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{{tool2|{{PAGENAME}}
__NOTOC__
|picture=Blue M oven big.jpg
{| class="wikitable" style="width:max-content;"
|type = Thermal Processing
|
|super = Chandan Ramakrishnaiah
=== Tool Categories ===
|super2 = Shivakumar Bhaskaran
* [[#Anneal & Furnace|Anneal & Furnace]]
|phone = (213) 551 6726
* [[#Deposition|Deposition]]
|location = Advanced Photo bay
* [[#Dry Etching & Plasma Cleaning|Dry Etching & Plasma Cleaning]]
|email =  <!-- Add USC email if needed, e.g. chandan@usc.edu or leave blank -->
* [[#Lithography|Lithography]]
|description = Blue M OV-12A Large Drying Oven for baking, curing, and low-temperature annealing up to 260°C
* [[#Metrology and testing|Metrology and testing]]
|manufacturer = Blue M (now part of Thermal Product Solutions)
* [[#Packaging & Mechanical Tooling|Packaging & Mechanical Tooling]]
|materials = Substrates, photoresist, polymers, glass, metals (check restrictions per process)
* [[#PCB Processing|PCB Processing]]
|toolid =  <!-- Add your internal tool ID if you have one, or leave blank -->
* [[#Wet Process|Wet Process]]
}}
|}
__TOC__
== Anneal & Furnace ==
* [[RTA (Rapid Thermal Annealer)]]
* [[Cascade Tek vacuum oven]]
* [[Blue M furnace big]]
* [[Blue M furnace little]]
* [[Narco vacuum oven]]


== About ==
== Deposition ==
[[File:Blue M oven big.jpg|thumb|300px|Blue M OV-12A Large Drying Oven in Advanced Photo Bay]]
=== CVD (Chemical Vapor Deposition) ===
* [[Oxford PECVD]]
* [[Veeco ALD]]


'''Process:''' This is a large-capacity forced-air convection drying oven designed for reliable, uniform heating at moderate temperatures. It is commonly used for baking photoresists, curing polymers, drying samples after wet processing, outgassing, or low-temperature annealing in a clean, controlled air environment.
=== PVD (Physical Vapor Deposition) ===
* [[Angstrom Evaporator]]
* [[CHA Evaporator]]
* [[KJL Evaporator]]
* [[Temescal Metal e-beam evaporator]] (Not in service)
* [[KJL Sputter]]


'''Hardware:''' Forced-air circulation with adjustable fan speed for excellent temperature uniformity. Stainless steel interior for cleanroom compatibility and easy cleaning. Digital temperature controller with over-temperature protection. Shelving system for multiple samples or larger substrates. Door with observation window and gasket seal.
== Dry Etching & Plasma Cleaning ==
=== Etchers ===
* [[Oxford DRIE]]
* [[Oxford DRIE-ALE]] (being commissioned)
* [[Oxford III-V]]
* [[Oxford RIE]]
* [[XeF2 etcher]]


'''Atmosphere:'''
=== Plasma Cleaning / Ashing ===
* Ambient air (forced convection)
* [[Tegal O2 Plasma Asher]]
* No vacuum or special gases (for inert or forming gas anneals, use RTA or other tools)
* [[Tegal Plasma]] (not in operation)
* Optional N₂ purge if modified (not standard – confirm if equipped)
* [[YES O2 Plasma]]


'''Applications:'''
== Lithography ==
* Post-bake and hard bake of photoresists (e.g., 90–180°C)
=== E-beam and Laser ===
* Curing of spin-on dielectrics, polyimides, or adhesives
* [[Raith EBL]]
* Drying wafers/substrates after rinse or solvent clean
* [[Heidelberg DWL]]
* Low-temperature outgassing or degassing
* Gentle thermal treatment of delicate samples
* Aging or stability testing of materials


'''Usage:''' Load samples on shelves, set temperature and time via controller, allow stabilization, run process. Use timer or manual monitoring. Cool down before opening door to avoid thermal shock or contamination. Follow SOP for loading/unloading and cleaning.
=== UV Mask Aligners ===
* [[Aligner A (MJB3)]]
* [[Aligner B (MJB3)]]
* [[Aligner C (MJB4)]]
* [[Aligner D (MA BA6 Gen4)]]


