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16:4516:45, 21 April 2026 Etcher Comparison (hist | edit) [7,893 bytes] Chandanr (talk | contribs) (Created page with " {| class="wikitable" style="width:100%; border:3px solid #990000; background:#ffffff; text-align:left;" |- ! style="background:#990000; color:#FFCC00; padding:10px; border:2px solid #990000; min-width:120px;" | Feature ! style="background:#990000; color:#FFCC00; padding:10px; border:2px solid #990000;" | Oxford RIE ! sty...")

12:0612:06, 17 February 2026 Keithley S530 Parametric Test System (hist | edit) [3,896 bytes] Chandanr (talk | contribs) (Created page with "== About == thumb|300px|Keithley S530 Parametric Test System (typical rack with SMUs, switching, and optional testhead/probe interface) '''Process:''' This is a semiconductor parametric test system for automated wafer/device electrical characterization, primarily DC I-V and C-V measurements. It integrates with probers (e.g., Electroglas 4080X) for PCM/TEG/production monitoring. '''Hardware:''' Keithley S530 (built around...")
11:5811:58, 17 February 2026 Electroglas 4080X (hist | edit) [3,870 bytes] Chandanr (talk | contribs) (Created page with "TOC == About == thumb|300px|Electroglas 4080X Automated Wafer Prober '''Process:''' This is an automated wafer prober used for wafer-level electrical testing preparation. It accurately places the wafer under a probe card, uses vision for alignment, and steps across die sites to enable a connected tester to perform electrical measurements and record/sort results. '''Hardware:''' Electroglas 4080X prober (modular: handler + probe...")

16:2016:20, 5 February 2026 Process Control Data (hist | edit) [4,012 bytes] Chandanr (talk | contribs) (Created page with "Process Control Data are standardized test processes, run by the USC Nanofab, allowing day-to-day or year-by-year comparisons of tool performance at the process level. This is similar to Statistical Process Control (SPC). These links appear on individual tool pages under the Process Control section. TOC Data are collected by trained users, Process Engineers, or interns and reviewed by Nanofab Staff. =Deposition, Dielectric (Process Control Data)= File:PECVD SPC Chart E...") Tag: Visual edit: Switched

14:5914:59, 4 February 2026 RIE 80 Standard Recipe Calibration (hist | edit) [116 bytes] Chandanr (talk | contribs) (Created page with "https://docs.google.com/spreadsheets/d/1cleuEcpL6Nnjj40jUlnfaEt4aXEZ23ReL1UCT6eQsUY/edit?gid=873136343#gid=873136343")

17:1517:15, 2 February 2026 Torrey Pines hot plate / stirrer (hist | edit) [3,221 bytes] Chandanr (talk | contribs) (Created page with "__TOC__ == About == thumb|300px|Torrey Pines HS70 Hot Plate / Stirrer in E-beam Resist Fume Hood (Photo Bay) '''Process:''' This is a digital hot plate with integrated magnetic stirrer used for controlled heating and mixing of solutions in the e-beam resist workflow. It provides precise temperature regulation and stirring for consistent preparation of resists, developers, or other liquids before coating or processing. '''Hardware:''...")
17:1417:14, 2 February 2026 Apogee Hot Plate (hist | edit) [3,366 bytes] Chandanr (talk | contribs) (Created page with "__TOC__ == About == thumb|300px|Apogee Hot Plates (left & right) in E-beam Resist Fume Hood (Photo Bay) '''Process:''' These are digital hot plates optimized for controlled baking of e-beam resists and other sensitive materials used in high-resolution lithography. They provide uniform heating with precise temperature and time control, critical for pre-exposure bake, post-exposure bake (if applicable), and curing steps in e-beam workf...")
17:1317:13, 2 February 2026 Headway Spinner (hist | edit) [3,144 bytes] Chandanr (talk | contribs) (Created page with "__TOC__ == About == thumb|300px|Headway CB15 Spinners in E-beam Resist Fume Hood (Photo Bay) '''Process:''' These are high-precision programmable spinners designed for uniform coating of e-beam resists and other sensitive materials. They offer excellent thickness control through adjustable spin speed, acceleration, and time, with vacuum chuck hold-down for flatness. Two units (left and right) are available in the dedicated e-beam res...")
