT profilometer |
| Desktop SEM | Phenom ProX G6 Desktop Scanning Electron Microscope |
Oxidation
| Tool | Description |
|---|---|
| Oxide (lower) | |
| Oxide (upper) |
Packaging & Mechanical Tooling
| Tool | Description |
|---|---|
| Ball & Wedge bonder | F&S Bondtec 53BDA Deep-access & Ball-Wedge bonder |
| Scribe Tool | LatticeAx 420 Cleaving System |
| Dicing Saw | DISCO Corp. DAD3350 Dicing Saw |
| Vacuum Sealer | Gramatech GVS2600R Vacuum Sealer |
Testers
| Tool | Description |
|---|---|
| Keithley S530 | Keithley (Tektronix) S530 Parametric tester |
Wet Process
| Tool | Description |
|---|---|
| Heated ultrasonic bath | |
| Hot plate |
| Tool | Description |
|---|---|
| Tool | Description |
|---|---|
| Tool | Description |
|---|---|
| Spinner 1 | Laurell resist spinner (left side) |
| Spinner 2 | Laurell resist spinner (right side) |
| Bake plate 1 | Apogee bake plate |
| Bake plate 2 | Apogee bake plate |
| Bake plate 3 | Apogee bake plate |
| Bake plate 4 | Apogee bake plate |
| Tool | Description |
|---|---|
| Tool | Description |
|---|---|
| Tool | Description |
|---|---|
| Headway spinner left | Headway resist spinner |
| Headway spinner right | Headway resist spinner |
| Torrey Pines Hot Plate left | |
| Torrey Pines Hot Plate right | |
| Ultrasonic heated bath |