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{| class="wikitable" style="width:min-content;"
{| class="wikitable" style="width:max-content;"
|
|
=== Tool Categories ===
=== Tool Categories ===
* Lithography
* [[#Anneal & Furnace|Anneal & Furnace]]
* Deposition
* [[#Deposition|Deposition]]
* Dry Etch
* [[#Dry Etching & Plasma Cleaning|Dry Etching & Plasma Cleaning]]
* Wet Process
* [[#Lithography|Lithography]]
* Thermal Process
* [[#Metrology and testing|Metrology and testing]]
* Packaging/Bonding
* [[#Packaging & Mechanical Tooling|Packaging & Mechanical Tooling]]
* Metrology/Test
* [[#PCB Processing|PCB Processing]]
* [[#Wet Process|Wet Process]]
|}
|}
== Anneal & Furnace ==
* [[RTA (Rapid Thermal Annealer)]]
* [[Cascade Tek vacuum oven]]
* [[Blue M furnace big]]
* [[Blue M furnace little]]
* [[Narco vacuum oven]]


= Anneal & Furnace =
== Deposition ==
* Rapid Thermal Annealer (RTA)
=== CVD (Chemical Vapor Deposition) ===
* Cascade Tek Vacuum Oven
* [[Oxford PECVD]]
* Blue M Furnace (Large)
* [[Veeco ALD]]
* Blue M Furnace (Small)
* Narco Vacuum Oven


= Deposition =
=== PVD (Physical Vapor Deposition) ===
== Chemical Vapor Deposition (CVD) ==
* [[Angstrom Evaporator]]
* Oxford PECVD
* [[CHA Evaporator]]
* Veeco ALD
* [[KJL Evaporator]]
* [[Temescal Metal e-beam evaporator]] (Not in service)
* [[KJL Sputter]]


== Physical Vapor Deposition (PVD) ==
== Dry Etching & Plasma Cleaning ==
* Angstrom E-Beam Evaporator
=== Etchers ===
* CHA E-Beam Evaporator
* [[Oxford DRIE]]
* KJL E-Beam Evaporator
* [[Oxford DRIE-ALE]] (being commissioned)
* Temescal E-Beam Evaporator (Not in service)
* [[Oxford III-V]]
* KJL Sputter System
* [[Oxford RIE]]
* [[XeF2 etcher]]


= Dry Etching & Plasma Cleaning =
=== Plasma Cleaning / Ashing ===
== Reactive Ion / Deep Reactive Ion Etchers ==
* [[Tegal O2 Plasma Asher]]
* Oxford DRIE (Deep Si Etcher)
* [[Tegal Plasma]] (not in operation)
* Oxford DRIE-ALE (Atomic Layer Etcher – commissioning)
* [[YES O2 Plasma]]
* Oxford III-V Etcher (PlasmaPro 100 Cobra)
* Oxford RIE (PlasmaPro 80 – Dielectrics)
* XeF₂ Etcher


== Plasma Cleaning / Ashing ==
== Lithography ==
* Tegal O₂ Plasma Asher
=== E-beam and Laser ===
* Tegal Plasma Cleaner (Not in operation)
* [[Raith EBL]]
* YES O₂ Plasma System
* [[Heidelberg DWL]]


= Lithography =
=== UV Mask Aligners ===
== Direct-Write / Maskless ==
* [[Aligner A (MJB3)]]
* Raith EBPG5150 Electron Beam Lithography
* [[Aligner B (MJB3)]]
* Heidelberg DWL 66+ Direct Write Laser
* [[Aligner C (MJB4)]]
* [[Aligner D (MA BA6 Gen4)]]


== Contact / Proximity Mask Aligners ==
== Metrology and testing ==
* Aligner A – SUSS MJB3 (Advanced Photo Bay)
=== Assorted Metrology ===
* Aligner B – SUSS MJB3 (Photo Bay)
* [[4-point Probe]]
* Aligner C – SUSS MJB4 (Photo Bay)
* [[Dektak profilometer]]
* Aligner D – SUSS MA/BA6 Gen4 (Advanced Photo Bay)
* [[Ellipsometer]]
* [[Filmetrics F20]]


= Metrology =
=== Microscopes ===
== Thin-Film & Electrical ==
* [[Desktop SEM]]
* 4-Point Probe
* [[Nikon LV 150 optical microscope]]
* DektakXT Profilometer
* [[Max ERB optical microscope]]
* Ellipsometer
* [[Zeiss optical microscope]]
* Filmetrics F20 Thin-Film Analyzer
* [[Nikon SMZ-10A optical microscope]]
* [[Nikon optical microscope]]


== Microscopy ==
=== Electrical Characterization ===
* Phenom ProX Desktop SEM
* [[Electroglas 4080X]] – Automated wafer prober
* Nikon LV150 Optical Microscope
* [[Keithley S530 Parametric Test System]] – Parametric analyzer
* Max ERB Optical Microscope
* Zeiss Optical Microscope
* Nikon SMZ-10A Stereo Microscope
* Nikon Optical Microscope (unspecified model)