17:1217:12, 2 February 2026 Apogee Bake Plate (hist | edit) [3,210 bytes] Chandanr (talk | contribs) (Created page with "__TOC__ == About == thumb|300px|Apogee Bake Plates (1–4) in Resist Fume Hood (Advanced Photo Bay) '''Process:''' These are digital hot plates optimized for controlled baking of photoresists, polymers, and thin films. They provide uniform heating with precise temperature and time control, essential for soft bake, post-exposure bake (PEB), hard bake, and curing steps in lithography workflows. '''Hardware:''' Four Apogee hot plates (labele...")
17:1117:11, 2 February 2026 Laurell Spinner (hist | edit) [2,867 bytes] Chandanr (talk | contribs) (Created page with "__TOC__ == About == thumb|300px|Laurell Resist Spinners in Resist Fume Hood (Advanced Photo Bay) '''Process:''' These are high-precision programmable spinners used for uniform coating of photoresists, polymers, and thin films on substrates. They provide excellent thickness control through adjustable spin speed, acceleration, and time, with vacuum chuck hold-down for flatness. '''Hardware:''' Laurell spinner with vacuum chuck for wafer/pie...")
17:0917:09, 2 February 2026 Imtec Accubath (hist | edit) [3,054 bytes] Chandanr (talk | contribs) (Created page with "__TOC__ == About == thumb|300px|Imtec Accubath Heated Bath – Left side (Acid Fume Hood, Etch Bay) '''Process:''' This is a temperature-controlled chemical bath designed for precise heating of acids, bases, and cleaning solutions. It is the only bath in the lab approved for Piranha (H₂SO₄/H₂O₂) and Nanostrip use, making it critical for organic residue removal, photoresist stripping, and wafer cleaning. '''Hardware:''' Imtec Ac...")
17:0717:07, 2 February 2026 Torrey Pines hot plate (hist | edit) [3,431 bytes] Chandanr (talk | contribs) (Created page with "__TOC__ == About == thumb|300px|Torrey Pines HS70 Hot Plate/Stirrer (shown in solvent fume hood setup) '''Process:''' These are digital hot plate/stirrers used for controlled heating, evaporation, mixing, or baking of solutions and samples in fume hoods. They provide precise temperature regulation and magnetic stirring for consistent results in wet processing workflows. '''Hardware:''' Torrey Pines HS70 series hot plate with integrated m...")
17:0517:05, 2 February 2026 Heated ultrasonic bath (hist | edit) [3,110 bytes] Chandanr (talk | contribs) (Created page with "__TOC__ == About == thumb|300px|Heated Ultrasonic Bath in Solvent Fume Hood (Metrology Bay) '''Process:''' This is a temperature-controlled ultrasonic bath used for solvent-based cleaning, cavitation-assisted particle removal, degassing of liquids, and dissolution of residues. Ultrasonic waves create microscopic bubbles that implode, dislodging contaminants from surfaces without mechanical abrasion. '''Hardware:''' Heated tank with ultra...")
17:0417:04, 2 February 2026 LPKF electroplater (hist | edit) [2,972 bytes] Chandanr (talk | contribs) (Created page with "__TOC__ == About == thumb|300px|LPKF Contac S4 Electroplater in Common Chase '''Status: Not Yet in Use''' This tool is installed but not currently operational. It requires procurement and setup of the appropriate plating chemistry set. Contact lab staff if interested in bringing it online for through-hole copper electroplating. '''Process (planned):''' The LPKF Contac S4 is a compact, multistep electroplating system designed...")
17:0317:03, 2 February 2026 LPKF PCB mill (hist | edit) [3,299 bytes] Chandanr (talk | contribs) (Created page with "__TOC__ == About == thumb|300px|LPKF ProtoMat S103 PCB Milling Machine in Common Chase '''Process:''' This is a high-precision desktop PCB milling, drilling, and routing system for rapid prototyping of single- and double-sided printed circuit boards. It uses mechanical milling bits to remove copper and substrate material, enabling fast turnaround from design file to functional PCB without chemicals or etching. '''Hardware:''' H...")
