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About
__NOTOC__
__TOC__[[File:Blue M oven big.jpg|thumb|300px|Blue M OV-12A Large Drying Oven in Advanced Photo Bay]]
{| class="wikitable" style="width:max-content;"
|
=== Tool Categories ===
* [[#Anneal & Furnace|Anneal & Furnace]]
* [[#Deposition|Deposition]]
* [[#Dry Etching & Plasma Cleaning|Dry Etching & Plasma Cleaning]]
* [[#Lithography|Lithography]]
* [[#Metrology and testing|Metrology and testing]]
* [[#Packaging & Mechanical Tooling|Packaging & Mechanical Tooling]]
* [[#PCB Processing|PCB Processing]]
* [[#Wet Process|Wet Process]]
|}
== Anneal & Furnace ==
* [[RTA (Rapid Thermal Annealer)]]
* [[Cascade Tek vacuum oven]]
* [[Blue M furnace big]]
* [[Blue M furnace little]]
* [[Narco vacuum oven]]


'''Process:''' This is a large-capacity forced-air convection drying oven designed for reliable, uniform heating at moderate temperatures. It is commonly used for baking photoresists, curing polymers, drying samples after wet processing, outgassing, or low-temperature annealing in a clean, controlled air environment.
== Deposition ==
=== CVD (Chemical Vapor Deposition) ===
* [[Oxford PECVD]]
* [[Veeco ALD]]


'''Hardware:''' Forced-air circulation with adjustable fan speed for excellent temperature uniformity. Stainless steel interior for cleanroom compatibility and easy cleaning. Digital temperature controller with over-temperature protection. Shelving system for multiple samples or larger substrates. Door with observation window and gasket seal.
=== PVD (Physical Vapor Deposition) ===
* [[Angstrom Evaporator]]
* [[CHA Evaporator]]
* [[KJL Evaporator]]
* [[Temescal Metal e-beam evaporator]] (Not in service)
* [[KJL Sputter]]


'''Atmosphere:'''
== Dry Etching & Plasma Cleaning ==
* Ambient air (forced convection)
=== Etchers ===
* No vacuum or special gases (for inert or forming gas anneals, use RTA or other tools)
* [[Oxford DRIE]]
* Optional N₂ purge if modified (not standard – confirm if equipped)
* [[Oxford DRIE-ALE]] (being commissioned)
* [[Oxford III-V]]
* [[Oxford RIE]]
* [[XeF2 etcher]]


'''Applications:'''
=== Plasma Cleaning / Ashing ===
* Post-bake and hard bake of photoresists (e.g., 90–180°C)
* [[Tegal O2 Plasma Asher]]
* Curing of spin-on dielectrics, polyimides, or adhesives
* [[Tegal Plasma]] (not in operation)
* Drying wafers/substrates after rinse or solvent clean
* [[YES O2 Plasma]]
* Low-temperature outgassing or degassing
* Gentle thermal treatment of delicate samples
* Aging or stability testing of materials


'''Usage:''' Load samples on shelves, set temperature and time via controller, allow stabilization, run process. Use timer or manual monitoring. Cool down before opening door to avoid thermal shock or contamination. Follow SOP for loading/unloading and cleaning.
== Lithography ==
=== E-beam and Laser ===
* [[Raith EBL]]
* [[Heidelberg DWL]]


== Detailed Specifications ==
=== UV Mask Aligners ===
* Model: Blue M OV-12A
* [[Aligner A (MJB3)]]
* Location: Advanced Photo bay
* [[Aligner B (MJB3)]]
* Substrate size: Flexible (wafers up to 8–12", cassettes, trays, or multiple pieces – check interior dimensions)
* [[Aligner C (MJB4)]]
* Temperature range: Ambient to 260°C
* [[Aligner D (MA BA6 Gen4)]]
* Temperature control: Digital PID controller with uniformity typically ±2–5°C across chamber (depending on load)
* Heating: Electric elements with forced-air circulation
* Features: Over-temperature safety cutoff, adjustable shelves, observation window, cleanroom-compatible design
* Restrictions: Max 260°C (not for high-temperature processes); avoid volatile/corrosive chemicals that could damage interior or contaminate other users
* Other: Large interior volume suitable for batch processing or bigger substrates


