Tool list: Difference between revisions

From USC Nanofab Wiki
Jump to navigation Jump to search
← Older editNewer edit →
J (talk | contribs)
Bureaucrats, Interface administrators, Suppressors, Administrators
587 edits
VisualWikitext
m Edit DRIE-ALE title
Move dry etch comparison to dedicated page.
Line 75: Line 75:


== Dry Etching ==
== Dry Etching ==
See also this [[Dry etch equipment comparison]].
{| class="wikitable"
{| class="wikitable"
|+Etchers
|+Etchers
Line 108: Line 111:
|[[YES O2 Plasma]]
|[[YES O2 Plasma]]
|YES Engineering O2 Plasma
|YES Engineering O2 Plasma
|}
{| class="wikitable"
|+Dry etch equipment comparison
!
![[Oxford III-V]]
![[Oxford RIE]]
![[Oxford DRIE]]
![[XeF2 etcher]]
![[YES O2 Plasma]]
|-
!Model
|Oxford PlasmaPro 100 Cobra 180
|Oxford PlasmaPro 80 RIE
|Oxford System 100 Phoenix GP
|Custom-built
|CV200RFS(E)
|-
!Use case
|Etching III-V materials
|Etching dielectrics
|Etching deep Si with Bosch process
|Etching Si quickly and isotropically with high selectivity
|Descum, photoresist stripping, or organic material removal
|-
!Allowed materials
|InP, InAs, GaN, AlGaAs, InGaAsP, ITO, Si, SiC, MoS2, WSe, Graphene
|SiO2, SiN, HfO2
|Si, SiO2, SiN, Parylene, polyimide, LiNbO3, BCB
|Si
|Photoresist, graphene, CNT
|-
!Material restrictions
|No exposed metals (except Cr)
No deep etching polymers (>1 µm)
|No exposed metals (except Cr)
No deep etching polymers (>1 µm)
|No exposed metals (except Cr)
|None
|None
|-
!Load lock
|Yes
|
|Yes
|
|
|-
!Substrate size
|4" wafer clamp
Smaller pieces may go onto carrier wafers
2″, 3″, 4″, 6″, 8″ wafers possible
|Up to 200 mm wafers
|4" wafer clamp
Smaller pieces may go onto carrier wafers
2″, 3″, 4″, 6″, 8″ wafers possible
|Up to 100 mm wafers
|Up to 200 mm wafers
|-
!Ar
|Yes
|Yes
|Yes
|
|
|-
!O2
|Yes
|Yes
|Yes
|
|Yes
|-
!CF4
|
|Yes
|Yes
|
|
|-
!CHF3
|
|Yes
|Yes
|
|
|-
!SF6
|Yes
|Yes
|Yes
|
|
|-
!C4F8
|
|
|Yes
|
|
|-
!CH4
|Yes
|
|
|
|
|-
!H2
|Yes
|
|
|
|
|-
!Cl2
|Yes
|
|
|
|
|-
!BCl3
|Yes
|
|
|
|
|-
!SiCl4
|Yes
|
|
|
|
|-
!XeF2
|
|
|
|Yes
|
|-
!Table RF power (max)
|300W
|300W
|600W
|
|1000W
|-
!ICP power (max)
|1500W
|
|3000W
|
|
|-
!He backside cooling
|Yes
|
|Yes
|
|
|-
!Table temperature
| -120 to 200C
|20C
|20C
|20C
|Ambient - 250C
|-
!Endpoint detection
|Horiba Jobin Yvon
LEM G50
|Horiba Jobin Yvon
LEM G50
|
|
|
|}
|}


Revision as of 13:39, 26 March 2025

Annealing

Tool Description
RTA Rapid Thermal Annealer

Deposition

CVD (chemical vapor deposition)
Tool Description
Veeco ALD Atomic Layer Deposition
Oxford PECVD Plasma-enhanced chemical vapor deposition
PVD (physical vapor deposition)
Tool Description
Angstrom Evaporator Angstrom Engineering e-beam evaporator
CHA Evaporator CHA Industries e-beam evaporator
KJL Evaporator Kurt J. Lesker e-beam evaporator
Temescal Metal Temescal e-beam evaporator
KJL Sputter Kurt J. Lesker sputterer

Lithography

E-beam lithography
Tool Description
Raith EBL Raith e-beam lithography EBPG5150
Laser writing
Tool Description
Heidelberg DWL Heidelberg DWL 66+ (Direct Write Laser)
Aligners
Tool Description
Aligners A and B (MJB3) MJB3 aligner
Aligner C (MJB4) MJB4 aligner
Aligner D (MA BA6 Gen4) MA/BA aligner

Dry Etching

See also this Dry etch equipment comparison.

Etchers
Tool Description
Oxford DRIE Oxford System 100 Deep reactive-ion etcher
Oxford DRIE-ALE Oxford Deep reactive-ion etcher and atomic-layer etcher.
Oxford III-V Oxford PlasmaPro 100 Cobra III-V etcher
Oxford RIE Oxford PlasmaPro 80 reactive ion etcher
XeF2 etcher XeF2 etcher
Plasma cleaning / ashing
Tool Description
O2 Plasma Asher
Tegal Plasma Tegal 915 Plasma Strip
YES O2 Plasma YES Engineering O2 Plasma

Metrology

Tool Description
4-point Probe Signatone 4-point probe
Dektak Bruker DektakXT profilometer
Desktop SEM Phenom ProX G6 Desktop Scanning Electron Microscope

Oxidation

Tool Description
Oxide (lower)
Oxide (upper)

Packaging & Mechanical Tooling

Tool Description
Ball & Wedge bonder F&S Bondtec 53BDA Deep-access & Ball-Wedge bonder
Dicing Saw DISCO Corp. DAD3350 Dicing Saw
Polisher EQ Unipol-300 Mini (3") Automatic Grinder/ Polisher
Scribe Tool LatticeAx 420 Cleaving System
Vacuum Sealer Gramatech GVS2600R Vacuum Sealer

Testers

Tool Description
Keithley S530 Keithley (Tektronix) S530 Parametric tester

Wet Process

Solvent fume hood (in Metrology bay)
Tool Description
Heated ultrasonic bath
Hot plate
Acid fume hood left-side (in Etch bay)
Tool Description
Acid fume hood right-side (in Etch bay)
Tool Description
Resist fume hood
Tool Description
Spinner 1 Laurell resist spinner (left side)
Spinner 2 Laurell resist spinner (right side)
Bake plate 1 Apogee bake plate
Bake plate 2 Apogee bake plate
Bake plate 3 Apogee bake plate
Bake plate 4 Apogee bake plate
Base and developer fume hood left-side (in Advanced Photo bay)
Tool Description
Base and developer fume hood right-side (in Advanced Photo bay)
Tool Description
EBL-use-only fume hood (in Photo bay)
Tool Description
Headway spinner left Headway resist spinner
Headway spinner right Headway resist spinner
Torrey Pines Hot Plate left
Torrey Pines Hot Plate right
Ultrasonic heated bath
Retrieved from "https://wiki.nanofab.usc.edu/index.php?title=Tool_list&oldid=80"