17:0317:03, 2 February 2026 Vacuum Bag Sealer (hist | edit) [3,133 bytes] Chandanr (talk | contribs) (Created page with "__TOC__ == About == thumb|300px|Gramatech GVS2600R Vacuum Bag Sealer in Advanced Photo Bay '''Process:''' This is a heavy-duty vacuum heat sealer designed for creating air-tight, moisture-free packages for sensitive samples, wafers, or devices. It supports N₂ purging before sealing to displace oxygen and moisture, providing inert atmosphere storage or shipping protection. '''Hardware:''' 36" (914 mm) maximum sealing width for...")
17:0217:02, 2 February 2026 FlipScribe Cleaver (hist | edit) [3,190 bytes] Chandanr (talk | contribs) (Created page with "__TOC__ == About == thumb|300px|LatticeGear FlipScribe Cleaver in Photo Bay '''Process:''' The FlipScribe is a specialized scribing tool that allows precise backside (or frontside) scribing of wafers and substrates while keeping the active device side protected. After scribing, manual or tool-assisted cleaving produces clean breaks with minimal chipping, making it ideal for preparing cross-sections or singulating delicate samples without...")
17:0117:01, 2 February 2026 LatticeAx Cleaver (hist | edit) [3,249 bytes] Chandanr (talk | contribs) (Created page with "__TOC__ == About == thumb|300px|LatticeAx 420 Cleaving System in Photo Bay '''Process:''' This is a precision cleaving tool designed for accurate, repeatable scribing and breaking of wafers and substrates. It allows controlled cleaving along crystal planes or predefined lines with minimal chipping and high edge quality, ideal for preparing samples for SEM, TEM, or device singulation without full dicing. '''Hardware:''' 2-axis linear stag...")
16:5716:57, 2 February 2026 Mini Polisher (hist | edit) [3,155 bytes] Chandanr (talk | contribs) (Created page with "__TOC__ == About == thumb|300px|EQ Unipol-300 Mini Automatic Grinder/Polisher in Common Chase '''Process:''' This is a compact, automatic tabletop grinder/polisher designed for small samples. It supports multi-step grinding and polishing with abrasive pads and slurries to achieve smooth, flat surfaces for microscopy, cross-section analysis, or device preparation. '''Hardware:''' 3" polishing platen with variable speed co...")
16:5516:55, 2 February 2026 Dicing Saw (hist | edit) [3,529 bytes] Chandanr (talk | contribs) (Created page with "__TOC__ == About == thumb|300px|DISCO DAD3350 Precision Dicing Saw in Common Chase '''Process:''' This is a high-precision automatic dicing saw used for cutting wafers and substrates into individual dies or pieces. It employs a high-speed diamond blade with programmable X/Y/Z control for accurate, repeatable cuts with minimal chipping or kerf damage. '''Hardware:''' 1.8 kW high-torque spindle for fast blade rotation. X/Y axes with 260 mm travel...")
16:4916:49, 2 February 2026 Ball & Wedge bonder (hist | edit) [3,256 bytes] Chandanr (talk | contribs) (Created page with "__TOC__ == About == thumb|300px|Ball and Wedge Bonder '''Process:''' The Ball and Wedge Bonder is used to form fine wire interconnections between device bond pads and package leads or substrates. It supports both ball bonding (typically gold wire) and wedge bonding (gold or aluminum wire), making it suitable for research, prototyping, and small-scale device packaging. '''Hardware:''' Manual or semi-automatic ball and wedge wire b...")
16:4716:47, 2 February 2026 Nikon optical microscope (hist | edit) [3,066 bytes] Chandanr (talk | contribs) (Created page with "__TOC__ == About == thumb|300px|Nikon Optical Microscope in Advanced Photo Bay '''Process:''' This is a standard upright optical microscope from Nikon used for routine visual inspection, pattern verification, and basic sample characterization in the cleanroom. It provides clear brightfield imaging for quick assessment of fabricated features and surfaces. '''Hardware:''' Nikon upright microscope body (specific model/series...")