== Detailed Specifications ==
== Metrology and testing ==
* Model: Blue M OV-12A
=== Assorted Metrology ===
* Location: Advanced Photo bay
* [[4-point Probe]]
* Substrate size: Flexible (wafers up to 8–12", cassettes, trays, or multiple pieces – check interior dimensions)
* [[Dektak profilometer]]
* Temperature range: Ambient to 260°C
* [[Ellipsometer]]
* Temperature control: Digital PID controller with uniformity typically ±2–5°C across chamber (depending on load)
* [[Filmetrics F20]]
* Heating: Electric elements with forced-air circulation
* Features: Over-temperature safety cutoff, adjustable shelves, observation window, cleanroom-compatible design
* Restrictions: Max 260°C (not for high-temperature processes); avoid volatile/corrosive chemicals that could damage interior or contaminate other users
* Other: Large interior volume suitable for batch processing or bigger substrates


== Documentation ==
=== Microscopes ===
* [[:File:Blue M OV-12A Drying Oven SOP v1.pdf|SOP – Standard Operating Procedure]]
* [[Desktop SEM]]
* Training required – contact lab staff (Chandan Ramakrishnaiah or Shivakumar Bhaskaran)
* [[Nikon LV 150 optical microscope]]
* [[Max ERB optical microscope]]
* [[Zeiss optical microscope]]
* [[Nikon SMZ-10A optical microscope]]
* [[Nikon optical microscope]]


== Recipes & Data ==
=== Electrical Characterization ===
* Standard Processes: Common bakes include:
* [[Electroglas 4080X]] – Automated wafer prober
  * Photoresist soft bake: 90–110°C
* [[Keithley S530 Parametric Test System]] – Parametric analyzer
  * Post-exposure bake (PEB): 100–130°C
  * Hard bake: 120–180°C
  * Curing of SU-8 or polyimide: 150–250°C
* Process Control: Verify temperature uniformity with thermocouple checks if needed. Monitor for contamination (e.g., particles) after use.
* Notes: Allow pre-heat stabilization time (30–60 min) for best uniformity. Use foil or trays to protect shelves from spills.


<!-- Optional: Add more images here if you have interior views, shelving, control panel, or example sample setups. -->
== Packaging & Mechanical Tooling ==
=== Wafer and Die Processing ===
* [[Ball & Wedge bonder]]
* [[Dicing Saw]]
* [[Mini Polisher]]
* [[LatticeAx Cleaver]]
* [[FlipScribe Cleaver]]
* [[Vacuum Bag Sealer]]
 
== PCB Processing ==
* [[LPKF PCB mill]]
* [[LPKF electroplater]]
 
== Wet Process ==
=== Fume Hoods & Stations ===
* Solvent Fume Hood (Metrology bay)
** [[Heated ultrasonic bath]] (Solvent hood)
** [[Torrey Pines hot plate]] (Solvent hood)
** Solvent drains
** N2 sprayers
* Acid Fume Hood – Left (Etch bay) – Piranha & Nanostrip allowed
** [[Imtec Accubath]] (Acid left)
** Quick-dump-rinse tank (QDR)
** DI water tap
** N2 gun
* Acid Fume Hood – Right (Etch bay) – No Piranha/Nanostrip
** [[Imtec Accubath]] (Acid right)
** [[Torrey Pines hot plate]] (Acid right – left & right units)
** Quick-dump-rinse tank (QDR)
** DI water tap
** N2 sprayer
* Resist Fume Hood (Advanced Photo bay)
** [[Laurell Spinner]] (left & right)
** [[Apogee Bake Plate]] (1–4)
* Base & Developer Fume Hood – Left (Advanced Photo bay)
** [[Imtec Accubath]] (Developer left)
** [[Torrey Pines hot plate]] (Developer left)
** Quick-dump-rinse tank (QDR)
** DI water tap
** N2 sprayer
* Base & Developer Fume Hood – Right (Advanced Photo bay)
** [[Imtec Accubath]] (Developer right)
** [[Torrey Pines hot plate]] (Developer right)
** Quick-dump-rinse tank (QDR)
** DI water tap
** N2 sprayer
* E-beam Resist Fume Hood (Photo bay)
** [[Headway Spinner]] (left & right)
** [[Apogee Hot Plate]] (left & right – ebeam)
** Ultrasonic heated bath
** [[Torrey Pines hot plate / stirrer]] (ebeam hood)

Latest revision as of 13:33, 17 February 2026

Tool Categories

Anneal & Furnace

Deposition

CVD (Chemical Vapor Deposition)

PVD (Physical Vapor Deposition)

Dry Etching & Plasma Cleaning

Etchers

Plasma Cleaning / Ashing

Lithography

E-beam and Laser

UV Mask Aligners

Metrology and testing

Assorted Metrology

Microscopes

Electrical Characterization

Packaging & Mechanical Tooling

Wafer and Die Processing

PCB Processing

Wet Process

Fume Hoods & Stations

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