== Documentation ==
== Metrology and testing ==
* [[:File:Blue M OV-12A Drying Oven SOP v1.pdf|SOP – Standard Operating Procedure]]
=== Assorted Metrology ===
* Training required – contact lab staff (Chandan Ramakrishnaiah or Shivakumar Bhaskaran)
* [[4-point Probe]]
* [[Dektak profilometer]]
* [[Ellipsometer]]
* [[Filmetrics F20]]


== Recipes & Data ==
=== Microscopes ===
* Standard Processes: Common bakes include:
* [[Desktop SEM]]
  * Photoresist soft bake: 90–110°C
* [[Nikon LV 150 optical microscope]]
  * Post-exposure bake (PEB): 100–130°C
* [[Max ERB optical microscope]]
  * Hard bake: 120–180°C
* [[Zeiss optical microscope]]
  * Curing of SU-8 or polyimide: 150–250°C
* [[Nikon SMZ-10A optical microscope]]
* Process Control: Verify temperature uniformity with thermocouple checks if needed. Monitor for contamination (e.g., particles) after use.
* [[Nikon optical microscope]]
* Notes: Allow pre-heat stabilization time (30–60 min) for best uniformity. Use foil or trays to protect shelves from spills.


<!-- Optional: Add more images here if you have interior views, shelving, control panel, or example sample setups. -->
=== Electrical Characterization ===
* [[Electroglas 4080X]] – Automated wafer prober
* [[Keithley S530 Parametric Test System]] – Parametric analyzer
 
== Packaging & Mechanical Tooling ==
=== Wafer and Die Processing ===
* [[Ball & Wedge bonder]]
* [[Dicing Saw]]
* [[Mini Polisher]]
* [[LatticeAx Cleaver]]
* [[FlipScribe Cleaver]]
* [[Vacuum Bag Sealer]]
 
== PCB Processing ==
* [[LPKF PCB mill]]
* [[LPKF electroplater]]
 
== Wet Process ==
=== Fume Hoods & Stations ===
* Solvent Fume Hood (Metrology bay)
** [[Heated ultrasonic bath]] (Solvent hood)
** [[Torrey Pines hot plate]] (Solvent hood)
** Solvent drains
** N2 sprayers
* Acid Fume Hood – Left (Etch bay) – Piranha & Nanostrip allowed
** [[Imtec Accubath]] (Acid left)
** Quick-dump-rinse tank (QDR)
** DI water tap
** N2 gun
* Acid Fume Hood – Right (Etch bay) – No Piranha/Nanostrip
** [[Imtec Accubath]] (Acid right)
** [[Torrey Pines hot plate]] (Acid right – left & right units)
** Quick-dump-rinse tank (QDR)
** DI water tap
** N2 sprayer
* Resist Fume Hood (Advanced Photo bay)
** [[Laurell Spinner]] (left & right)
** [[Apogee Bake Plate]] (1–4)
* Base & Developer Fume Hood – Left (Advanced Photo bay)
** [[Imtec Accubath]] (Developer left)
** [[Torrey Pines hot plate]] (Developer left)
** Quick-dump-rinse tank (QDR)
** DI water tap
** N2 sprayer
* Base & Developer Fume Hood – Right (Advanced Photo bay)
** [[Imtec Accubath]] (Developer right)
** [[Torrey Pines hot plate]] (Developer right)
** Quick-dump-rinse tank (QDR)
** DI water tap
** N2 sprayer
* E-beam Resist Fume Hood (Photo bay)
** [[Headway Spinner]] (left & right)
** [[Apogee Hot Plate]] (left & right – ebeam)
** Ultrasonic heated bath
** [[Torrey Pines hot plate / stirrer]] (ebeam hood)

Latest revision as of 13:33, 17 February 2026

Tool Categories

Anneal & Furnace

Deposition

CVD (Chemical Vapor Deposition)

PVD (Physical Vapor Deposition)

Dry Etching & Plasma Cleaning

Etchers

Plasma Cleaning / Ashing

Lithography

E-beam and Laser

UV Mask Aligners

Metrology and testing

Assorted Metrology

Microscopes

Electrical Characterization

Packaging & Mechanical Tooling

Wafer and Die Processing

PCB Processing

Wet Process

Fume Hoods & Stations

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