16:4616:46, 2 February 2026 Nikon SMZ-10A optical microscope (hist | edit) [3,400 bytes] Chandanr (talk | contribs) (Created page with "__TOC__ == About == thumb|300px|Nikon SMZ-10A Stereo Zoom Microscope in Advanced Photo Bay '''Process:''' This is a stereo zoom optical microscope designed for three-dimensional viewing and inspection at low to medium magnifications. It provides a large working distance and wide field of view, making it ideal for examining larger samples, wire bonds, packaged devices, or 3D microstructures without the need for high-resolution flat-...")
16:4516:45, 2 February 2026 Zeiss optical microscope (hist | edit) [3,078 bytes] Chandanr (talk | contribs) (Created page with "__TOC__ == About == thumb|300px|Zeiss Optical Microscope in Advanced Photo Bay '''Process:''' This is a high-quality upright optical microscope from Zeiss designed for detailed visual inspection and characterization of fabricated structures in the cleanroom. It provides excellent image clarity and contrast, suitable for routine sample review, defect identification, and process verification. '''Hardware:''' Zeiss binocular or trinocular he...")
16:4416:44, 2 February 2026 Max ERB optical microscope (hist | edit) [3,271 bytes] Chandanr (talk | contribs) (Created page with "__TOC__ == About == thumb|300px|Max ERB Optical Microscope in Photo Bay '''Process:''' This is a specialized optical microscope equipped with a high-quality Zeiss binocular head and integrated linear encoder for accurate dimensional measurements. It is used for detailed visual inspection, alignment verification, and basic metrology of fabricated structures in the cleanroom. '''Hardware:''' Zeiss 47 30 12 9902 binocular microscope head f...")
16:4316:43, 2 February 2026 Nikon LV 150 optical microscope (hist | edit) [3,505 bytes] Chandanr (talk | contribs) (Created page with "__TOC__ == About == thumb|300px|Nikon LV150N Optical Microscope in Photo Bay '''Process:''' This is a high-end upright optical microscope optimized for inspection and metrology of micro- and nanostructures in cleanroom environments. It supports brightfield, darkfield, polarized light, and differential interference contrast (DIC if equipped) modes, with a high-resolution camera for image capture and export. '''Hardware:''' Nikon LV1...")
16:4216:42, 2 February 2026 Desktop SEM (hist | edit) [3,430 bytes] Chandanr (talk | contribs) (Created page with "__TOC__ == About == thumb|300px|Phenom ProX G6 Desktop SEM in Metrology Bay '''Process:''' This is a compact, tabletop scanning electron microscope (SEM) that provides high-resolution surface imaging and basic elemental analysis via energy-dispersive X-ray spectroscopy (EDS). It offers both electron and optical imaging modes, making it ideal for quick, user-friendly sample inspection without the complexity of full-size SEMs. '''Hardware:''' The...")
16:4116:41, 2 February 2026 Filmetrics F20 (hist | edit) [3,357 bytes] Chandanr (talk | contribs) (Created page with "__TOC__ == About == thumb|300px|Filmetrics F20 Thin Film Thickness Measurement System in Photo Bay '''Process:''' This is a reflectometry-based thin film measurement tool that uses visible/near-IR light reflection to determine film thickness quickly and non-destructively. It provides spot measurements or small-area maps, ideal for routine process monitoring and thickness verification after deposition or etch. '''Hardware:''' Broadband light...")
16:4016:40, 2 February 2026 Ellipsometer (hist | edit) [3,556 bytes] Chandanr (talk | contribs) (Created page with "__TOC__ == About == thumb|300px|Ellipsometer system in Photo Bay '''Process:''' This is a spectroscopic ellipsometer that measures the change in polarization of light reflected from a sample to determine thin film thickness, optical constants (refractive index n and extinction coefficient k), and layer structure. It supports multi-wavelength operation and wafer mapping for spatial uniformity analysis. '''Hardware:''' Multi-laser system with d...")
16:3716:37, 2 February 2026 Dektak profilometer (hist | edit) [3,287 bytes] Chandanr (talk | contribs) (Created page with "__TOC__ == About == thumb|300px|Bruker DektakXT Stylus Profilometer in Metrology Bay '''Process:''' This is a contact stylus profilometer that measures surface topography by scanning a diamond-tipped stylus across the sample. It provides high-resolution 2D line scans and 3D maps for step heights, film thickness, roughness, trench depth, and surface profiles with angstrom-level precision. '''Hardware:''' Diamond stylus tip (low force, typically 1–...")
