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{| class="wikitable" style="width:max-content;"
{| class="wikitable" style="width:min-content;"
|
|
=== Tool Categories ===
=== Tool Categories ===
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* [[#Dry Etching & Plasma Cleaning|Dry Etching & Plasma Cleaning]]
* [[#Dry Etching & Plasma Cleaning|Dry Etching & Plasma Cleaning]]
* [[#Lithography|Lithography]]
* [[#Lithography|Lithography]]
* [[#Metrology|Metrology]]
* [[#Metrology and testing|Metrology and testing]]
* [[#Packaging & Mechanical Tooling|Packaging & Mechanical Tooling]]
* [[#Packaging & Mechanical Tooling|Packaging & Mechanical Tooling]]
* [[#PCB Processing|PCB Processing]]
* [[#PCB Processing|PCB Processing]]
* [[#Wet Process|Wet Process]]
* [[#Wet Process|Wet Process]]
|}
|}
== Anneal & Furnace ==
* [[RTA (Rapid Thermal Annealer)]]
* [[Cascade Tek vacuum oven]]
* [[Blue M furnace big]]
* [[Blue M furnace little]]
* [[Narco vacuum oven]]


= Anneal & Furnace =
== Deposition ==
* [[#RTA|RTA (Rapid Thermal Annealer)]]
=== CVD (Chemical Vapor Deposition) ===
* [[#Cascade Tek vacuum oven|Cascade Tek vacuum oven]]
* [[Oxford PECVD]]
* [[#Blue M furnace big|Blue M furnace big]]
* [[Veeco ALD]]
* [[#Blue M furnace little|Blue M furnace little]]
* [[#Narco vacuum oven|Narco vacuum oven]]
 
= Deposition =
 
== CVD ==
* [[#Oxford PECVD|Oxford PECVD]]
* [[#Veeco ALD|Veeco ALD]]
 
== PVD ==
* [[#Angstrom Evaporator|Angstrom Evaporator]]
* [[#CHA Evaporator|CHA Evaporator]]
* [[#KJL Evaporator|KJL Evaporator]]
* [[#Temescal Metal e-beam evaporator|Temescal Metal e-beam evaporator]] (not in service)
* [[#KJL Sputter|KJL Sputter]]
 
= Dry Etching & Plasma Cleaning =
 
== Etchers ==
* [[#Oxford DRIE|Oxford DRIE]]
* [[#Oxford DRIE-ALE|Oxford DRIE-ALE]] (commissioning in progress)
* [[#Oxford III-V|Oxford III-V]]
* [[#Oxford RIE|Oxford RIE]]
* [[#XeF2 etcher|XeF2 etcher]]
 
== Plasma cleaning / ashing ==
* [[#Tegal O2 Plasma Asher|Tegal O2 Plasma Asher]]
* [[#Tegal Plasma|Tegal Plasma]] (not in operation)
* [[#YES O2 Plasma|YES O2 Plasma]]
 
= Lithography =
 
== E-beam and laser ==
* [[#Raith EBL|Raith EBL]]
* [[#Heidelberg DWL|Heidelberg DWL]]
 
== UV mask aligners ==
* [[#Aligner A (MJB3)|Aligner A (MJB3)]]
* [[#Aligner B (MJB3)|Aligner B (MJB3)]]
* [[#Aligner C (MJB4)|Aligner C (MJB4)]]
* [[#Aligner D (MA BA6 Gen4)|Aligner D (MA BA6 Gen4)]]
 
= Metrology =
 
== Assorted metrology ==
* [[#4-point Probe|4-point Probe]]
* [[#Dektak profilometer|Dektak profilometer]]
* [[#Ellipsometer|Ellipsometer]]
* [[#Filmetrics F20|Filmetrics F20]]


== Microscopes ==
=== PVD (Physical Vapor Deposition) ===
* [[#Desktop SEM|Desktop SEM]]
* [[Angstrom Evaporator]]
* [[#Nikon LV 150 optical microscope|Nikon LV 150 optical microscope]]
* [[CHA Evaporator]]
* [[#Max ERB optical microscope|Max ERB optical microscope]]
* [[KJL Evaporator]]
* [[#Zeiss optical microscope|Zeiss optical microscope]]
* [[Temescal Metal e-beam evaporator]] (Not in service)
* [[#Nikon SMZ-10A optical microscope|Nikon SMZ-10A optical microscope]]
* [[KJL Sputter]]
* [[#Nikon optical microscope|Nikon optical microscope]]


= Packaging & Mechanical Tooling =
== Dry Etching & Plasma Cleaning ==
=== Etchers ===
* [[Oxford DRIE]]
* [[Oxford DRIE-ALE]] (being commissioned)
* [[Oxford III-V]]
* [[Oxford RIE]]
* [[XeF2 etcher]]


== Wafer and die processing ==
=== Plasma Cleaning / Ashing ===
* [[#Ball & Wedge bonder|Ball & Wedge bonder]]
* [[Tegal O2 Plasma Asher]]
* [[#Dicing Saw|Dicing Saw]]
* [[Tegal Plasma]] (not in operation)
* [[#Mini Polisher|Mini Polisher]]
* [[YES O2 Plasma]]
* [[#LatticeAx Cleaver|LatticeAx Cleaver]]
* [[#FlipScribe Cleaver|FlipScribe Cleaver]]
* [[#Vacuum Bag Sealer|Vacuum Bag Sealer]]


