Tools menu: Difference between revisions

From USC Nanofab Wiki
Jump to navigation Jump to search
← Older editNewer edit →
Chandanr (talk | contribs)
Administrators
292 edits
VisualWikitext
No edit summary
No edit summary
Line 1: Line 1:
__NOTOC__
__NOTOC__


{| class="wikitable" style="width:max-content;"
{| class="wikitable" style="width:min-content;"
|
|
=== Tool Categories ===
=== Tool Categories ===
Line 15: Line 15:


== Anneal & Furnace ==
== Anneal & Furnace ==
* [[#RTA|RTA (Rapid Thermal Annealer)]]
* [[RTA (Rapid Thermal Annealer)]]
* [[#Cascade Tek vacuum oven|Cascade Tek vacuum oven]]
* [[Cascade Tek vacuum oven]]
* [[#Blue M furnace big|Blue M furnace big]]
* [[Blue M furnace big]]
* [[#Blue M furnace little|Blue M furnace little]]
* [[Blue M furnace little]]
* [[#Narco vacuum oven|Narco vacuum oven]]
* [[Narco vacuum oven]]


== Deposition ==
== Deposition ==


=== CVD (Chemical Vapor Deposition) ===
=== CVD (Chemical Vapor Deposition) ===
* [[#Oxford PECVD|Oxford PECVD]]
* [[Oxford PECVD]]
* [[#Veeco ALD|Veeco ALD]]
* [[Veeco ALD]]


=== PVD (Physical Vapor Deposition) ===
=== PVD (Physical Vapor Deposition) ===
* [[#Angstrom Evaporator|Angstrom Evaporator]]
* [[Angstrom Evaporator]]
* [[#CHA Evaporator|CHA Evaporator]]
* [[CHA Evaporator]]
* [[#KJL Evaporator|KJL Evaporator]]
* [[KJL Evaporator]]
* [[#Temescal Metal e-beam evaporator|Temescal Metal e-beam evaporator]] (Not in service)
* [[Temescal Metal e-beam evaporator]] (Not in service)
* [[#KJL Sputter|KJL Sputter]]
* [[KJL Sputter]]


== Dry Etching & Plasma Cleaning ==
== Dry Etching & Plasma Cleaning ==


=== Etchers ===
=== Etchers ===
* [[#Oxford DRIE|Oxford DRIE]]
* [[Oxford DRIE]]
* [[#Oxford DRIE-ALE|Oxford DRIE-ALE]] (being commissioned)
* [[Oxford DRIE-ALE]] (being commissioned)
* [[#Oxford III-V|Oxford III-V]]
* [[Oxford III-V]]
* [[#Oxford RIE|Oxford RIE]]
* [[Oxford RIE]]
* [[#XeF2 etcher|XeF2 etcher]]
* [[XeF2 etcher]]


=== Plasma Cleaning / Ashing ===
=== Plasma Cleaning / Ashing ===
* [[#Tegal O2 Plasma Asher|Tegal O2 Plasma Asher]]
* [[Tegal O2 Plasma Asher]]
* [[#Tegal Plasma|Tegal Plasma]] (not in operation)
* [[Tegal Plasma]] (not in operation)
* [[#YES O2 Plasma|YES O2 Plasma]]
* [[YES O2 Plasma]]


== Lithography ==
== Lithography ==


=== E-beam and Laser ===
=== E-beam and Laser ===
* [[#Raith EBL|Raith EBL]]
* [[Raith EBL]]
* [[#Heidelberg DWL|Heidelberg DWL]]
* [[Heidelberg DWL]]


=== UV Mask Aligners ===
=== UV Mask Aligners ===
* [[#Aligner A (MJB3)|Aligner A (MJB3)]]
* [[Aligner A (MJB3)]]
* [[#Aligner B (MJB3)|Aligner B (MJB3)]]
* [[Aligner B (MJB3)]]
* [[#Aligner C (MJB4)|Aligner C (MJB4)]]
* [[Aligner C (MJB4)]]
* [[#Aligner D (MA BA6 Gen4)|Aligner D (MA BA6 Gen4)]]
* [[Aligner D (MA BA6 Gen4)]]


== Metrology ==
== Metrology ==


=== Assorted Metrology ===
=== Assorted Metrology ===
* [[#4-point Probe|4-point Probe]]
* [[4-point Probe]]
* [[#Dektak profilometer|Dektak profilometer]]
* [[Dektak profilometer]]
* [[#Ellipsometer|Ellipsometer]]
* [[Ellipsometer]]
* [[#Filmetrics F20|Filmetrics F20]]
* [[Filmetrics F20]]


=== Microscopes ===
=== Microscopes ===
* [[#Desktop SEM|Desktop SEM]]
* [[Desktop SEM]]
* [[#Nikon LV 150 optical microscope|Nikon LV 150 optical microscope]]
* [[Nikon LV 150 optical microscope]]
* [[#Max ERB optical microscope|Max ERB optical microscope]]
* [[Max ERB optical microscope]]
* [[#Zeiss optical microscope|Zeiss optical microscope]]
* [[Zeiss optical microscope]]
* [[#Nikon SMZ-10A optical microscope|Nikon SMZ-10A optical microscope]]
* [[Nikon SMZ-10A optical microscope]]
* [[#Nikon optical microscope|Nikon optical microscope]]
* [[Nikon optical microscope]]