16:3416:34, 2 February 2026 4-point Probe (hist | edit) [3,449 bytes] Chandanr (talk | contribs) (Created page with "__TOC__ == About == thumb|300px|Signatone 4-point Probe with HP 34401A Multimeter in Metrology Bay '''Process:''' This is a manual 4-point probe system used to measure sheet resistance (Rs) and calculate resistivity (ρ) of thin films, doped layers, or bulk materials non-destructively. The four-point configuration eliminates contact resistance errors, providing accurate electrical characterization of conductive layers. '''Hardware:''' Signat...")
16:3216:32, 2 February 2026 Aligner D (MA BA6 Gen4) (hist | edit) [3,371 bytes] Chandanr (talk | contribs) (Created page with "{{tool2|{{PAGENAME}} |picture=MABA6 D.jpg |type = Lithography |super = Chandan Ramakrishnaiah |super2 = Shivakumar Bhaskaran |phone = (213) 551 6726 |location = Advanced Photo Bay |email =  |description = SUSS MA/BA6 Gen4 Mask Aligner D – advanced contact/proximity aligner with backside alignment and LED exposure |manufacturer = SUSS MicroTec |materials = Photoresists (UV-sensitive, e.g., AZ, SPR, S...")
16:3116:31, 2 February 2026 Aligner C (MJB4) (hist | edit) [2,973 bytes] Chandanr (talk | contribs) (Created page with "__TOC__ == About == thumb|300px|SUSS MJB4 Mask Aligner C in Photo Bay '''Process:''' This is a manual contact mask aligner designed for precise UV photolithography on small pieces or substrates. It offers high-magnification objectives for accurate alignment and supports standard contact modes, making it suitable for fine features on limited-size samples. '''Hardware:''' 350 W mercury arc lamp with UV output in the 350–450 nm range (broadband UV)....")
16:3116:31, 2 February 2026 Aligner B (MJB3) (hist | edit) [2,807 bytes] Chandanr (talk | contribs) (Created page with "__TOC__ == About == thumb|300px|SUSS MJB3 Mask Aligner B in Photo Bay '''Process:''' This is a manual contact mask aligner designed for precise UV photolithography on small pieces or substrates. It supports soft, hard, and vacuum contact modes for different resolution and gap requirements. (Note: Unlike Aligner A, this unit does not have backside alignment capability listed.) '''Hardware:''' 350 W mercury arc lamp with UV output in the 350–450 nm...")
16:2816:28, 2 February 2026 Aligner A (MJB3) (hist | edit) [3,343 bytes] Chandanr (talk | contribs) (Created page with "__TOC__ == About == thumb|300px|SUSS MJB3 Mask Aligner A in Advanced Photo Bay '''Process:''' This is a manual contact mask aligner designed for precise UV photolithography on small pieces or substrates. It supports soft, hard, and vacuum contact modes for different resolution and gap requirements, and includes backside alignment capability for double-sided processing. '''Hardware:''' 350 W mercury arc lamp with UV output in the 350–450 nm range...")
16:2716:27, 2 February 2026 Heidelberg DWL (hist | edit) [3,346 bytes] Chandanr (talk | contribs) (Created page with "__TOC__ == About == thumb|300px|Heidelberg DWL 66+ Direct Write Laser Lithography system in Metrology Bay '''Process:''' This is a high-resolution direct-write laser lithography system that patterns photoresist directly on substrates or mask blanks without a physical photomask. It uses a 405 nm ("h-line") laser for grayscale and binary exposure, offering flexibility in feature size, write speed, and alignment. '''Hardware:''' 405 nm dio...")
16:2416:24, 2 February 2026 Raith EBL (hist | edit) [3,272 bytes] Chandanr (talk | contribs) (Created page with "__TOC__ == About == thumb|300px|Raith EBPG5150 Electron Beam Lithography system in Ebeam Bay '''Process:''' This is a high-performance direct-write electron beam lithography (EBL) system capable of ultra-high resolution patterning down to <8 nm. It uses a thermal field emission gun for precise, high-current beam control and is ideal for nanofabrication requiring sub-10 nm features, custom nanostructures, or low-volume prototyping. '''Hardwa...")