= PCB Processing =
== Lithography ==
* [[#LPKF PCB mill|LPKF PCB mill]]
=== E-beam and Laser ===
* [[#LPKF electroplater|LPKF electroplater]]
* [[Raith EBL]]
* [[Heidelberg DWL]]


= Wet Process =
=== UV Mask Aligners ===
* [[Aligner A (MJB3)]]
* [[Aligner B (MJB3)]]
* [[Aligner C (MJB4)]]
* [[Aligner D (MA BA6 Gen4)]]


== Solvent fume hood (Metrology bay) ==
== Metrology and testing ==
* Heated ultrasonic bath
=== Assorted Metrology ===
* Torrey Pines hot plate / stirrer
* [[4-point Probe]]
* Solvent drains
* [[Dektak profilometer]]
* N2 sprayers
* [[Ellipsometer]]
* [[Filmetrics F20]]


== Acid fume hood left (Etch bay) ==
=== Microscopes ===
* Heated bath (Imtec Accubath)
* [[Desktop SEM]]
* Quick-dump-rinse tank (QDR)
* [[Nikon LV 150 optical microscope]]
* DI water tap
* [[Max ERB optical microscope]]
* N2 gun
* [[Zeiss optical microscope]]
* [[Nikon SMZ-10A optical microscope]]
* [[Nikon optical microscope]]


== Acid fume hood right (Etch bay) ==
=== Electrical Characterization ===
* Heated bath (Imtec Accubath)
* [[Electroglas 4080X]] – Automated wafer prober
* Torrey Pines hot plate left
* [[Keithley S530 Parametric Test System]] – Parametric analyzer
* Torrey Pines hot plate right
* Quick-dump-rinse tank (QDR)
* DI water tap
* N2 sprayer


== Resist fume hood (Advanced Photo bay) ==
== Packaging & Mechanical Tooling ==
* Spinner left (Laurell)
=== Wafer and Die Processing ===
* Spinner right (Laurell)
* [[Ball & Wedge bonder]]
* Bake plate 1 (Apogee)
* [[Dicing Saw]]
* Bake plate 2 (Apogee)
* [[Mini Polisher]]
* Bake plate 3 (Apogee)
* [[LatticeAx Cleaver]]
* Bake plate 4 (Apogee)
* [[FlipScribe Cleaver]]
* [[Vacuum Bag Sealer]]


== Base and developer fume hoods (Advanced Photo bay) ==
== PCB Processing ==
* Heated bath (Imtec Accubath)
* [[LPKF PCB mill]]
* Torrey Pines hot plate
* [[LPKF electroplater]]
* Quick-dump-rinse tank (QDR)
* DI water tap
* N2 sprayer


== E-beam resist fume hood (Photo bay) ==
== Wet Process ==
* Headway spinner left
=== Fume Hoods & Stations ===
* Headway spinner right
* Solvent Fume Hood (Metrology bay)
* Apogee hot plate left
** [[Heated ultrasonic bath]] (Solvent hood)
* Apogee hot plate right
** [[Torrey Pines hot plate]] (Solvent hood)
* Ultrasonic heated bath
** Solvent drains
* Torrey Pines hot plate / stirrer
** N2 sprayers
* Acid Fume Hood – Left (Etch bay) – Piranha & Nanostrip allowed
** [[Imtec Accubath]] (Acid left)
** Quick-dump-rinse tank (QDR)
** DI water tap
** N2 gun
* Acid Fume Hood – Right (Etch bay) – No Piranha/Nanostrip
** [[Imtec Accubath]] (Acid right)
** [[Torrey Pines hot plate]] (Acid right – left & right units)
** Quick-dump-rinse tank (QDR)
** DI water tap
** N2 sprayer
* Resist Fume Hood (Advanced Photo bay)
** [[Laurell Spinner]] (left & right)
** [[Apogee Bake Plate]] (1–4)
* Base & Developer Fume Hood – Left (Advanced Photo bay)
** [[Imtec Accubath]] (Developer left)
** [[Torrey Pines hot plate]] (Developer left)
** Quick-dump-rinse tank (QDR)
** DI water tap
** N2 sprayer
* Base & Developer Fume Hood – Right (Advanced Photo bay)
** [[Imtec Accubath]] (Developer right)
** [[Torrey Pines hot plate]] (Developer right)
** Quick-dump-rinse tank (QDR)
** DI water tap
** N2 sprayer
* E-beam Resist Fume Hood (Photo bay)
** [[Headway Spinner]] (left & right)
** [[Apogee Hot Plate]] (left & right – ebeam)
** Ultrasonic heated bath
** [[Torrey Pines hot plate / stirrer]] (ebeam hood)

Latest revision as of 13:33, 17 February 2026

Tool Categories

Anneal & Furnace

Deposition

CVD (Chemical Vapor Deposition)

PVD (Physical Vapor Deposition)

Dry Etching & Plasma Cleaning

Etchers

Plasma Cleaning / Ashing

Lithography

E-beam and Laser

UV Mask Aligners

Metrology and testing

Assorted Metrology

Microscopes

Electrical Characterization

Packaging & Mechanical Tooling

Wafer and Die Processing

PCB Processing

Wet Process

Fume Hoods & Stations

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