Tools menu: Difference between revisions

From USC Nanofab Wiki
Jump to navigation Jump to search
Chandanr (talk | contribs)
Administrators
291 edits
VisualWikitext
Created page with "__NOTOC__ {| class="wikitable" style="width:min-content;" | === Tool Categories === * Anneal & Furnace * Deposition * Dry Etching & Plasma Cleaning * Lithography * Metrology * Packaging & Mechanical Tooling * PCB Processing * :Category:Wet Process|W..."
 
No edit summary
 
(26 intermediate revisions by the same user not shown)
Line 1: Line 1:
__NOTOC__
__NOTOC__
{| class="wikitable" style="width:min-content;"
{| class="wikitable" style="width:max-content;"
|
|
=== Tool Categories ===
=== Tool Categories ===
* [[:Category:Anneal & Furnace|Anneal & Furnace]]
* [[#Anneal & Furnace|Anneal & Furnace]]
* [[:Category:Deposition|Deposition]]
* [[#Deposition|Deposition]]
* [[:Category:Dry Etching & Plasma Cleaning|Dry Etching & Plasma Cleaning]]
* [[#Dry Etching & Plasma Cleaning|Dry Etching & Plasma Cleaning]]
* [[:Category:Lithography|Lithography]]
* [[#Lithography|Lithography]]
* [[:Category:Metrology|Metrology]]
* [[#Metrology and testing|Metrology and testing]]
* [[:Category:Packaging & Mechanical Tooling|Packaging & Mechanical Tooling]]
* [[#Packaging & Mechanical Tooling|Packaging & Mechanical Tooling]]
* [[:Category:PCB Processing|PCB Processing]]
* [[#PCB Processing|PCB Processing]]
* [[:Category:Wet Process|Wet Process]]
* [[#Wet Process|Wet Process]]
|}
|}
== Anneal & Furnace ==
* [[RTA (Rapid Thermal Annealer)]]
* [[Cascade Tek vacuum oven]]
* [[Blue M furnace big]]
* [[Blue M furnace little]]
* [[Narco vacuum oven]]


=Anneal & Furnace=
== Deposition ==
* RTA (Rapid Thermal Annealer)
=== CVD (Chemical Vapor Deposition) ===
* Cascade Tek vacuum oven
* [[Oxford PECVD]]
* Blue M furnace big
* [[Veeco ALD]]
* Blue M furnace little
* Narco vacuum oven


=Deposition=
=== PVD (Physical Vapor Deposition) ===
=====CVD (chemical vapor deposition)=====
* [[Angstrom Evaporator]]
* Oxford PECVD
* [[CHA Evaporator]]
* Veeco ALD
* [[KJL Evaporator]]
* [[Temescal Metal e-beam evaporator]] (Not in service)
* [[KJL Sputter]]


=====PVD (physical vapor deposition)=====
== Dry Etching & Plasma Cleaning ==
* Angstrom Evaporator
=== Etchers ===
* CHA Evaporator
* [[Oxford DRIE]]
* KJL Evaporator
* [[Oxford DRIE-ALE]] (being commissioned)
* Temescal Metal e-beam evaporator (Not in service)
* [[Oxford III-V]]
* KJL Sputter
* [[Oxford RIE]]
* [[XeF2 etcher]]


=Dry Etching & Plasma Cleaning=
=== Plasma Cleaning / Ashing ===
=====Etchers=====
* [[Tegal O2 Plasma Asher]]
* Oxford DRIE
* [[Tegal Plasma]] (not in operation)
* Oxford DRIE-ALE
* [[YES O2 Plasma]]
* Oxford III-V
* Oxford RIE
* XeF2 etcher


=====Plasma cleaning / ashing=====
== Lithography ==
* Tegal O2 Plasma Asher
=== E-beam and Laser ===
* Tegal Plasma (Not in operation)
* [[Raith EBL]]
* YES O2 Plasma
* [[Heidelberg DWL]]


=Lithography=
=== UV Mask Aligners ===
=====E-beam and laser=====
* [[Aligner A (MJB3)]]
* Raith EBL
* [[Aligner B (MJB3)]]
* Heidelberg DWL
* [[Aligner C (MJB4)]]
* [[Aligner D (MA BA6 Gen4)]]


=====UV mask aligners=====
== Metrology and testing ==
* Aligner A (MJB3)
=== Assorted Metrology ===
* Aligner B (MJB3)
* [[4-point Probe]]
* Aligner C (MJB4)
* [[Dektak profilometer]]
* Aligner D (MA BA6 Gen4)
* [[Ellipsometer]]
* [[Filmetrics F20]]


=Metrology=
=== Microscopes ===
=====Assorted metrology=====
* [[Desktop SEM]]
* 4-point Probe
* [[Nikon LV 150 optical microscope]]
* Dektak profilometer
* [[Max ERB optical microscope]]
* Ellipsometer
* [[Zeiss optical microscope]]
* Filmetrics F20
* [[Nikon SMZ-10A optical microscope]]
* [[Nikon optical microscope]]