= Packaging & Mechanical Tooling =
== Packaging & Mechanical Tooling ==
* F&S Bondtec Ball & Wedge Wire Bonder
=== Wafer and Die Processing ===
* DISCO DAD3350 Dicing Saw
* [[Ball & Wedge bonder]]
* EQ Unipol-300 Mini Polisher / Grinder
* [[Dicing Saw]]
* LatticeAx 420 Cleaving System
* [[Mini Polisher]]
* LatticeGear FlipScribe Wafer Cleaver
* [[LatticeAx Cleaver]]
* Gramatech Vacuum Bag Sealer
* [[FlipScribe Cleaver]]
* [[Vacuum Bag Sealer]]


= PCB Processing =
== PCB Processing ==
* LPKF ProtoMat S103 PCB Mill
* [[LPKF PCB mill]]
* LPKF Contac S4 Electroplater
* [[LPKF electroplater]]


= Wet Process =
== Wet Process ==
== Solvent Fume Hood (Metrology Bay) ==
=== Fume Hoods & Stations ===
* Heated Ultrasonic Bath
* Solvent Fume Hood (Metrology bay)
* Torrey Pines Hot Plate
** [[Heated ultrasonic bath]] (Solvent hood)
* Solvent Drains
** [[Torrey Pines hot plate]] (Solvent hood)
* N₂ Blow Guns
** Solvent drains
 
** N2 sprayers
== Acid Fume Hood – Left Side (Etch Bay) ==
* Acid Fume Hood – Left (Etch bay) – Piranha & Nanostrip allowed
* Imtec Heated Bath
** [[Imtec Accubath]] (Acid left)
* Quick-Dump-Rinse (QDR) Tank
** Quick-dump-rinse tank (QDR)
* DI Water Tap
** DI water tap
* N₂ Gun
** N2 gun
 
* Acid Fume Hood – Right (Etch bay) – No Piranha/Nanostrip
== Acid Fume Hood – Right Side (Etch Bay) ==
** [[Imtec Accubath]] (Acid right)
* Imtec Heated Bath
** [[Torrey Pines hot plate]] (Acid right – left & right units)
* Torrey Pines Hot Plate (Left)
** Quick-dump-rinse tank (QDR)
* Torrey Pines Hot Plate (Right)
** DI water tap
* Quick-Dump-Rinse (QDR) Tank
** N2 sprayer
* DI Water Tap
* Resist Fume Hood (Advanced Photo bay)
* N₂ Sprayer
** [[Laurell Spinner]] (left & right)
 
** [[Apogee Bake Plate]] (1–4)
== Resist Coating / Baking Fume Hood (Advanced Photo Bay) ==
* Base & Developer Fume Hood – Left (Advanced Photo bay)
* Laurell Spinner – Left
** [[Imtec Accubath]] (Developer left)
* Laurell Spinner – Right
** [[Torrey Pines hot plate]] (Developer left)
* Apogee Bake Plate 1
** Quick-dump-rinse tank (QDR)
* Apogee Bake Plate 2
** DI water tap
* Apogee Bake Plate 3
** N2 sprayer
* Apogee Bake Plate 4
* Base & Developer Fume Hood – Right (Advanced Photo bay)
 
** [[Imtec Accubath]] (Developer right)
== Developer / Base Fume Hood – Left Side (Advanced Photo Bay) ==
** [[Torrey Pines hot plate]] (Developer right)
* Imtec Heated Bath
** Quick-dump-rinse tank (QDR)
* Torrey Pines Hot Plate
** DI water tap
* Quick-Dump-Rinse (QDR) Tank
** N2 sprayer
* DI Water Tap
* E-beam Resist Fume Hood (Photo bay)
* N₂ Sprayer
** [[Headway Spinner]] (left & right)
 
** [[Apogee Hot Plate]] (left & right – ebeam)
== Developer / Base Fume Hood – Right Side (Advanced Photo Bay) ==
** Ultrasonic heated bath
* Imtec Heated Bath
** [[Torrey Pines hot plate / stirrer]] (ebeam hood)
* Torrey Pines Hot Plate
* Quick-Dump-Rinse (QDR) Tank
* DI Water Tap
* N₂ Sprayer
 
== E-Beam Resist Fume Hood (Photo Bay) ==
* Headway Spinner – Left
* Headway Spinner – Right
* Apogee Hot Plate – Left
* Apogee Hot Plate – Right
* Ultrasonic Heated Bath
* Torrey Pines Hot Plate / Stirrer
 
== Decommissioned Tools ==
(None currently listed)
 
This matches the clean, one-tool-per-line style from the UCSB example you showed, with the categories box now compact and each category listed individually on its own line inside the table cell. The rest of the page keeps the grouped structure for better organization.

Latest revision as of 13:33, 17 February 2026

Tool Categories

Anneal & Furnace

Deposition

CVD (Chemical Vapor Deposition)

PVD (Physical Vapor Deposition)

Dry Etching & Plasma Cleaning

Etchers

Plasma Cleaning / Ashing

Lithography

E-beam and Laser

UV Mask Aligners

Metrology and testing

Assorted Metrology

Microscopes

Electrical Characterization

Packaging & Mechanical Tooling

Wafer and Die Processing

PCB Processing

Wet Process

Fume Hoods & Stations

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