== Packaging & Mechanical Tooling ==
== Packaging & Mechanical Tooling ==


=== Wafer and Die Processing ===
=== Wafer and Die Processing ===
* [[#Ball & Wedge bonder|Ball & Wedge bonder]]
* [[Ball & Wedge bonder]]
* [[#Dicing Saw|Dicing Saw]]
* [[Dicing Saw]]
* [[#Mini Polisher|Mini Polisher]]
* [[Mini Polisher]]
* [[#LatticeAx Cleaver|LatticeAx Cleaver]]
* [[LatticeAx Cleaver]]
* [[#FlipScribe Cleaver|FlipScribe Cleaver]]
* [[FlipScribe Cleaver]]
* [[#Vacuum Bag Sealer|Vacuum Bag Sealer]]
* [[Vacuum Bag Sealer]]


== PCB Processing ==
== PCB Processing ==
 
* [[LPKF PCB mill]]
* [[#LPKF PCB mill|LPKF PCB mill]]
* [[LPKF electroplater]]
* [[#LPKF electroplater|LPKF electroplater]]


== Wet Process ==
== Wet Process ==


=== Fume Hoods & Stations ===
=== Fume Hoods & Stations ===
* Solvent Fume Hood (Metrology bay)
* Solvent Fume Hood (Metrology bay)
** Heated ultrasonic bath
** [[Heated ultrasonic bath]] (Solvent hood)
** Torrey Pines hot plate / stirrer
** [[Torrey Pines hot plate]] (Solvent hood)
** Solvent drains
** Solvent drains
** N2 sprayers
** N2 sprayers


* Acid Fume Hood – Left (Etch bay) – Piranha & Nanostrip allowed
* Acid Fume Hood – Left (Etch bay) – Piranha & Nanostrip allowed
** Heated bath (Imtec Accubath)
** [[Imtec Accubath]] (Acid left)
** Quick-dump-rinse tank (QDR)
** Quick-dump-rinse tank (QDR)
** DI water tap
** DI water tap
Line 107: Line 107:


* Acid Fume Hood – Right (Etch bay) – No Piranha/Nanostrip
* Acid Fume Hood – Right (Etch bay) – No Piranha/Nanostrip
** Heated bath (Imtec Accubath)
** [[Imtec Accubath]] (Acid right)
** Torrey Pines hot plate left
** [[Torrey Pines hot plate]] (Acid right – left & right units)
** Torrey Pines hot plate right
** Quick-dump-rinse tank (QDR)
** Quick-dump-rinse tank (QDR)
** DI water tap
** DI water tap
Line 115: Line 114:


* Resist Fume Hood (Advanced Photo bay)
* Resist Fume Hood (Advanced Photo bay)
** Spinner left (Laurell)
** [[Laurell Spinner]] (left & right)
** Spinner right (Laurell)
** [[Apogee Bake Plate]] (1–4)
** Bake plate 1 (Apogee)
** Bake plate 2 (Apogee)
** Bake plate 3 (Apogee)
** Bake plate 4 (Apogee)


* Base & Developer Fume Hood – Left (Advanced Photo bay)
* Base & Developer Fume Hood – Left (Advanced Photo bay)
** Heated bath (Imtec Accubath)
** [[Imtec Accubath]] (Developer left)
** Torrey Pines hot plate
** [[Torrey Pines hot plate]] (Developer left)
** Quick-dump-rinse tank (QDR)
** Quick-dump-rinse tank (QDR)
** DI water tap
** DI water tap
Line 130: Line 125:


* Base & Developer Fume Hood – Right (Advanced Photo bay)
* Base & Developer Fume Hood – Right (Advanced Photo bay)
** Heated bath (Imtec Accubath)
** [[Imtec Accubath]] (Developer right)
** Torrey Pines hot plate
** [[Torrey Pines hot plate]] (Developer right)
** Quick-dump-rinse tank (QDR)
** Quick-dump-rinse tank (QDR)
** DI water tap
** DI water tap
Line 137: Line 132:


* E-beam Resist Fume Hood (Photo bay)
* E-beam Resist Fume Hood (Photo bay)
** Headway spinner left
** [[Headway Spinner]] (left & right)
** Headway spinner right
** [[Apogee Hot Plate]] (left & right – ebeam)
** Apogee hot plate left
** Apogee hot plate right
** Ultrasonic heated bath
** Ultrasonic heated bath
** Torrey Pines hot plate / stirrer
** [[Torrey Pines hot plate / stirrer]] (ebeam hood)

Revision as of 13:50, 2 February 2026


Tool Categories

Anneal & Furnace

Deposition

CVD (Chemical Vapor Deposition)

PVD (Physical Vapor Deposition)

Dry Etching & Plasma Cleaning

Etchers

Plasma Cleaning / Ashing

Lithography

E-beam and Laser

UV Mask Aligners

Metrology

Assorted Metrology

Microscopes

Packaging & Mechanical Tooling

Wafer and Die Processing

PCB Processing

Wet Process

Fume Hoods & Stations

  • Acid Fume Hood – Left (Etch bay) – Piranha & Nanostrip allowed
    • Imtec Accubath (Acid left)
    • Quick-dump-rinse tank (QDR)
    • DI water tap
    • N2 gun
  • Acid Fume Hood – Right (Etch bay) – No Piranha/Nanostrip
  • Base & Developer Fume Hood – Left (Advanced Photo bay)
  • Base & Developer Fume Hood – Right (Advanced Photo bay)
Retrieved from "https://wiki.nanofab.usc.edu/index.php?title=Tools_menu&oldid=530"