16:2316:23, 2 February 2026 YES O2 Plasma (hist | edit) [3,439 bytes] Chandanr (talk | contribs) (Created page with "__TOC__ == About == thumb|300px|YES-CV200RFS O₂ Plasma Cleaner in Advanced Photo Bay '''Process:''' This is a high-power oxygen plasma system designed for efficient photoresist ashing, descumming, organic residue removal, and surface activation. It combines elevated temperature (up to 250°C) with high RF power for faster processing and better control over ashing rates and surface chemistry. '''Hardware:''' Parallel-plate RF plasma configu...")
16:2316:23, 2 February 2026 Tegal Plasma (hist | edit) [2,384 bytes] Chandanr (talk | contribs) (Created page with "__TOC__ == About == thumb|300px|Tegal Plasma 915 (currently not in operation) in Advanced Photo Bay '''Status: Not in Operation''' This Tegal Plasma 915 tool is currently offline and not available for user processing. It was previously used for plasma cleaning, ashing, or surface treatment, but has been decommissioned or is awaiting repair/reactivation. '''Historical Process (for reference only):''' The Tegal Plasma 915 is a legac...")
16:2116:21, 2 February 2026 Tegal O2 Plasma Asher (hist | edit) [3,396 bytes] Chandanr (talk | contribs) (Created page with "__TOC__ == About == thumb|300px|Tegal O₂ Plasma Asher in Advanced Photo Bay '''Process:''' This is an oxygen plasma asher designed for gentle, downstream or direct O₂ plasma treatment. It is primarily used for stripping photoresist, descumming (removing thin resist residues), surface cleaning, and activating surfaces (e.g., improving wettability or adhesion) without significant ion damage. '''Hardware:''' Parallel-plate or downstream p...")
16:2016:20, 2 February 2026 XeF2 etcher (hist | edit) [3,546 bytes] Chandanr (talk | contribs) (Created page with "{{tool2|{{PAGENAME}} |picture=XeF2.jpg |type = Dry Etching |super = Chandan Ramakrishnaiah |super2 = Shivakumar Bhaskaran |phone = (213) 551 6726 |location = Deposition bay 1 |email =  |description = Custom XeF₂ etcher for rapid, isotropic, highly selective silicon etching |manufacturer = Custom-built (Armani group) |materials = Si only (high selectivity; no etching of SiO₂, Si₃N₄, photoresist...") Tag: Visual edit: Switched
16:1916:19, 2 February 2026 Oxford III-V (hist | edit) [8,258 bytes] Chandanr (talk | contribs) (Created page with "{{tool2|{{PAGENAME}} |picture=III-V.jpg |type = Dry Etching |super = Chandan Ramakrishnaiah |super2 = Shivakumar Bhaskaran |phone = (213) 551 6726 |location = Etch bay 1 |email =  |description = Oxford PlasmaPro 100 Cobra III-V etcher for compound semiconductors and advanced materials (cryo-capable) |manufacturer = Oxford Instruments |materials = InP, InAs, GaN, AlGaAs, GaAs, InGaAsP, ITO, Si, SiC, Mo...") Tag: Visual edit: Switched
16:1716:17, 2 February 2026 Oxford DRIE-ALE (hist | edit) [3,555 bytes] Chandanr (talk | contribs) (Created page with "{{tool2|{{PAGENAME}} |picture=DRIE-ALE.jpg |type = Dry Etching |super = Chandan Ramakrishnaiah |super2 = Shivakumar Bhaskaran |phone = (213) 551 6726 |location = Etch bay 1 |email =  |description = Oxford Deep Reactive Ion Etcher + Atomic Layer Etcher (currently being commissioned) |manufacturer = Oxford Instruments |materials = To be determined (likely similar to DRIE: Si, SiO₂, SiN, etc.; confirm...")
