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{{tool2|{{PAGENAME}}
__NOTOC__
|picture=Blue M oven big.jpg
|type = Thermal Processing
|super = Chandan Ramakrishnaiah
|super2 = Shivakumar Bhaskaran
|phone = (213) 551 6726
|location = Advanced Photo bay
|email =  <!-- Add USC email if needed, e.g. chandan@usc.edu or leave blank -->
|description = Blue M OV-12A Large Drying Oven for baking, curing, and low-temperature annealing up to 260°C
|manufacturer = Blue M (now part of Thermal Product Solutions)
|materials = Substrates, photoresist, polymers, glass, metals (check restrictions per process)
|toolid =  <!-- Add your internal tool ID if you have one, or leave blank -->
}}
__TOC__


== About ==
{| class="wikitable" style="width:max-content;"
[[File:Blue M oven big.jpg|thumb|300px|Blue M OV-12A Large Drying Oven in Advanced Photo Bay]]
|
=== Tool Categories ===
* [[#Anneal & Furnace|Anneal & Furnace]]
* [[#Deposition|Deposition]]
* [[#Dry Etching & Plasma Cleaning|Dry Etching & Plasma Cleaning]]
* [[#Lithography|Lithography]]
* [[#Metrology|Metrology]]
* [[#Packaging & Mechanical Tooling|Packaging & Mechanical Tooling]]
* [[#PCB Processing|PCB Processing]]
* [[#Wet Process|Wet Process]]
|}


'''Process:''' This is a large-capacity forced-air convection drying oven designed for reliable, uniform heating at moderate temperatures. It is commonly used for baking photoresists, curing polymers, drying samples after wet processing, outgassing, or low-temperature annealing in a clean, controlled air environment.
== Anneal & Furnace ==
* [[RTA (Rapid Thermal Annealer)]]
* [[Cascade Tek vacuum oven]]
* [[Blue M furnace big]]
* [[Blue M furnace little]]
* [[Narco vacuum oven]]


'''Hardware:''' Forced-air circulation with adjustable fan speed for excellent temperature uniformity. Stainless steel interior for cleanroom compatibility and easy cleaning. Digital temperature controller with over-temperature protection. Shelving system for multiple samples or larger substrates. Door with observation window and gasket seal.
== Deposition ==


'''Atmosphere:'''
=== CVD (Chemical Vapor Deposition) ===
* Ambient air (forced convection)
* [[Oxford PECVD]]
* No vacuum or special gases (for inert or forming gas anneals, use RTA or other tools)
* [[Veeco ALD]]
* Optional N₂ purge if modified (not standard – confirm if equipped)


'''Applications:'''
=== PVD (Physical Vapor Deposition) ===
* Post-bake and hard bake of photoresists (e.g., 90–180°C)
* [[Angstrom Evaporator]]
* Curing of spin-on dielectrics, polyimides, or adhesives
* [[CHA Evaporator]]
* Drying wafers/substrates after rinse or solvent clean
* [[KJL Evaporator]]
* Low-temperature outgassing or degassing
* [[Temescal Metal e-beam evaporator]] (Not in service)
* Gentle thermal treatment of delicate samples
* [[KJL Sputter]]
* Aging or stability testing of materials


'''Usage:''' Load samples on shelves, set temperature and time via controller, allow stabilization, run process. Use timer or manual monitoring. Cool down before opening door to avoid thermal shock or contamination. Follow SOP for loading/unloading and cleaning.
== Dry Etching & Plasma Cleaning ==


== Detailed Specifications ==
=== Etchers ===
* Model: Blue M OV-12A
* [[Oxford DRIE]]
* Location: Advanced Photo bay
* [[Oxford DRIE-ALE]] (being commissioned)
* Substrate size: Flexible (wafers up to 8–12", cassettes, trays, or multiple pieces – check interior dimensions)
* [[Oxford III-V]]
* Temperature range: Ambient to 260°C
* [[Oxford RIE]]
* Temperature control: Digital PID controller with uniformity typically ±2–5°C across chamber (depending on load)
* [[XeF2 etcher]]
* Heating: Electric elements with forced-air circulation
* Features: Over-temperature safety cutoff, adjustable shelves, observation window, cleanroom-compatible design
* Restrictions: Max 260°C (not for high-temperature processes); avoid volatile/corrosive chemicals that could damage interior or contaminate other users
* Other: Large interior volume suitable for batch processing or bigger substrates


== Documentation ==
=== Plasma Cleaning / Ashing ===
* [[:File:Blue M OV-12A Drying Oven SOP v1.pdf|SOP – Standard Operating Procedure]]
* [[Tegal O2 Plasma Asher]]
* Training required – contact lab staff (Chandan Ramakrishnaiah or Shivakumar Bhaskaran)
* [[Tegal Plasma]] (not in operation)
* [[YES O2 Plasma]]


== Recipes & Data ==
== Lithography ==
* Standard Processes: Common bakes include:
  * Photoresist soft bake: 90–110°C
  * Post-exposure bake (PEB): 100–130°C
  * Hard bake: 120–180°C
  * Curing of SU-8 or polyimide: 150–250°C
* Process Control: Verify temperature uniformity with thermocouple checks if needed. Monitor for contamination (e.g., particles) after use.
* Notes: Allow pre-heat stabilization time (30–60 min) for best uniformity. Use foil or trays to protect shelves from spills.


