Tool list: Difference between revisions

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|+PVD (physical vapor deposition)
|+PVD (physical vapor deposition)
!Tool
!Tool
!Substrate size
!Substrate size  
(up to diameter)
!# of pockets
!# of pockets
!E-beam voltage
!E-beam voltage
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|[[Angstrom Evaporator]]
|[[Angstrom Evaporator]]
[[File:Angstrom Evaporator.jpg|frameless|200x200px]]
[[File:Angstrom Evaporator.jpg|frameless|200x200px]]
|Pieces up to 6" diameter
|6"
|4
|4
|10kV
|10kV
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|[[CHA Evaporator]]
|[[CHA Evaporator]]
[[File:CHA Evaporator.jpg|frameless|195x195px]]
[[File:CHA Evaporator.jpg|frameless|195x195px]]
|Pieces up to 6" diameter
|6"
|6 @ 15cc
|6 @ 15cc
|10kV
|10kV
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|-
|-
|[[KJL Evaporator]]
|[[KJL Evaporator]]
|
[[File:KJL Evaporator.jpg|frameless|150x150px]]
|6"
|4
|4
|5kV
|Ti, Au, Pt, Pd, Cr, Ni and Ag
|
|
|
|
|
* substrate rotation
|Kurt J. Lesker e-beam evaporator
* source to substrate distance is approx. 15″ (381mm)
|
|[[:File:KJL Metal SOP v1.pdf|SOP]],
[[:File:KJL Ebeam.mp4|how-to video]]
|-
|-
|[[Temescal Metal]]
|[[Temescal Metal]]
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|Temescal e-beam evaporator
|Temescal e-beam evaporator
|
|
|-
!Tool
!Substrate size
!# of sources
!Sputter power
!Deposition materials
!Gases
!Other features
!Links
|-
|-
|[[KJL Sputter]]
|[[KJL Sputter]]
[[File:KJL Sputter.jpg|frameless|150x150px]]
|6"
|5 total, 4 DC, 1 RF/DC
|
|
* DC sputter power 500 W
* RF sputter power 300 W
|Au, Pt, Ti, Al, W, Mo, Cu, SiO2, Al2O3, ITO
|Ar, O2
|
|
|
* Target size: 2"
|
* Substrate rotation
|
|[[:File:KJL Sputter SOP v2.pdf|SOP]]
|Kurt J. Lesker sputterer
|
|}
|}


Revision as of 13:14, 7 May 2025

Annealing

Tool Description
RTA Rapid Thermal Annealer

Deposition

CVD (chemical vapor deposition)
Tool Description
Veeco ALD Atomic Layer Deposition
Oxford PECVD Plasma-enhanced chemical vapor deposition
PVD (physical vapor deposition)
Tool Substrate size

(up to diameter)

# of pockets E-beam voltage Deposition materials Gases Other features Links
Angstrom Evaporator

6" 4 10kV Ti, Al, Al2O3 Ar, 5% O2 in Ar
  • variable angle stage
  • substrate rotation
  • substrate heater
  • ion mill for substrate cleaning
  • load lock
 SOP
CHA Evaporator

6" 6 @ 15cc 10kV Ti, Au, Pt, Pd, Cr, Ni and Ag
  • Sweep controller
  • motor-driven deposition shield
  • 8kW heater array
  • Lift-off fixturing
  • substrate rotation
  • substrate dome for twenty-two 100mm back loaded wafers
  • Inficon IC/6 for thickness control
 SOP
KJL Evaporator

6" 4 5kV Ti, Au, Pt, Pd, Cr, Ni and Ag
  • substrate rotation
  • source to substrate distance is approx. 15″ (381mm)
 SOP,

how-to video

Temescal Metal Temescal e-beam evaporator
Tool Substrate size # of sources Sputter power Deposition materials Gases Other features Links
KJL Sputter

6" 5 total, 4 DC, 1 RF/DC
  • DC sputter power 500 W
  • RF sputter power 300 W
 Au, Pt, Ti, Al, W, Mo, Cu, SiO2, Al2O3, ITO Ar, O2
  • Target size: 2"
  • Substrate rotation
 SOP

Lithography

E-beam lithography
Tool Description
Raith EBL Raith e-beam lithography EBPG5150
Laser writing
Tool Description
Heidelberg DWL Heidelberg DWL 66+ (Direct Write Laser)
Aligners
Tool Description
Aligners A and B (MJB3) MJB3 aligner
Aligner C (MJB4) MJB4 aligner
Aligner D (MA BA6 Gen4) MA/BA aligner

Dry Etching

See also: Dry etch equipment comparison.

Etchers
Tool Description
Oxford DRIE Oxford System 100 Deep reactive-ion etcher
Oxford DRIE-ALE Oxford Deep reactive-ion etcher and atomic-layer etcher.
Oxford III-V Oxford PlasmaPro 100 Cobra III-V etcher
Oxford RIE Oxford PlasmaPro 80 reactive ion etcher
XeF2 etcher XeF2 etcher
Plasma cleaning / ashing
Tool Description
O2 Plasma Asher
Tegal Plasma Tegal 915 Plasma Strip
YES O2 Plasma YES Engineering O2 Plasma

Metrology

Tool Description
4-point Probe Signatone 4-point probe
Dektak Bruker DektakXT profilometer
Desktop SEM Phenom ProX G6 Desktop Scanning Electron Microscope
Ellipsometer Thin film thickness measurement
F20 Thin film thickness measurement
Keithley S530 Keithley (Tektronix) S530 Parametric tester

Oxidation

Tool Description
Oxide (lower)
Oxide (upper)

Packaging & Mechanical Tooling

Tool Description
Ball & Wedge bonder F&S Bondtec 53BDA Deep-access & Ball-Wedge bonder
Dicing Saw DISCO Corp. DAD3350 Dicing Saw
Mini Polisher EQ Unipol-300 Mini (3") Automatic Grinder/ Polisher
Scribe Tool LatticeAx 420 Cleaving System
Vacuum Sealer Gramatech GVS2600R Vacuum Sealer

Wet Process

Solvent fume hood (in Metrology bay)
Tool Description
Heated ultrasonic bath
Hot plate
Acid fume hood left-side (in Etch bay)
Tool Description
Acid fume hood right-side (in Etch bay)
Tool Description
Resist fume hood
Tool Description
Spinner 1 Laurell resist spinner (left side)
Spinner 2 Laurell resist spinner (right side)
Bake plate 1 Apogee bake plate
Bake plate 2 Apogee bake plate
Bake plate 3 Apogee bake plate
Bake plate 4 Apogee bake plate
Base and developer fume hood left-side (in Advanced Photo bay)
Tool Description
Base and developer fume hood right-side (in Advanced Photo bay)
Tool Description
EBL-use-only fume hood (in Photo bay)
Tool Description
Headway spinner left Headway resist spinner
Headway spinner right Headway resist spinner
Torrey Pines Hot Plate left
Torrey Pines Hot Plate right
Ultrasonic heated bath
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