16:1616:16, 2 February 2026 Oxford DRIE (hist | edit) [3,863 bytes] Chandanr (talk | contribs) (Created page with "{{tool2|{{PAGENAME}} |picture=DRIE.jpg |type = Dry Etching |super = Chandan Ramakrishnaiah |super2 = Shivakumar Bhaskaran |phone = (213) 551 6726 |location = Etch bay 1 |email =  |description = Oxford System 100 Deep Reactive Ion Etcher (DRIE) for high-aspect-ratio Si etching via Bosch process |manufacturer = Oxford Instruments |materials = Si, SiO₂, SiN, Parylene, polyimide, LiNbO₃, BCB (no expos...")
16:1316:13, 2 February 2026 KJL Sputter (hist | edit) [4,160 bytes] Chandanr (talk | contribs) (Created page with "{{tool2|{{PAGENAME}} |picture=KJL Sputter.jpg |type = Vacuum Deposition |super = Chandan Ramakrishnaiah |super2 = Shivakumar Bhaskaran |phone = (213) 551 6726 |location = Deposition bay 1 |email =  |description = Kurt J. Lesker (KJL) Sputter system for DC and RF magnetron sputtering of metals, oxides, and ITO |manufacturer = Kurt J. Lesker (KJL) |materials = Au, Pt, Ti, Al, W, Mo, Cu, SiO₂, Al₂O...")
16:1216:12, 2 February 2026 Temescal Metal e-beam evaporator (hist | edit) [3,507 bytes] Chandanr (talk | contribs) (Created page with "{{tool2|{{PAGENAME}} |picture=  |type = Vacuum Deposition |super = Chandan Ramakrishnaiah |super2 = Shivakumar Bhaskaran |phone = (213) 551 6726 |location = Deposition bay 1 |email =  |description = Temescal Metal e-beam Evaporator (Currently Not in Service) |manufacturer = Temescal (now part of F...")
14:4814:48, 2 February 2026 KJL Evaporator (hist | edit) [3,433 bytes] Chandanr (talk | contribs) (Created page with "{{tool2|{{PAGENAME}} |picture=KJL Evaporator.jpg |type = Vacuum Deposition |super = Chandan Ramakrishnaiah |super2 = Shivakumar Bhaskaran |phone = (213) 551 6726 |location = Deposition bay 1 |email =  |description = KJL e-beam evaporator for multi-pocket metal deposition with substrate rotation |manufacturer = Kurt J. Lesker (KJL) |materials = Ti, Au, Pt, Pd, Cr, Ni, Ag (other materials available upon...")
14:4614:46, 2 February 2026 CHA Evaporator (hist | edit) [3,461 bytes] Chandanr (talk | contribs) (Created page with "{{tool2|{{PAGENAME}} |picture=CHA Evaporator.jpg |type = Vacuum Deposition |super = Chandan Ramakrishnaiah |super2 = Shivakumar Bhaskaran |phone = (213) 551 6726 |location = Deposition bay 2 |email =  |description = CHA e-beam evaporator for multi-pocket metal deposition with high-capacity dome and liftoff support |manufacturer = CHA Industries |materials = Ti, Au, Pt, Pd, Cr, Ni, Ag |toolid = <!--...") Tag: Visual edit: Switched
14:4514:45, 2 February 2026 Angstrom Evaporator (hist | edit) [3,385 bytes] Chandanr (talk | contribs) (Created page with "{{tool2|{{PAGENAME}} |picture=Angstrom Evaporator.jpg |type = Vacuum Deposition |super = Chandan Ramakrishnaiah |super2 = Shivakumar Bhaskaran |phone = (213) 551 6726 |location = Deposition bay 1 |email =  |description = Angstrom Engineering e-beam evaporator for metals and oxides with ion milling and substrate heating |manufacturer = Angstrom Engineering |materials = Ti, Al, Al₂O₃ (other material...")
14:4314:43, 2 February 2026 Narco vacuum oven (hist | edit) [3,670 bytes] Chandanr (talk | contribs) (Created page with "{{tool2|{{PAGENAME}} |picture=Narco oven.jpg |type = Thermal Processing |super = Chandan Ramakrishnaiah |super2 = Shivakumar Bhaskaran |phone = (213) 551 6726 |location = Advanced Photo bay |email =  |description = Narco 5831 Vacuum Oven for low-pressure drying, degassing, and baking |manufacturer = Narco (National Appliance Company, legacy model) |materials = Substrates, photoresist, polymers, glass...") Tag: Visual edit: Switched

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