Tool list: Difference between revisions

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|+CVD (chemical vapor deposition)
|+CVD (chemical vapor deposition)
!Tool
!Tool
!Description
!Substrate size (up to diameter)
!Films available
!Gases
!Other features
!Links
|-
|-
|[[Veeco ALD]]
|[[Veeco ALD]]
|Atomic Layer Deposition
[[File:ALD.jpg|frameless|212x212px]]
|4"
|MgO, Al2O3, Pt, Ru, HfO2, ZrO2, TiO2
|N2 as a carrier gas
O2 or O3 as film precursor
|
* Reactor temperature: 150°C for most recipes, up to 270°C
* Ozone generator can replace O2 with O3
|[[:File:ALD Quick Start Guide - August 2023.pdf|SOP]]
|-
|-
|[[Oxford PECVD]]
|[[Oxford PECVD]]
|Plasma-enhanced chemical vapor deposition
[[File:PECVD.jpg|frameless|200x200px]]
|6" wafer
|SiO2, Si3N4, SiNO
|2% SiH4/N2, NH3, N2O, N2, He, CF4
|
* Electrode specs: 240mm diameter, up to 400°C
* Load lock
* No wafer clamping, fixed height
* RF power 300W
* LF power 500W
|[[:File:DEP-010 Oxford PECVD.pdf|SOP]]
|}
|}
{| class="wikitable"
{| class="wikitable"
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|-
|-
|[[KJL Evaporator]]
|[[KJL Evaporator]]
[[File:KJL Evaporator.jpg|frameless|150x150px]]
[[File:KJL Evaporator.jpg|frameless|200x200px]]
|6"
|6"
|4
|4
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|
|
|-
|-
!Tool
|
!Substrate size
!Substrate size
!# of sources
!# of sources
!Sputter power
!Sputter power
!Deposition materials
|
!Gases
|
!Other features
|
!Links
|
|-
|-
|[[KJL Sputter]]
|[[KJL Sputter]]
[[File:KJL Sputter.jpg|frameless|150x150px]]
[[File:KJL Sputter.jpg|frameless|200x200px]]
|6"
|6"
|5 total, 4 DC, 1 RF/DC
|5 total, 4 DC, 1 RF/DC

Revision as of 13:41, 7 May 2025

Annealing

Tool Description
RTA Rapid Thermal Annealer

Deposition

CVD (chemical vapor deposition)
Tool Substrate size (up to diameter) Films available Gases Other features Links
Veeco ALD

4" MgO, Al2O3, Pt, Ru, HfO2, ZrO2, TiO2 N2 as a carrier gas

O2 or O3 as film precursor

  • Reactor temperature: 150°C for most recipes, up to 270°C
  • Ozone generator can replace O2 with O3
 SOP
Oxford PECVD

6" wafer SiO2, Si3N4, SiNO 2% SiH4/N2, NH3, N2O, N2, He, CF4
  • Electrode specs: 240mm diameter, up to 400°C
  • Load lock
  • No wafer clamping, fixed height
  • RF power 300W
  • LF power 500W
 SOP
PVD (physical vapor deposition)
Tool Substrate size

(up to diameter)

# of pockets E-beam voltage Deposition materials Gases Other features Links
Angstrom Evaporator

6" 4 10kV Ti, Al, Al2O3 Ar, 5% O2 in Ar
  • variable angle stage
  • substrate rotation
  • substrate heater
  • ion mill for substrate cleaning
  • load lock
 SOP
CHA Evaporator

6" 6 @ 15cc 10kV Ti, Au, Pt, Pd, Cr, Ni and Ag
  • Sweep controller
  • motor-driven deposition shield
  • 8kW heater array
  • Lift-off fixturing
  • substrate rotation
  • substrate dome for twenty-two 100mm back loaded wafers
  • Inficon IC/6 for thickness control
 SOP
KJL Evaporator

6" 4 5kV Ti, Au, Pt, Pd, Cr, Ni and Ag
  • substrate rotation
  • source to substrate distance is approx. 15″ (381mm)
 SOP,

how-to video

Temescal Metal Temescal e-beam evaporator
Substrate size # of sources Sputter power
KJL Sputter

6" 5 total, 4 DC, 1 RF/DC
  • DC sputter power 500 W
  • RF sputter power 300 W
 Au, Pt, Ti, Al, W, Mo, Cu, SiO2, Al2O3, ITO Ar, O2
  • Target size: 2"
  • Substrate rotation
 SOP

Lithography

E-beam lithography
Tool Description
Raith EBL Raith e-beam lithography EBPG5150
Laser writing
Tool Description
Heidelberg DWL Heidelberg DWL 66+ (Direct Write Laser)
Aligners
Tool Description
Aligners A and B (MJB3) MJB3 aligner
Aligner C (MJB4) MJB4 aligner
Aligner D (MA BA6 Gen4) MA/BA aligner

Dry Etching

See also: Dry etch equipment comparison.

Etchers
Tool Description
Oxford DRIE Oxford System 100 Deep reactive-ion etcher
Oxford DRIE-ALE Oxford Deep reactive-ion etcher and atomic-layer etcher.
Oxford III-V Oxford PlasmaPro 100 Cobra III-V etcher
Oxford RIE Oxford PlasmaPro 80 reactive ion etcher
XeF2 etcher XeF2 etcher
Plasma cleaning / ashing
Tool Description
O2 Plasma Asher
Tegal Plasma Tegal 915 Plasma Strip
YES O2 Plasma YES Engineering O2 Plasma

Metrology

Tool Description
4-point Probe Signatone 4-point probe
Dektak Bruker DektakXT profilometer
Desktop SEM Phenom ProX G6 Desktop Scanning Electron Microscope
Ellipsometer Thin film thickness measurement
F20 Thin film thickness measurement
Keithley S530 Keithley (Tektronix) S530 Parametric tester

Oxidation

Tool Description
Oxide (lower)
Oxide (upper)

Packaging & Mechanical Tooling

Tool Description
Ball & Wedge bonder F&S Bondtec 53BDA Deep-access & Ball-Wedge bonder
Dicing Saw DISCO Corp. DAD3350 Dicing Saw
Mini Polisher EQ Unipol-300 Mini (3") Automatic Grinder/ Polisher
Scribe Tool LatticeAx 420 Cleaving System
Vacuum Sealer Gramatech GVS2600R Vacuum Sealer

Wet Process

Solvent fume hood (in Metrology bay)
Tool Description
Heated ultrasonic bath
Hot plate
Acid fume hood left-side (in Etch bay)
Tool Description
Acid fume hood right-side (in Etch bay)
Tool Description
Resist fume hood
Tool Description
Spinner 1 Laurell resist spinner (left side)
Spinner 2 Laurell resist spinner (right side)
Bake plate 1 Apogee bake plate
Bake plate 2 Apogee bake plate
Bake plate 3 Apogee bake plate
Bake plate 4 Apogee bake plate
Base and developer fume hood left-side (in Advanced Photo bay)
Tool Description
Base and developer fume hood right-side (in Advanced Photo bay)
Tool Description
EBL-use-only fume hood (in Photo bay)
Tool Description
Headway spinner left Headway resist spinner
Headway spinner right Headway resist spinner
Torrey Pines Hot Plate left
Torrey Pines Hot Plate right
Ultrasonic heated bath
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