Tool list: Difference between revisions
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|Oxford System 100 Deep reactive-ion etcher | |Oxford System 100 Deep reactive-ion etcher | ||
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|[[Oxford | |[[Oxford DRIE-ALE]] | ||
|Oxford | |Oxford Deep reactive-ion etcher and atomic-layer etcher. | ||
|- | |- | ||
|[[Oxford III-V]] | |[[Oxford III-V]] | ||
Revision as of 15:55, 24 March 2025
Annealing
| Tool | Description |
|---|---|
| RTA | Rapid Thermal Annealer |
Deposition
| Tool | Description |
|---|---|
| Veeco ALD | Atomic Layer Deposition |
| Oxford PECVD | Plasma-enhanced chemical vapor deposition |
| Tool | Description |
|---|---|
| Angstrom Evaporator | Angstrom Engineering e-beam evaporator |
| CHA Evaporator | CHA Industries e-beam evaporator |
| KJL Evaporator | Kurt J. Lesker e-beam evaporator |
| Temescal Metal | Temescal e-beam evaporator |
| KJL Sputter | Kurt J. Lesker sputterer |
Lithography
| Tool | Description |
|---|---|
| Raith EBL | Raith e-beam lithography EBPG5150 |
| Tool | Description |
|---|---|
| Heidelberg DWL | Heidelberg DWL 66+ (Direct Write Laser) |
| Tool | Description |
|---|---|
| Aligners A and B (MJB3) | MJB3 aligner |
| Aligner C (MJB4) | MJB4 aligner |
| Aligner D (MA BA6 Gen4) | MA/BA aligner |
Dry Etching
| Tool | Description |
|---|---|
| Oxford DRIE | Oxford System 100 Deep reactive-ion etcher |
| Oxford DRIE-ALE | Oxford Deep reactive-ion etcher and atomic-layer etcher. |
| Oxford III-V | Oxford PlasmaPro 100 Cobra III-V etcher |
| Oxford RIE | Oxford PlasmaPro 80 reactive ion etcher |
| XeF2 etcher | XeF2 etcher |
| Tool | Description |
|---|---|
| O2 Plasma Asher | |
| Tegal Plasma | Tegal 915 Plasma Strip |
| YES O2 Plasma | YES Engineering O2 Plasma |
| Oxford III-V | Oxford RIE | Oxford DRIE | XeF2 etcher | YES O2 Plasma | |
|---|---|---|---|---|---|
| Model | Oxford PlasmaPro 100 Cobra 180 | Oxford PlasmaPro 80 RIE | Oxford System 100 Phoenix GP | Custom-built | CV200RFS(E) |
| Use case | Etching III-V materials | Etching dielectrics | Etching deep Si with Bosch process | Etching Si quickly and isotropically with high selectivity | Descum, photoresist stripping, or organic material removal |
| Allowed materials | InP, InAs, GaN, AlGaAs, InGaAsP, ITO, Si, SiC, MoS2, WSe, Graphene | SiO2, SiN, HfO2 | Si, SiO2, SiN, Parylene, polyimide, LiNbO3, BCB | Si | Photoresist, graphene, CNT |
| Material restrictions | No exposed metals (except Cr)
No deep etching polymers (>1 µm) |
No exposed metals (except Cr)
No deep etching polymers (>1 µm) |
No exposed metals (except Cr) | None | None |
| Load lock | Yes | Yes | |||
| Substrate size | 4" wafer clamp
Smaller pieces may go onto carrier wafers 2″, 3″, 4″, 6″, 8″ wafers possible |
Up to 200 mm wafers | 4" wafer clamp
Smaller pieces may go onto carrier wafers 2″, 3″, 4″, 6″, 8″ wafers possible |
Up to 100 mm wafers | Up to 200 mm wafers |
| Ar | Yes | Yes | Yes | ||
| O2 | Yes | Yes | Yes | Yes | |
| CF4 | Yes | Yes | |||
| CHF3 | Yes | Yes | |||
| SF6 | Yes | Yes | Yes | ||
| C4F8 | Yes | ||||
| CH4 | Yes | ||||
| H2 | Yes | ||||
| Cl2 | Yes | ||||
| BCl3 | Yes | ||||
| SiCl4 | Yes | ||||
| XeF2 | Yes | ||||
| Table RF power (max) | 300W | 300W | 600W | 1000W | |
| ICP power (max) | 1500W | 3000W | |||
| He backside cooling | Yes | Yes | |||
| Table temperature | -120 to 200C | 20C | 20C | 20C | Ambient - 250C |
| Endpoint detection | Horiba Jobin Yvon
LEM G50 |
Horiba Jobin Yvon
LEM G50 |
Metrology
| Tool | Description |
|---|---|
| 4-point Probe | Signatone 4-point probe |
| Dektak | Bruker DektakXT profilometer |
| Desktop SEM | Phenom ProX G6 Desktop Scanning Electron Microscope |
Oxidation
| Tool | Description |
|---|---|
| Oxide (lower) | |
| Oxide (upper) |
Packaging & Mechanical Tooling
| Tool | Description |
|---|---|
| Ball & Wedge bonder | F&S Bondtec 53BDA Deep-access & Ball-Wedge bonder |
| Dicing Saw | DISCO Corp. DAD3350 Dicing Saw |
| Polisher | EQ Unipol-300 Mini (3") Automatic Grinder/ Polisher |
| Scribe Tool | LatticeAx 420 Cleaving System |
| Vacuum Sealer | Gramatech GVS2600R Vacuum Sealer |
Testers
| Tool | Description |
|---|---|
| Keithley S530 | Keithley (Tektronix) S530 Parametric tester |
Wet Process
| Tool | Description |
|---|---|
| Heated ultrasonic bath | |
| Hot plate |
| Tool | Description |
|---|---|
| Tool | Description |
|---|---|
| Tool | Description |
|---|---|
| Spinner 1 | Laurell resist spinner (left side) |
| Spinner 2 | Laurell resist spinner (right side) |
| Bake plate 1 | Apogee bake plate |
| Bake plate 2 | Apogee bake plate |
| Bake plate 3 | Apogee bake plate |
| Bake plate 4 | Apogee bake plate |
| Tool | Description |
|---|---|
| Tool | Description |
|---|---|
| Tool | Description |
|---|---|
| Headway spinner left | Headway resist spinner |
| Headway spinner right | Headway resist spinner |
| Torrey Pines Hot Plate left | |
| Torrey Pines Hot Plate right | |
| Ultrasonic heated bath |