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__NOTOC__
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{| class="wikitable" style="width:min-content;"
{| class="wikitable" style="width:max-content;"
|
|
=== Tool Categories ===
=== Tool Categories ===
* Lithography
* [[#Anneal & Furnace|Anneal & Furnace]]
* Deposition
* [[#Deposition|Deposition]]
* Dry Etch
* [[#Dry Etching & Plasma Cleaning|Dry Etching & Plasma Cleaning]]
* Wet Process
* [[#Lithography|Lithography]]
* Thermal Process
* [[#Metrology and testing|Metrology and testing]]
* Packaging/Bonding
* [[#Packaging & Mechanical Tooling|Packaging & Mechanical Tooling]]
* Metrology/Test
* [[#PCB Processing|PCB Processing]]
* [[#Wet Process|Wet Process]]
|}
|}
== Anneal & Furnace ==
* [[RTA (Rapid Thermal Annealer)]]
* [[Cascade Tek vacuum oven]]
* [[Blue M furnace big]]
* [[Blue M furnace little]]
* [[Narco vacuum oven]]


= Lithography =
== Deposition ==
== Direct-Write / Maskless ==
=== CVD (Chemical Vapor Deposition) ===
* Raith EBPG5150 Electron Beam Lithography
* [[Oxford PECVD]]
* Heidelberg DWL 66+ Direct Write Laser
* [[Veeco ALD]]


== Contact / Proximity Mask Aligners ==
=== PVD (Physical Vapor Deposition) ===
* Aligner A – SUSS MJB3 (Advanced Photo Bay)
* [[Angstrom Evaporator]]
* Aligner B – SUSS MJB3 (Photo Bay)
* [[CHA Evaporator]]
* Aligner C – SUSS MJB4 (Photo Bay)
* [[KJL Evaporator]]
* Aligner D – SUSS MA/BA6 Gen4 (Advanced Photo Bay)
* [[Temescal Metal e-beam evaporator]] (Not in service)
* [[KJL Sputter]]


= Deposition =
== Dry Etching & Plasma Cleaning ==
== Chemical Vapor Deposition (CVD) ==
=== Etchers ===
* Oxford PECVD
* [[Oxford DRIE]]
* Veeco ALD
* [[Oxford DRIE-ALE]] (being commissioned)
* [[Oxford III-V]]
* [[Oxford RIE]]
* [[XeF2 etcher]]


== Physical Vapor Deposition (PVD) ==
=== Plasma Cleaning / Ashing ===
* Angstrom E-Beam Evaporator
* [[Tegal O2 Plasma Asher]]
* CHA E-Beam Evaporator
* [[Tegal Plasma]] (not in operation)
* KJL E-Beam Evaporator
* [[YES O2 Plasma]]
* Temescal E-Beam Evaporator (Not in service)
* KJL Sputter System


= Dry Etch =
== Lithography ==
== Reactive Ion / Deep Reactive Ion Etchers ==
=== E-beam and Laser ===
* Oxford DRIE (Deep Si Etcher)
* [[Raith EBL]]
* Oxford DRIE-ALE (Atomic Layer Etcher – commissioning)
* [[Heidelberg DWL]]
* Oxford III-V Etcher (PlasmaPro 100 Cobra)
* Oxford RIE (PlasmaPro 80 – Dielectrics)
* XeF₂ Etcher


== Plasma Cleaning / Ashing ==
=== UV Mask Aligners ===
* Tegal O₂ Plasma Asher
* [[Aligner A (MJB3)]]
* Tegal Plasma Cleaner (Not in operation)
* [[Aligner B (MJB3)]]
* YES O₂ Plasma System
* [[Aligner C (MJB4)]]
* [[Aligner D (MA BA6 Gen4)]]


= Wet Process =
== Metrology and testing ==
== Solvent Fume Hood (Metrology Bay) ==
=== Assorted Metrology ===
* Heated Ultrasonic Bath
* [[4-point Probe]]
* Torrey Pines Hot Plate
* [[Dektak profilometer]]
* Solvent Drains
* [[Ellipsometer]]
* N₂ Blow Guns
* [[Filmetrics F20]]


== Acid Fume Hood – Left Side (Etch Bay) ==
=== Microscopes ===
* Imtec Heated Bath
* [[Desktop SEM]]
* Quick-Dump-Rinse (QDR) Tank
* [[Nikon LV 150 optical microscope]]
* DI Water Tap
* [[Max ERB optical microscope]]
* N₂ Gun
* [[Zeiss optical microscope]]
* [[Nikon SMZ-10A optical microscope]]
* [[Nikon optical microscope]]


== Acid Fume Hood – Right Side (Etch Bay) ==
=== Electrical Characterization ===
* Imtec Heated Bath
* [[Electroglas 4080X]] – Automated wafer prober
* Torrey Pines Hot Plate (Left)
* [[Keithley S530 Parametric Test System]] – Parametric analyzer
* Torrey Pines Hot Plate (Right)
* Quick-Dump-Rinse (QDR) Tank
* DI Water Tap
* N₂ Sprayer