=====Microscopes=====
=== Electrical Characterization ===
* Desktop SEM
* [[Electroglas 4080X]] – Automated wafer prober
* Nikon LV 150 optical microscope
* [[Keithley S530 Parametric Test System]] – Parametric analyzer
* Max ERB optical microscope
* Zeiss optical microscope
* Nikon SMZ-10A optical microscope
* Nikon optical microscope


=Packaging & Mechanical Tooling=
== Packaging & Mechanical Tooling ==
=====Wafer and die processing=====
=== Wafer and Die Processing ===
* Ball & Wedge bonder
* [[Ball & Wedge bonder]]
* Dicing Saw
* [[Dicing Saw]]
* Mini Polisher
* [[Mini Polisher]]
* LatticeAx Cleaver
* [[LatticeAx Cleaver]]
* FlipScribe Cleaver
* [[FlipScribe Cleaver]]
* Vacuum Bag Sealer
* [[Vacuum Bag Sealer]]


=PCB Processing=
== PCB Processing ==
* LPKF PCB mill
* [[LPKF PCB mill]]
* LPKF electroplater
* [[LPKF electroplater]]


=Wet Process=
== Wet Process ==
=====Solvent fume hood=====
=== Fume Hoods & Stations ===
* Heated ultrasonic bath
* Solvent Fume Hood (Metrology bay)
* Torrey Pines hot plate
** [[Heated ultrasonic bath]] (Solvent hood)
* Solvent drains
** [[Torrey Pines hot plate]] (Solvent hood)
* N2 sprayers
** Solvent drains
 
** N2 sprayers
=====Acid fume hood left-side=====
* Acid Fume Hood – Left (Etch bay) – Piranha & Nanostrip allowed
* Heated bath
** [[Imtec Accubath]] (Acid left)
* Quick-dump-rinse tank (QDR)
** Quick-dump-rinse tank (QDR)
* DI water tap
** DI water tap
* N2 gun
** N2 gun
 
* Acid Fume Hood – Right (Etch bay) – No Piranha/Nanostrip
=====Acid fume hood right-side=====
** [[Imtec Accubath]] (Acid right)
* Heated bath
** [[Torrey Pines hot plate]] (Acid right – left & right units)
* Torrey Pines hot plate left
** Quick-dump-rinse tank (QDR)
* Torrey Pines hot plate right
** DI water tap
* Quick-dump-rinse tank (QDR)
** N2 sprayer
* DI water tap
* Resist Fume Hood (Advanced Photo bay)
* N2 sprayer
** [[Laurell Spinner]] (left & right)
 
** [[Apogee Bake Plate]] (1–4)
=====Resist fume hood=====
* Base & Developer Fume Hood – Left (Advanced Photo bay)
* Spinner left
** [[Imtec Accubath]] (Developer left)
* Spinner right
** [[Torrey Pines hot plate]] (Developer left)
* Bake plate 1
** Quick-dump-rinse tank (QDR)
* Bake plate 2
** DI water tap
* Bake plate 3
** N2 sprayer
* Bake plate 4
* Base & Developer Fume Hood – Right (Advanced Photo bay)
 
** [[Imtec Accubath]] (Developer right)
=====Base and developer fume hood left-side=====
** [[Torrey Pines hot plate]] (Developer right)
* Heated bath
** Quick-dump-rinse tank (QDR)
* Torrey Pines hot plate
** DI water tap
* Quick-dump-rinse tank (QDR)
** N2 sprayer
* DI water tap
* E-beam Resist Fume Hood (Photo bay)
* N2 sprayer
** [[Headway Spinner]] (left & right)
 
** [[Apogee Hot Plate]] (left & right – ebeam)
=====Base and developer fume hood right-side=====
** Ultrasonic heated bath
* Heated bath
** [[Torrey Pines hot plate / stirrer]] (ebeam hood)
* Torrey Pines hot plate
* Quick-dump-rinse tank (QDR)
* DI water tap
* N2 sprayer
 
=====E-beam resist fume hood=====
* Headway spinner left
* Headway spinner right
* Apogee hot plate left
* Apogee hot plate right
* Ultrasonic heated bath
* Torrey Pines hot plate/stirrer
 
== Decommissioned Tools ==
(If any exist, list here; currently none specified in the provided structure)

Latest revision as of 13:33, 17 February 2026

Tool Categories

Anneal & Furnace

Deposition

CVD (Chemical Vapor Deposition)

PVD (Physical Vapor Deposition)

Dry Etching & Plasma Cleaning

Etchers

Plasma Cleaning / Ashing

Lithography

E-beam and Laser

UV Mask Aligners

Metrology and testing

Assorted Metrology

Microscopes

Electrical Characterization

Packaging & Mechanical Tooling

Wafer and Die Processing

PCB Processing

Wet Process

Fume Hoods & Stations

Retrieved from "https://wiki.nanofab.usc.edu/index.php?title=Tools_menu&oldid=738"