<!-- Optional: Add more images here if you have interior views, shelving, control panel, or example sample setups. -->
=== E-beam and Laser ===
* [[Raith EBL]]
* [[Heidelberg DWL]]
 
=== UV Mask Aligners ===
* [[Aligner A (MJB3)]]
* [[Aligner B (MJB3)]]
* [[Aligner C (MJB4)]]
* [[Aligner D (MA BA6 Gen4)]]
 
== Metrology ==
 
=== Assorted Metrology ===
* [[4-point Probe]]
* [[Dektak profilometer]]
* [[Ellipsometer]]
* [[Filmetrics F20]]
 
=== Microscopes ===
* [[Desktop SEM]]
* [[Nikon LV 150 optical microscope]]
* [[Max ERB optical microscope]]
* [[Zeiss optical microscope]]
* [[Nikon SMZ-10A optical microscope]]
* [[Nikon optical microscope]]
 
== Packaging & Mechanical Tooling ==
 
=== Wafer and Die Processing ===
* [[Ball & Wedge bonder]]
* [[Dicing Saw]]
* [[Mini Polisher]]
* [[LatticeAx Cleaver]]
* [[FlipScribe Cleaver]]
* [[Vacuum Bag Sealer]]
 
== PCB Processing ==
* [[LPKF PCB mill]]
* [[LPKF electroplater]]
 
== Wet Process ==
 
=== Fume Hoods & Stations ===
 
* Solvent Fume Hood (Metrology bay)
** [[Heated ultrasonic bath]] (Solvent hood)
** [[Torrey Pines hot plate]] (Solvent hood)
** Solvent drains
** N2 sprayers
 
* Acid Fume Hood – Left (Etch bay) – Piranha & Nanostrip allowed
** [[Imtec Accubath]] (Acid left)
** Quick-dump-rinse tank (QDR)
** DI water tap
** N2 gun
 
* Acid Fume Hood – Right (Etch bay) – No Piranha/Nanostrip
** [[Imtec Accubath]] (Acid right)
** [[Torrey Pines hot plate]] (Acid right – left & right units)
** Quick-dump-rinse tank (QDR)
** DI water tap
** N2 sprayer
 
* Resist Fume Hood (Advanced Photo bay)
** [[Laurell Spinner]] (left & right)
** [[Apogee Bake Plate]] (1–4)
 
* Base & Developer Fume Hood – Left (Advanced Photo bay)
** [[Imtec Accubath]] (Developer left)
** [[Torrey Pines hot plate]] (Developer left)
** Quick-dump-rinse tank (QDR)
** DI water tap
** N2 sprayer
 
* Base & Developer Fume Hood – Right (Advanced Photo bay)
** [[Imtec Accubath]] (Developer right)
** [[Torrey Pines hot plate]] (Developer right)
** Quick-dump-rinse tank (QDR)
** DI water tap
** N2 sprayer
 
* E-beam Resist Fume Hood (Photo bay)
** [[Headway Spinner]] (left & right)
** [[Apogee Hot Plate]] (left & right – ebeam)
** Ultrasonic heated bath
** [[Torrey Pines hot plate / stirrer]] (ebeam hood)

Revision as of 14:38, 2 February 2026


Tool Categories

Anneal & Furnace

Deposition

CVD (Chemical Vapor Deposition)

PVD (Physical Vapor Deposition)

Dry Etching & Plasma Cleaning

Etchers

Plasma Cleaning / Ashing

Lithography

E-beam and Laser

UV Mask Aligners

Metrology

Assorted Metrology

Microscopes

Packaging & Mechanical Tooling

Wafer and Die Processing

PCB Processing

Wet Process

Fume Hoods & Stations

  • Acid Fume Hood – Left (Etch bay) – Piranha & Nanostrip allowed
    • Imtec Accubath (Acid left)
    • Quick-dump-rinse tank (QDR)
    • DI water tap
    • N2 gun
  • Acid Fume Hood – Right (Etch bay) – No Piranha/Nanostrip
  • Base & Developer Fume Hood – Left (Advanced Photo bay)
  • Base & Developer Fume Hood – Right (Advanced Photo bay)
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