== Resist Coating / Baking Fume Hood (Advanced Photo Bay) ==
== Packaging & Mechanical Tooling ==
* Laurell Spinner – Left
=== Wafer and Die Processing ===
* Laurell Spinner – Right
* [[Ball & Wedge bonder]]
* Apogee Bake Plate 1
* [[Dicing Saw]]
* Apogee Bake Plate 2
* [[Mini Polisher]]
* Apogee Bake Plate 3
* [[LatticeAx Cleaver]]
* Apogee Bake Plate 4
* [[FlipScribe Cleaver]]
* [[Vacuum Bag Sealer]]


== Developer / Base Fume Hood – Left Side (Advanced Photo Bay) ==
== PCB Processing ==
* Imtec Heated Bath
* [[LPKF PCB mill]]
* Torrey Pines Hot Plate
* [[LPKF electroplater]]
* Quick-Dump-Rinse (QDR) Tank
* DI Water Tap
* N₂ Sprayer


== Developer / Base Fume Hood – Right Side (Advanced Photo Bay) ==
== Wet Process ==
* Imtec Heated Bath
=== Fume Hoods & Stations ===
* Torrey Pines Hot Plate
* Solvent Fume Hood (Metrology bay)
* Quick-Dump-Rinse (QDR) Tank
** [[Heated ultrasonic bath]] (Solvent hood)
* DI Water Tap
** [[Torrey Pines hot plate]] (Solvent hood)
* N₂ Sprayer
** Solvent drains
 
** N2 sprayers
== E-Beam Resist Fume Hood (Photo Bay) ==
* Acid Fume Hood – Left (Etch bay) – Piranha & Nanostrip allowed
* Headway Spinner – Left
** [[Imtec Accubath]] (Acid left)
* Headway Spinner – Right
** Quick-dump-rinse tank (QDR)
* Apogee Hot Plate – Left
** DI water tap
* Apogee Hot Plate – Right
** N2 gun
* Ultrasonic Heated Bath
* Acid Fume Hood – Right (Etch bay) – No Piranha/Nanostrip
* Torrey Pines Hot Plate / Stirrer
** [[Imtec Accubath]] (Acid right)
 
** [[Torrey Pines hot plate]] (Acid right – left & right units)
= Thermal Process =
** Quick-dump-rinse tank (QDR)
* Rapid Thermal Annealer (RTA)
** DI water tap
* Cascade Tek Vacuum Oven
** N2 sprayer
* Blue M Furnace (Large)
* Resist Fume Hood (Advanced Photo bay)
* Blue M Furnace (Small)
** [[Laurell Spinner]] (left & right)
* Narco Vacuum Oven
** [[Apogee Bake Plate]] (1–4)
 
* Base & Developer Fume Hood – Left (Advanced Photo bay)
= Packaging/Bonding =
** [[Imtec Accubath]] (Developer left)
* F&S Bondtec Ball & Wedge Wire Bonder
** [[Torrey Pines hot plate]] (Developer left)
* DISCO DAD3350 Dicing Saw
** Quick-dump-rinse tank (QDR)
* EQ Unipol-300 Mini Polisher / Grinder
** DI water tap
* LatticeAx 420 Cleaving System
** N2 sprayer
* LatticeGear FlipScribe Wafer Cleaver
* Base & Developer Fume Hood – Right (Advanced Photo bay)
* Gramatech Vacuum Bag Sealer
** [[Imtec Accubath]] (Developer right)
 
** [[Torrey Pines hot plate]] (Developer right)
= Metrology/Test =
** Quick-dump-rinse tank (QDR)
== Thin-Film & Electrical ==
** DI water tap
* 4-Point Probe
** N2 sprayer
* DektakXT Profilometer
* E-beam Resist Fume Hood (Photo bay)
* Ellipsometer
** [[Headway Spinner]] (left & right)
* Filmetrics F20 Thin-Film Analyzer
** [[Apogee Hot Plate]] (left & right – ebeam)
 
** Ultrasonic heated bath
== Microscopy ==
** [[Torrey Pines hot plate / stirrer]] (ebeam hood)
* Phenom ProX Desktop SEM
* Nikon LV150 Optical Microscope
* Max ERB Optical Microscope
* Zeiss Optical Microscope
* Nikon SMZ-10A Stereo Microscope
* Nikon Optical Microscope (unspecified model)
 
== PCB Processing (Additional Fabrication Support) ==
* LPKF ProtoMat S103 PCB Mill
* LPKF Contac S4 Electroplater
 
== Decommissioned Tools ==
(None currently listed)
 
This version uses the exact category names and structure from the UCSB example you provided (Lithography, Deposition, Dry Etch, Wet Process, Thermal Process, Packaging/Bonding, Metrology/Test), while mapping all USC tools into those categories. The tools are listed cleanly with one tool per line under each main category heading.

Latest revision as of 13:33, 17 February 2026

Tool Categories

Anneal & Furnace

Deposition

CVD (Chemical Vapor Deposition)

PVD (Physical Vapor Deposition)

Dry Etching & Plasma Cleaning

Etchers

Plasma Cleaning / Ashing

Lithography

E-beam and Laser

UV Mask Aligners

Metrology and testing

Assorted Metrology

Microscopes

Electrical Characterization

Packaging & Mechanical Tooling

Wafer and Die Processing

PCB Processing

Wet Process

Fume Hoods & Stations

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